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    Color control by alteration of wavelength converting element
    3.
    发明申请
    Color control by alteration of wavelength converting element 有权
    通过改变波长转换元件的颜色控制

    公开(公告)号：US20060258028A1

    公开(公告)日：2006-11-16

    申请号：US11444592

    申请日：2006-05-31

    申请人： Steven Paolini ,  Michael Camras ,  Oscar Chao Pujol ,  Frank Steranka ,  John Epler

    发明人： Steven Paolini ,  Michael Camras ,  Oscar Chao Pujol ,  Frank Steranka ,  John Epler

    IPC分类号： H01L21/00

    CPC分类号： H01L33/508 ,  H01L33/22 ,  H01L33/58 ,  H01L2224/73253 ,  H01L2933/0041

    摘要： A light emitting device is produced by depositing a layer of wavelength converting material over the light emitting device, testing the device to determine the wavelength spectrum produced and correcting the wavelength converting member to produce the desired wavelength spectrum. The wavelength converting member may be corrected by reducing or increasing the amount of wavelength converting material. In one embodiment, the amount of wavelength converting material in the wavelength converting member is reduced, e.g., through laser ablation or etching, to produce the desired wavelength spectrum.

    摘要翻译： 通过在发光器件上沉积波长转换材料层来制造发光器件，测试该器件以确定产生的波长光谱并校正波长转换部件以产生所需的波长光谱。 可以通过减少或增加波长转换材料的量来校正波长转换构件。 在一个实施例中，波长转换构件中的波长转换材料的量例如通过激光烧蚀或蚀刻而减小，以产生所需的波长谱。

    Bonding an optical element to a light emitting device
    6.
    发明申请
    Bonding an optical element to a light emitting device 有权
    将光学元件结合到发光器件

    公开(公告)号：US20060105478A1

    公开(公告)日：2006-05-18

    申请号：US10987241

    申请日：2004-11-12

    申请人： Michael Camras ,  William Imler ,  Franklin Wall ,  Frank Steranka ,  Michael Krames ,  Helena Ticha ,  Ladislav Tichy

    发明人： Michael Camras ,  William Imler ,  Franklin Wall ,  Frank Steranka ,  Michael Krames ,  Helena Ticha ,  Ladislav Tichy

    IPC分类号： H01L21/00

    CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.

    摘要翻译： 设备具有至少一个发光器件（LED）裸片，该发光器件（LED）裸片安装在具有随后热粘合到LED管芯上的光学元件的基座上。 LED管芯通过接触凸块电连接到副安装座，接触凸块具有比用于将光学元件热粘合到LED管芯的温度高的熔点。 在一个实现中，单个光学元件被结合到安装到基座上的多个LED芯片，并且基座和光学元件具有大致相同的热膨胀系数。 或者，可以使用多个光学元件。 光学元件或LED管芯可以用波长转换材料的涂层覆盖。 在一个实施方案中，测试该器件以确定产生的波长，并且添加波长转换材料的附加层，直到产生所需的波长。