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    Method for picking semiconductor chips from a foil
    1.
    发明申请
    Method for picking semiconductor chips from a foil 审中-公开
    从箔片拾取半导体芯片的方法

    公开(公告)号：US20040105750A1

    公开(公告)日：2004-06-03

    申请号：US10719829

    申请日：2003-11-20

    申请人： ESEC TRADING SA, A Swiss Corporation

    发明人： Daniel Bolliger ,  Dominik Hartmann ,  Felix Leu ,  Eugen Mannhart

    IPC分类号： B65B021/02

    CPC分类号： H01L21/67132 ,  H01L2221/68322

    摘要： The picking of a semiconductor chip from a foil takes place by means of a chip gripper which bears on a bondhead and can be deflected in a predetermined direction and with the aid of a needle. An inductive sensor serves the precise measurement of the deflection of the chip gripper with reference to the bondhead. The pick process itself is characterised by the following steps: a) Lowering the chip gripper to a height z0, that is greater than an average height of the surface of the semiconductor chips so that the chip gripper does not yet touch the semiconductor chip, b) Raising the needle to a predetermined height z1, whereby the needle raises the semiconductor chip in order to bring the semiconductor chip into contact with the chip gripper and then to increase the height of the chip gripper, and c) Raising the chip gripper, whereby the semiconductor chip detaches itself from the needle.

    摘要翻译： 从箔片中取出半导体芯片通过一个芯片夹持器进行，该夹持器承载在接合头上，并且可以在预定的方向上偏转并借助于针头。 电感式传感器用于精确测量芯片夹持器参考接合头的偏转。 拾取过程本身的特征在于以下步骤：a）将芯片夹持器降低到高于半导体芯片的表面的平均高度的高度z0，使得芯片夹持器尚未接触半导体芯片，b ）将针抬高到预定的高度z1，由此针引出半导体芯片以使半导体芯片与芯片夹持器接触，然后增加芯片夹持器的高度，并且c）提升芯片夹持器，由此 半导体芯片将其自身从针脱离。

    Method for the calibration of a Wire Bonder
    3.
    发明申请
    Method for the calibration of a Wire Bonder 失效
    焊线机校准方法

    公开(公告)号：US20030146267A1

    公开(公告)日：2003-08-07

    申请号：US10357160

    申请日：2003-02-03

    申请人： ESEC Trading SA

    发明人： Michael Mayer ,  Martin Melzer

    IPC分类号： B23K031/02 ,  B23K037/00

    CPC分类号： H01L24/78 ,  B23K20/005 ,  B23K20/106 ,  H01L2224/78302 ,  H01L2224/789 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099

    摘要： In order that, on wire bonding by means of a Wire Bonder, optimum bonding results can be achieved after a capillary change it is suggested that, after a change from a first capillary to a second capillary, the ultrasonic transducer which applies ultrasonics to the horn which guides the capillary is controlled with a parameter P2 which results from the parameter P1 before the capillary change as P2nullg(k1, k2)*P1 or P2nullg(k1, k2, A1, A2)*P1 or P2nullg(k1, k2, A1, A2, H1, H2)*P1, whereby the quantities k1 and k2 designate the estimated values for the flexural strength, the quantities A1 and A2 the amplitudes of the freely oscillating capillary and H1 and H2 the diameters in the narrowest part of the longitudinal drill hole of the first or second capillary and whereby the function g is a predetermined function.

    摘要翻译： 为了通过引线接合器进行引线接合，毛细管变化后可以实现最佳的结合结果，建议在从第一毛细管到第二毛细管的变化之后，将超声波应用于喇叭 使用参数P2控制毛细管，该参数P2由毛细管变化之前的参数P1产生，P2 = g（k1，k2）* P1或P2 = g（k1，k2，A1，A2）* P1或P2 = g （k1，k2，A1，A2，H1，H2）* P1，其中数量k1和k2表示弯曲强度的估计值，量A1和A2表示自由振动毛细管的振幅和H1和H2的直径 第一或第二毛细管的纵向钻孔的最窄部分，由此功能g是预定的功能。

    Apparatus for the transport and equipping of substrates with semiconductor chips
    4.
    发明申请
    Apparatus for the transport and equipping of substrates with semiconductor chips 失效
    用于运输和装备具有半导体芯片的衬底的装置

    公开(公告)号：US20030022416A1

    公开(公告)日：2003-01-30

    申请号：US10209066

    申请日：2002-07-29

    申请人： ESEC Trading SA, a Swiss Corporation

    发明人： Daniel Kellenberger ,  Guido Suter

    IPC分类号： H01L021/44

    CPC分类号： H01L21/67144

    摘要： An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order to move the substrates in transport direction as well as resiliently mounted elements which press against the substrates.

    摘要翻译： 用于输送和装备具有半导体芯片的基板的装置包括具有两个侧壁的通道，其中基板沿输送方向输送。 该装置具有至少一个可以升高和降低的梳子，以便在输送方向上移动基板以及压靠基板的弹性安装元件。

    Apparatus for placing a semiconductor chip as a flipchip on a substrate
    5.
    发明申请
    Apparatus for placing a semiconductor chip as a flipchip on a substrate 失效
    用于将半导体芯片作为倒装芯片放置在基板上的装置

    公开(公告)号：US20020162217A1

    公开(公告)日：2002-11-07

    申请号：US10086405

    申请日：2002-02-28

    申请人： ESEC Trading SA, a Swiss Corporation

    发明人： Dominik Hartmann ,  Ruedi Grueter

    IPC分类号： B23P019/00 ,  H05K003/34

    CPC分类号： H01L21/67132 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53196 ,  Y10T29/53265

    摘要： An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.

    摘要翻译： 将半导体芯片作为倒装芯片放置在基板上的装置具有用于翻转半导体芯片的翻盖装置。 翻盖装置形成为由支撑托架，第一和第二旋转臂和连接臂组成的平行四边形构造。 连接臂上设置有芯片夹持器。 驱动系统用于在芯片夹持器接受半导体芯片的第一极限位置和芯片夹持器将半导体芯片放置在基板上的第二极限位置之间平行四边形结构的前后运动。

    Wire bonder
    6.
    发明申请
    Wire bonder 失效
    焊线机

    公开(公告)号：US20040245314A1

    公开(公告)日：2004-12-09

    申请号：US10853328

    申请日：2004-05-25

    申请人： ESEC Trading SA

    发明人： Dieter Vischer

    IPC分类号： B23K037/00

    CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01082 ,  H01L2924/19042 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： The bondhead of a Wire Bonder, that serves to produce a wire connection between two connection points by means of a capillary guiding a wire, is formed as a pantograph mechanism. The pantograph mechanism comprises a first swivel arm driven by a first motor, a second swivel arm driven by a second motor and two connecting arms. With this pantograph mechanism, the movement of the capillary takes place by means of rotary movements.

    摘要翻译： 用于通过引导导线的毛细管在两个连接点之间产生电线连接的引线接合器的接合头形成为缩放机构。 受电弓机构包括由第一电动机驱动的第一旋转臂，由第二电动机驱动的第二旋转臂和两个连接臂。 利用此缩放机构，毛细管的运动通过旋转运动进行。

    Clamping element with an integrated force sensor
    7.
    发明申请
    Clamping element with an integrated force sensor 失效
    具有集成力传感器的夹紧元件

    公开(公告)号：US20040025605A1

    公开(公告)日：2004-02-12

    申请号：US10606146

    申请日：2003-06-24

    申请人： ESEC Trading SA, a Swiss Corporation

    发明人： Peter Hess ,  Raphael Bernhardsgrueter ,  Alexander Greber ,  Hansjorg Gujer ,  Nicolino Onda

    IPC分类号： G01M019/00

    CPC分类号： H01L21/67288 ,  G01L5/0071 ,  H01L21/67259 ,  H01L21/68707 ,  Y10T24/44291

    摘要： A clamping element for the transport of a substrate in a predefined transport direction comprises a first and a second leg with a first and second clamping jaw for clamping a substrate. Each of the two clamping jaws has a clamping plate which is movable in transport direction relative to the corresponding leg. A sensor measures the deflection of the first clamping plate relative to the first leg. As soon as the measured deflection exceeds a predefined threshold value, the clamping element is opened.

    摘要翻译： 用于在预定的输送方向上输送基板的夹持元件包括具有第一和第二夹持爪以夹持基底的第一和第二支腿。 两个夹爪中的每一个都具有可相对于相应的腿在运输方向上移动的夹板。 传感器测量第一夹板相对于第一支腿的挠曲。 一旦测量的偏转超过预定义的阈值，则夹紧元件打开。

    Method for determining optimum bonding parameters for bonding with a wire bonder
    8.
    发明申请
    Method for determining optimum bonding parameters for bonding with a wire bonder 失效
    用于确定用引线接合器进行接合的最佳接合参数的方法

    公开(公告)号：US20030146265A1

    公开(公告)日：2003-08-07

    申请号：US10357023

    申请日：2003-02-03

    申请人： ESEC Trading SA

    发明人： Michael Mayer ,  Jurg Schwizer

    IPC分类号： B23K031/02

    CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Optimum bond parameters for a bond force FB and an ultrasonic variable P and, optionally, at least one further bond parameter of a Wire Bonder can be determined by means of a method with the following steps: a) Carrying out several bonding operations, with which an end of a wire formed into a ball is bonded onto a connection point, whereby the bond force FB and the ultrasonic variable P and, if necessary, the at least one further bond parameter are each varied in discrete steps in a predefined range, whereby during bonding, for each bonding operation an electrical signal is produced by means of a sensor which is proportional to a shear force exerted on the corresponding connection point, b) for each bonding operation, determining a quantity G from the electrical signal delivered by the sensor during the bonding operation, c) Determining the maximum value of the quantity G and the corresponding values for the bond force FB, the ultrasonic variable P and, if necessary, the at least one further bond parameter or determining a global maximum of the quantity G and determining the corresponding values for the bond force FB, the ultrasonic variable P and, if necessary, the at least one further bond parameter or determining a parameter range H for the quantity G in which the quantity G fulfills predefined criteria, and determining a value for the bond force FB, the ultrasonic variable P and, if necessary, the at least one further bond parameter, which lie in the parameter range H.

    摘要翻译： 可以通过具有以下步骤的方法来确定接合力FB和超声波变量P以及任选地至少一个引线接合器的另外的接合参数的最佳接合参数：a）进行多个接合操作，其中 形成为球的线的端部被接合到连接点上，由此接合力FB和超声波变量P以及必要时的至少一个另外的接合参数各自以预定范围的离散步长变化，由此 在接合期间，对于每个接合操作，通过与施加在对应连接点上的剪切力成比例的传感器产生电信号，b）对于每个接合操作，从由传感器传送的电信号确定量G 在接合操作期间，c）确定数量G的最大值和接合力FB的相应值，超声波变量P以及如有必要，至少一个f 进一步的粘合参数或确定数量G的全局最大值，并确定粘合力FB，超声波变量P和如果需要的至少一个另外的粘合参数或确定用于量G的参数范围H的相应值 其数量G满足预定义的标准，以及确定粘合力FB，超声波变量P和如果需要的至少一个另外的粘结参数的值，其位于参数范围H中。

    Pressure sensor
    9.
    发明申请
    Pressure sensor 失效
    压力传感器

    公开(公告)号：US20020178826A1

    公开(公告)日：2002-12-05

    申请号：US10150180

    申请日：2002-05-16

    申请人： ESEC Trading SA, a Swiss Corporation

    发明人： Eugen Mannhart

    IPC分类号： G01L013/02

    CPC分类号： G01L27/002

    摘要： A pressure sensor for measuring a pressure p contains a membrane with a front and a rear clamped into a body. The pressure p can be applied to the rear of the membrane. The front of the membrane is actively linked to a piston. In addition, a force transmitter is present with which a predetermined force can be applied to the piston. For the purpose of re-calibration, the membrane of the pressure sensor can be deformed by the force transmitter under precisely defined conditions and the output signal re-calibrated. A positioner can also be foreseen instead of the force transmitter.

    摘要翻译： 用于测量压力p的压力传感器包含具有夹紧在主体中的前后的膜。 压力p可以施加到膜的后部。 膜的前部活动地连接到活塞。 此外，存在能够向活塞施加预定力的力传递器。 为了重新校准，压力传感器的膜可以在精确定义的条件下由力传感器变形，并输出信号重新校准。 定位器也可以预见，而不是力传递器。