公开(公告)号：US20050032257A1

公开(公告)日：2005-02-10

申请号：US10938237

申请日：2004-09-10

申请人： Michael Camras ,  Michael Krames ,  Wayne Snyder ,  Frank Steranka ,  Robert Taber ,  John Uebbing ,  Douglas Pocius ,  Troy Trottier ,  Christopher Lowery ,  Gerd Mueller ,  Regina Mueller-Mach ,  Gloria Hofler

发明人： Michael Camras ,  Michael Krames ,  Wayne Snyder ,  Frank Steranka ,  Robert Taber ,  John Uebbing ,  Douglas Pocius ,  Troy Trottier ,  Christopher Lowery ,  Gerd Mueller ,  Regina Mueller-Mach ,  Gloria Hofler

IPC分类号： H01L33/20 ,  H01L33/40 ,  H01L33/58 ,  H01L21/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/502 ,  H01L33/62

摘要： A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region is provided. The method includes elevating a temperature of the optical element and the stack and applying a pressure to press the optical element and the stack together. In one embodiment, the method also includes disposing a layer of a transparent bonding material between the stack and the optical element. The bonding method can be applied to a premade optical element or to a block of optical element material which is later formed or shaped into an optical element such as a lens or an optical concentrator.

摘要翻译： 提供了一种将透明光学元件结合到具有包括包括有源区域的半导体层的层叠层的发光器件的方法。 该方法包括升高光学元件和叠层的温度并施加压力以将光学元件和叠层压在一起。 在一个实施例中，该方法还包括在叠层和光学元件之间设置透明粘结材料层。 接合方法可以应用于预制光学元件或稍后形成或成形为诸如透镜或聚光器的光学元件的光学元件材料块。

公开(公告)号：US20080023719A1

公开(公告)日：2008-01-31

申请号：US11868903

申请日：2007-10-08

申请人： Michael Camras ,  Michael Krames ,  Wayne Snyder ,  Frank Steranka ,  Robert Taber ,  John Uebbing ,  Douglas Pocius ,  Troy Trottier ,  Christopher Lowery ,  Gerd Mueller ,  Regina Mueller-Mach ,  Gloria Hofler

发明人： Michael Camras ,  Michael Krames ,  Wayne Snyder ,  Frank Steranka ,  Robert Taber ,  John Uebbing ,  Douglas Pocius ,  Troy Trottier ,  Christopher Lowery ,  Gerd Mueller ,  Regina Mueller-Mach ,  Gloria Hofler

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/502 ,  H01L33/62

摘要： Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent optical element.

摘要翻译： 提供了具有提高光提取效率的发光器件。 发光器件具有包括有源区的半导体层的一叠层。 叠层结合到透明光学元件上。

公开(公告)号：US20060118805A1

公开(公告)日：2006-06-08

申请号：US11328964

申请日：2006-01-09

申请人： Michael Camras ,  Gerard Harbers ,  William Imler ,  Matthijs Keuper ,  Paul Martin ,  Douglas Pocius ,  Frank Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. West

发明人： Michael Camras ,  Gerard Harbers ,  William Imler ,  Matthijs Keuper ,  Paul Martin ,  Douglas Pocius ,  Frank Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. West

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

公开(公告)号：US20050023545A1

公开(公告)日：2005-02-03

申请号：US10633054

申请日：2003-07-31

申请人： Michael Camras ,  Gerard Harbers ,  William Imler ,  Matthijs Keuper ,  Paul Martin ,  Douglas Pocius ,  Frank Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. West

发明人： Michael Camras ,  Gerard Harbers ,  William Imler ,  Matthijs Keuper ,  Paul Martin ,  Douglas Pocius ,  Frank Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. West

IPC分类号： H01L33/44 ,  H01L33/58 ,  H01L33/60 ,  H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

摘要翻译： 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。

公开(公告)号：US20080006840A1

公开(公告)日：2008-01-10

申请号：US11860486

申请日：2007-09-24

申请人： Michael Camras ,  Gerard Harbers ,  William Imler ,  Matthijs Keuper ,  Paul Martin ,  Douglas Pocius ,  Frank Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. West

发明人： Michael Camras ,  Gerard Harbers ,  William Imler ,  Matthijs Keuper ,  Paul Martin ,  Douglas Pocius ,  Frank Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. West

IPC分类号： H01L29/22 ,  H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

摘要翻译： 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。