公开(公告)号：US20080078145A1

公开(公告)日：2008-04-03

申请号：US11536051

申请日：2006-09-28

申请人： Ping Liang TU ,  Deming LIU ,  Kui Kam LAM ,  Man Chung Raymond NG

发明人： Ping Liang TU ,  Deming LIU ,  Kui Kam LAM ,  Man Chung Raymond NG

IPC分类号： B65B31/00

CPC分类号： B23K1/008 ,  B23K2101/40

摘要： A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.

摘要翻译： 因此，提供了一种制造工艺和装置，用于在加工期间处理包括可氧化材料的电子装置。 电子设备位于室内并用加热器加热处理温度。 通过在加工温度下处理电子装置的同时供应包含乙醇酸蒸汽的气体，在室中产生还原性气氛。

公开(公告)号：US07462926B2

公开(公告)日：2008-12-09

申请号：US11293711

申请日：2005-12-01

申请人： Ran Fu ,  Deming Liu ,  Yiu Fai Kwan

发明人： Ran Fu ,  Deming Liu ,  Yiu Fai Kwan

IPC分类号： H01L23/495 ,  H01L21/00 ,  B32B15/00

CPC分类号： H01L23/49582 ,  H01L2924/00014 ,  H01L2924/0002 ,  Y10T428/12694 ,  Y10T428/12708 ,  Y10T428/12771 ,  Y10T428/12882 ,  Y10T428/12903 ,  H01L2224/45099 ,  H01L2924/00

摘要： A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.

摘要翻译： 提供一种制造引线框架的方法，该方法包括以下步骤：提供基板，用锡层镀基材，在锡层上镀镍层，然后在该层上镀覆一层或多层保护层 的镍。 引线框架之后可以被加热以产生包含锡的一个或多个金属间层，其阻止铜从引线框架的基底材料向其表面的向外扩散。

公开(公告)号：US20070126096A1

公开(公告)日：2007-06-07

申请号：US11293711

申请日：2005-12-01

申请人： Ran Fu ,  Deming Liu ,  Yiu Kwan

发明人： Ran Fu ,  Deming Liu ,  Yiu Kwan

IPC分类号： H01L23/495

CPC分类号： H01L23/49582 ,  H01L2924/00014 ,  H01L2924/0002 ,  Y10T428/12694 ,  Y10T428/12708 ,  Y10T428/12771 ,  Y10T428/12882 ,  Y10T428/12903 ,  H01L2224/45099 ,  H01L2924/00

摘要： A method of producing a leadframe is provided comprising the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.

摘要翻译： 提供一种制造引线框架的方法，包括以下步骤：提供基板，用锡层镀基板，在锡层上镀镍层，然后在镍层上镀覆一层或多层保护层。 引线框架之后可以被加热以产生包含锡的一个或多个金属间层，其阻止铜从引线框架的基底材料向其表面的向外扩散。

公开(公告)号：US07087202B2

公开(公告)日：2006-08-08

申请号：US10628528

申请日：2003-07-28

申请人： Deming Liu ,  Chou Kee Peter Liu ,  Jian Zhong Fan ,  Jun Xu ,  Tao Zuo ,  Zhao Zu Gao

发明人： Deming Liu ,  Chou Kee Peter Liu ,  Jian Zhong Fan ,  Jun Xu ,  Tao Zuo ,  Zhao Zu Gao

IPC分类号： B22F3/12

CPC分类号： C22F1/047 ,  B22D17/007 ,  B22F2009/041 ,  B22F2998/10 ,  C22C2001/1073 ,  C22F1/04 ,  Y10T428/256 ,  B22F9/04 ,  B22F3/04 ,  C22C1/1036

摘要： This invention concerns particulate reinforced Al-based composites, and the near net shape forming process of their components. The average size of the reinforced particle in the invented composites is 0.1–3.5 μm and the volume percentage is 10–40%, and a good interfacial bonding between the reinforced particulate and the matrix is formed with the reinforced particles uniformly distributed. The production method of its billet is to have the reinforced particles and Al-base alloy powder receive variable-speed high-energy ball-milling in the balling drum. Then, with addition of a liquid surfactant, the ball-mill proceeds to carry on ball-milling. After the ball-milling, the produced composite powder undergoes cold isostatic pressing and the subsequent vacuum sintering or vacuum hot-pressing to be shaped into a hot compressed billet, which in turn undergoes semisolid thixotropic forming and may be shaped into complex-shaped components. These components can be used in various fields. This product is featured with excellent property, good machinability, stable quality, component near net shape forming and cost effective and higher performance.

摘要翻译： 本发明涉及颗粒增强的基于Al的复合材料及其组分的近净形状形成过程。 本发明复合材料中增强颗粒的平均尺寸为0.1-3.5μm，体积百分比为10-40％，增强颗粒与基质之间形成良好的界面结合，增强颗粒均匀分布。 钢坯的生产方法是将球磨机中的增强颗粒和Al基合金粉末接受可变速高能球磨。 然后，加入液体表面活性剂，使球磨机进行球磨。 在球磨后，所生产的复合粉末进行冷等静压，随后进行真空烧结或真空热压成型为热压缩坯料，其又进行半固体触变形成并且可以成形为复杂形状的组分。 这些组件可用于各种领域。 本产品具有优良的性能，良好的机械加工性，质量稳定性，近净成型成分，成本效益高，性能更高。

公开(公告)号：US06991967B2

公开(公告)日：2006-01-31

申请号：US10785293

申请日：2004-02-23

申请人： Deming Liu ,  Ran Fu ,  Kui Kam Lam ,  Man Chung Raymond Ng ,  Wai Yuen Cheung

发明人： Deming Liu ,  Ran Fu ,  Kui Kam Lam ,  Man Chung Raymond Ng ,  Wai Yuen Cheung

IPC分类号： H01L21/44

CPC分类号： H01L24/83 ,  H01L21/67132 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015

摘要： The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.

摘要翻译： 本发明提供一种用于芯片附着到包括非金属材料的基板上的设备，以及适于接收具有共晶涂层的模具的金属材料。 提供加热导管，通过该加热导管可移动基板，以将金属材料加热至共晶接合温度，以便于在模具附着位置处与模具和金属材料之间的结合。 在将模具附接到金属材料上之前，在芯片附着位置处的感应加热装置将基板的金属材料加热至共晶粘合温度。

公开(公告)号：US06306578B1

公开(公告)日：2001-10-23

申请号：US09528085

申请日：2000-03-17

申请人： Volker Schellenberger ,  Amy Deming Liu

发明人： Volker Schellenberger ,  Amy Deming Liu

IPC分类号： C12Q100

CPC分类号： B01J19/0046 ,  B01J2219/00286 ,  B01J2219/00317 ,  B01J2219/00319 ,  B01J2219/0052 ,  B01J2219/00524 ,  B01J2219/00533 ,  B01J2219/00596 ,  B01J2219/00644 ,  B01J2219/00659 ,  B01J2219/00662 ,  B01J2219/00707 ,  B01L3/5025 ,  B01L3/5085 ,  B01L3/50857 ,  B01L2300/0654 ,  B01L2300/0809 ,  B01L2300/161 ,  C40B60/14 ,  G01N35/1065 ,  G01N2035/00237

摘要： A method for holding samples for analysis and an apparatus thereof includes a testing plate with a pair of opposing surfaces and a plurality of holes. Each of the holes extends from one of the opposing surfaces to the other one of the opposing surfaces. The holes are arranged in groups, where each group has at least two rows and two columns of holes. The groups are arranged in sets, where each set has at least two rows and two columns of groups. To analyze samples, at least one of the opposing surfaces of the testing plate is immersed in a solution to be analyzed. A portion of the solution enters openings for each of the holes in the immersed opposing surface. Once the holes are filled with solution, the testing plate is removed and is held above a supporting surface. Surface tension holds the solution in each of the holes. The solution in one or more of the holes is then analyzed and the solution in one of these holes is identified for further study. The location of the identified solution is marked based upon its location within a particular set and group of holes.

摘要翻译： 用于保持用于分析的样品的方法及其装置包括具有一对相对表面和多个孔的测试板。 每个孔从相对表面中的一个延伸到相对表面中的另一个。 孔分组排列，每组具有至少两排和两列孔。 这些组以组合的形式排列，其中每组具有至少两行和两列组。 为了分析样品，将测试板的相对表面中的至少一个浸入待分析的溶液中。 溶液的一部分进入浸入的相对表面中的每个孔的开口。 一旦孔充满了溶液，测试板被移除并被保持在支撑表面上方。 表面张力将溶液保持在每个孔中。 然后分析一个或多个孔中的溶液，并鉴定其中一个孔中的溶液用于进一步研究。 所识别的解决方案的位置基于其在特定组和一组孔内的位置被标记。

公开(公告)号：US20130044755A1

公开(公告)日：2013-02-21

申请号：US13210576

申请日：2011-08-16

申请人： Deming Liu ,  Ken Yi ,  Pinzhong Liu

发明人： Deming Liu ,  Ken Yi ,  Pinzhong Liu

IPC分类号： H04L12/56

CPC分类号： H04L47/568

摘要： An apparatus comprising a plurality of queues configured to cache a plurality of packets that correspond to a plurality of sessions, a scheduler configured to schedule the packets from the different queues for forwarding based on a finish time for each packet at the egress of each corresponding queue, and an egress link coupled to the scheduler and configured to forward the scheduled packets from all the queues at a total bandwidth that is shared among the queues, wherein the finish time is calculated dynamically based on the amount of bandwidth allocated for the corresponding queue, and wherein the queues are assigned corresponding weights for sharing the total bandwidth.

摘要翻译： 一种装置，包括：多个队列，被配置为缓存对应于多个会话的多个分组;调度器，被配置为基于每个对应队列的出口处的每个分组的完成时间调度来自不同队列的分组以进行转发 以及耦合到所述调度器的出端链路，并且被配置为以所述队列之间共享的总带宽转发来自所有队列的所述调度分组，其中，基于为相应队列分配的带宽量来动态地计算完成时间， 并且其中为队列分配相应的权重以共享总带宽。

公开(公告)号：US20120094851A1

公开(公告)日：2012-04-19

申请号：US13276179

申请日：2011-10-18

申请人： Volker SCHELLENBERGER ,  Amy Deming Liu

发明人： Volker SCHELLENBERGER ,  Amy Deming Liu

IPC分类号： C40B30/00 ,  C40B60/12

CPC分类号： B01J19/0046 ,  B01J2219/00286 ,  B01J2219/00317 ,  B01J2219/00319 ,  B01J2219/0052 ,  B01J2219/00524 ,  B01J2219/00533 ,  B01J2219/00596 ,  B01J2219/00644 ,  B01J2219/00659 ,  B01J2219/00662 ,  B01J2219/00707 ,  B01L3/5025 ,  B01L3/5085 ,  B01L3/50857 ,  B01L2300/0654 ,  B01L2300/0809 ,  B01L2300/161 ,  C40B60/14 ,  G01N35/1065 ,  G01N2035/00237

摘要： A method for holding samples for analysis and an apparatus thereof includes a testing plate with a pair of opposing surfaces and a plurality of holes. Each of the holes extends from one of the opposing surfaces to the other one of the opposing surfaces. The holes are arranged in groups, where each group has at least two rows and two columns of holes. The groups are arranged in sets, where each set has at least two rows and two columns of groups. To analyze samples, at least one of the opposing surfaces of the testing plate is immersed in a solution to be analyzed. A portion of the solution enters openings for each of the holes in the immersed opposing surface. Once the holes are filled with solution, the testing plate is removed and is held above a supporting surface. Surface tension holds the solution in each of the holes. The solution in one or more of the holes is then analyzed and the solution in one of these holes is identified for further study. The location of the identified solution is marked based upon its location within a particular set and group of holes.

摘要翻译： 用于保持用于分析的样品的方法及其装置包括具有一对相对表面和多个孔的测试板。 每个孔从相对表面中的一个延伸到相对表面中的另一个。 孔分组排列，每组具有至少两排和两列孔。 这些组以组合的形式排列，其中每组具有至少两行和两列组。 为了分析样品，将测试板的相对表面中的至少一个浸入待分析的溶液中。 溶液的一部分进入浸入的相对表面中的每个孔的开口。 一旦孔充满了溶液，测试板被移除并被保持在支撑表面上方。 表面张力将溶液保持在每个孔中。 然后分析一个或多个孔中的溶液，并鉴定其中一个孔中的溶液用于进一步研究。 所识别的解决方案的位置基于其在特定组和一组孔内的位置被标记。

公开(公告)号：US07666360B2

公开(公告)日：2010-02-23

申请号：US10223893

申请日：2002-08-20

申请人： Volker Schellenberger ,  Amy Deming Liu

发明人： Volker Schellenberger ,  Amy Deming Liu

IPC分类号： B01L3/00

CPC分类号： B01J19/0046 ,  B01J2219/00286 ,  B01J2219/00317 ,  B01J2219/00319 ,  B01J2219/0052 ,  B01J2219/00524 ,  B01J2219/00533 ,  B01J2219/00596 ,  B01J2219/00644 ,  B01J2219/00659 ,  B01J2219/00662 ,  B01J2219/00707 ,  B01L3/5025 ,  B01L3/5085 ,  B01L3/50857 ,  B01L2300/0654 ,  B01L2300/0809 ,  B01L2300/161 ,  C40B60/14 ,  G01N35/1065 ,  G01N2035/00237

摘要： A method for holding samples for analysis and an apparatus thereof includes a testing plate with a pair of opposing surfaces and a plurality of holes. Each of the holes extends from one of the opposing surfaces to the other one of the opposing surfaces. The holes are arranged in groups, where each group has at least two rows and two columns of holes. The groups are arranged in sets, where each set has at least two rows and two columns of groups. To analyze samples, at least one of the opposing surfaces of the testing plate is immersed in a solution to be analyzed. A portion of the solution enters openings for each of the holes in the immersed opposing surface. Once the holes are filled with solution, the testing plate is removed and is held above a supporting surface. Surface tension holds the solution in each of the holes. The solution in one or more of the holes is then analyzed and the solution in one of these holes is identified for further study. The location of the identified solution is marked based upon its location within a particular set and group of holes.

摘要翻译： 用于保持用于分析的样品的方法及其装置包括具有一对相对表面和多个孔的测试板。 每个孔从相对表面中的一个延伸到相对表面中的另一个。 孔分组排列，每组具有至少两排和两列孔。 这些组以组合的形式排列，其中每组具有至少两行和两列组。 为了分析样品，将测试板的相对表面中的至少一个浸入待分析的溶液中。 溶液的一部分进入浸入的相对表面中的每个孔的开口。 一旦孔充满了溶液，测试板被移除并被保持在支撑表面上方。 表面张力将溶液保持在每个孔中。 然后分析一个或多个孔中的溶液，并鉴定其中一个孔中的溶液用于进一步研究。 所识别的解决方案的位置基于其在特定组和一组孔内的位置被标记。

公开(公告)号：US07458495B2

公开(公告)日：2008-12-02

申请号：US10964292

申请日：2004-10-13

申请人： Ran Fu ,  Deming Liu ,  Chi Chuen Chaw ,  Hing Leung Li ,  Chak Hau Pang ,  Hing Suen Siu

发明人： Ran Fu ,  Deming Liu ,  Chi Chuen Chaw ,  Hing Leung Li ,  Chak Hau Pang ,  Hing Suen Siu

IPC分类号： B23K1/06 ,  B29C65/08

CPC分类号： B23K20/106 ,  B23K2101/40 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2224/0401

摘要： A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.

摘要翻译： 提供了一种用于将半导体芯片接合到表面的接合工具和方法，其中所述接合工具包括具有陶瓷材料的接合末端，优选为碳化钛。 接合端可操作以保持芯片，并且诸如超声波换能器的键合能量发生器耦合到接合尖端，以将粘合能量施加到接合尖端和芯片以将芯片粘合到表面。 接合端可以进一步包括马氏体，使得碳化钛存在于硬质相中，并且马氏体作为粘合剂存在于软相中。