Circuits and methods for placing programmable impedance memory elements in high impedance states
    2.
    发明授权
    Circuits and methods for placing programmable impedance memory elements in high impedance states 有权
    将可编程阻抗存储器元件置于高阻态中的电路和方法

    公开(公告)号:US09368198B1

    公开(公告)日:2016-06-14

    申请号:US14281830

    申请日:2014-05-19

    IPC分类号: G11C11/00 G11C13/00

    摘要: A memory device can include a plurality of two terminal conductive bridging random access memory (CBRAM) type memory elements; at least one program transistor configured to enable a program current to flow through at least one memory element in response to the application of a program signal at its control terminal and a program bias voltage to the memory element; and an erase load circuit that includes at least one two-terminal diode-like load element, the erase load circuit configured to enable an erase current to flow through the load element and at least one memory element in a direction opposite to that of the program current.

    摘要翻译: 存储器件可以包括多个两端导电桥接随机存取存储器(CBRAM)型存储器元件; 至少一个程序晶体管被配置为响应于在其控制端处应用程序信号而使程序电流流过至少一个存储器元件,并且将程序偏置电压提供给存储器元件; 以及擦除负载电路,其包括至少一个二端二极管状负载元件,所述擦除负载电路被配置为使得擦除电流能够以与所述程序相反的方向流过所述负载元件和至少一个存储元件 当前。