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公开(公告)号：US20230416527A1
公开(公告)日：2023-12-28
申请号：US17871593
申请日：2022-07-22
发明人： Zhilong HU , Xiangnan LI , Hongxia PENG , Hezong ZHANG , Bangjun LAN
IPC分类号： C08L71/12
CPC分类号： C08L71/126 , C08L2205/03
摘要： A phenylvinylsilane-divinylbenzene-styrene terpolymer is prepared by copolymerizing 50 parts by weight to 70 parts by weight of phenylvinylsilane, 10 parts by weight to 20 parts by weight of divinylbenzene and 20 parts by weight to 30 parts by weight of styrene, the total amount of phenylvinylsilane, divinylbenzene and styrene being 100 parts by weight, wherein the phenylvinylsilane has a structure of Formula (I) or Formula (II). Moreover, a resin composition includes a phenylvinylsilane-divinylbenzene-styrene terpolymer and a vinyl group-containing polyphenylene ether resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.
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2.发明授权公开(公告)号：US11773115B2
公开(公告)日：2023-10-03
申请号：US17013226
申请日：2020-09-04
发明人： Zhilong Hu , Hezong Zhang
CPC分类号： C07F7/0812 , C08K5/5406 , C08L71/126 , C08L79/085 , C08J5/18 , C08J5/244 , C08J2371/12
摘要： A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved.
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公开(公告)号：US20210108074A1
公开(公告)日：2021-04-15
申请号：US16699159
申请日：2019-11-29
发明人： Zhilong HU , Xiang XIONG , Yaoqiang MING
摘要： A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.
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公开(公告)号：US10947364B2
公开(公告)日：2021-03-16
申请号：US15832083
申请日：2017-12-05
发明人： Zhilong Hu , Licheng Lin
IPC分类号： C08K5/00 , C08K5/5313 , C08K5/5357 , C07F9/40 , C07F9/30 , C07F9/53 , C07F9/6571 , G01N21/35 , G01N25/48 , G01R33/46
摘要： Disclosed is a phosphorus-containing compound capable of serving as a flame retardant to be used in conjunction with other ingredients to make resin compositions, useful for fabricating such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including glass transition temperature, coefficient of thermal expansion, thermal resistance, flame retardancy, dielectric constant, and dissipation factor. In addition, a method of preparing the phosphorus-containing compound and a resin composition comprising the phosphorus-containing compound are also disclosed.
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公开(公告)号：US20170166729A1
公开(公告)日：2017-06-15
申请号：US15225839
申请日：2016-08-02
发明人： ZHI-LONG HU , Chen-Yu Hsieh
IPC分类号： C08K5/5313 , C08J5/24 , H05K1/03 , C09D5/18 , H05K1/09 , C08L71/12 , C09D171/12
CPC分类号： C08K5/5313 , C08J5/24 , C08J2371/12 , C08K3/36 , C08K5/14 , C08L71/126 , C08L2201/02 , C08L2203/206 , C08L2205/03 , C08L2205/035 , C09D5/18 , C09D7/61 , C09D171/12 , H05K1/0326 , H05K1/0373 , H05K2201/012 , C08L71/12
摘要： The present invention relates to resin composite materials, and more particularly, to low-dielectric resin composition and prepreg, resin film, resin coated copper, laminate and printed circuit board formed therefrom. The low-dielectric resin composition includes a phosphorus-containing flame retardant as shown in formula (I) and a resin with an active unsaturated bond. The low-dielectric resin composition may further be manufactured as a prepreg, a resin film, a resin coated copper, a laminate, or a printed circuit board, having a high glass transition temperature, low dielectric property, halogen-free flame retardancy and low percent of thermal expansion of laminate.
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6.发明申请PHOSPHAPHENANTHRENE-BASED COMPOUND AND RELATED PREPARATION METHOD AND APPLICATION 有权基于磷酸盐的化合物及相关制备方法和应用公开(公告)号：US20170022228A1
公开(公告)日：2017-01-26
申请号：US15086047
申请日：2016-03-30
发明人： ZHI-LONG HU , CHEN-YU HSIEH , XING-FA CHEN , XIANG XIONG
IPC分类号： C07F9/6574 , C08G79/04
CPC分类号： C08G79/04 , C07F9/657172
摘要： Provided is a phosphaphenanthrene-based compound represented by the following chemical structure: The phosphaphenanthrene-based compound can be added in a resin composition and made into a prepreg or resin film. The prepreg or resin film made from such resin composition has low coefficient of thermal expansion, low dielectric constant and dissipation factor, and flame retardancy, thereby being suitable for copper-clad laminate or printed circuit board.
摘要翻译： 可以将菲基类菲基化合物加入到树脂组合物中，制成预浸料或树脂膜。 由这种树脂组合物制成的预浸料或树脂膜具有低热膨胀系数，低介电常数和耗散因数以及阻燃性，因此适用于覆铜层压板或印刷电路板。
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7.发明授权Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same 有权无卤素树脂组合物，使用其的覆铜层压板和使用其的印刷电路板公开(公告)号：US09187635B2
公开(公告)日：2015-11-17
申请号：US13827911
申请日：2013-03-14
发明人： Chang-Yuan Li , Yi-Jen Chen , Hong-Xia Peng
CPC分类号： C08L63/00 , C08G59/302 , C08G59/4064 , C08G59/621 , C08L35/00 , C09D163/00 , H05K1/0353 , Y10T428/24917 , Y10T428/31529 , C08L35/06
摘要： A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.
摘要翻译： 无卤树脂组合物包含（A）100重量份环氧树脂; （B）10〜100重量份苯乙烯 - 马来酸酐（SMA）共聚物; 和（C）5〜50重量份的双酚S.无卤素树脂组合物包含特定成分，其特征在于其特定比例，从而实现高玻璃化转变温度，高耐热性和有吸引力的外观，以及 因此适用于制备预浸料或树脂膜，从而可应用于覆铜层压板和印刷电路板。
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公开(公告)号：US11713391B2
公开(公告)日：2023-08-01
申请号：US17205653
申请日：2021-03-18
发明人： Yaoqiang Ming , Zhilong Hu
CPC分类号： C08L33/24 , C08J5/244 , C08J5/246 , C08K3/36 , C08K5/3445 , C08K7/18 , H05K1/02 , C08K2201/003 , C08L63/00 , C08L79/04 , C08L2201/08 , C08L2203/16 , C08L2203/20 , C08L2205/03 , H05K2201/0154
摘要： A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.
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公开(公告)号：US20230126282A1
公开(公告)日：2023-04-27
申请号：US17539541
申请日：2021-12-01
发明人： Zhilong HU , Changyuan LI , Hongxia PENG , Lianhui CAI , Jianzhao LI
摘要： A phosphorus-containing silane compound has a structure of SiR1(R2)n(R3)3-n, wherein R1 is a phenyl group, R2 is a vinyl group, R3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.
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10.发明申请公开(公告)号：US20220024952A1
公开(公告)日：2022-01-27
申请号：US17013226
申请日：2020-09-04
发明人： Zhilong HU , Hezong ZHANG
摘要： A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved.
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