摘要:
A plastic optical element for focusing light to a target includes a first lens and a second lens. The first lens includes an incident surface, a projection surface opposite the incident surface, and a non-optical surface through which light does not pass and that includes a non-transfer portion. At least one light beam passes from the incident surface to the projection surface. The second lens includes an incident surface, a projection surface opposite the incident surface, and a non-optical surface through which light does not pass and that includes a non-transfer portion disposed opposite the non-optical surface of the first lens. At least one light beam passes from the incident surface to the projection surface. The non-transfer portions of the first lens and the second lens are portions on which no surface is transferred from a surface of a mold used to form the plastic optical element.
摘要:
A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
摘要:
An optical scanning device that scans a plurality of surfaces to be scanned in a main scanning direction by using a light beam includes: a plurality of light sources; a light deflector that deflects a plurality of light beams emitted from the light sources; and a scanning optical system that individually guides each one of the light beams deflected by the light deflector to a corresponding one of the surfaces to be scanned. The scanning optical system includes one scanning lens shared by the light beams, and at least one surface of the scanning lens has a plurality of optical surfaces corresponding to the plurality of light beams disposed in a sub-scanning direction with a flat surface provided between the optical surfaces.
摘要:
A plastic article is formable by using a metal die having a cavity to accommodate melted resin therein at a given pressure. The plastic article includes a transfer face to which is transferred a face shape of the metal die, a projection disposed at least one face other than the transfer face, an incomplete transfer face having a concave shape disposed at the same face on which the projection is disposed, formed by an incomplete transfer of a face shape of the cavity of the metal die, and an incomplete transfer face having a convex shape disposed at least one face other than the transfer face.
摘要:
A molded plastic part prepared by injecting a resin in a cavity of a die so that a pressure is generated in the resin in the cavity and at least one transfer wall surface of the cavity is transferred to the resin. The plastic part has at least one transferred surface; at least one imperfectly transferred concave portion on a first surface thereof other than the transferred surface; and at least one imperfectly transferred convex portion on the first surface or a second surface thereof other than the transferred surface. The ratio (a)/(b) of the thickness (a) of the plastic part in a direction perpendicular to the transferred surface to the thickness (b) of the plastic part in a direction parallel to the transferred surface is less than 1.
摘要:
A plastic optical element for guiding a scanned light beam in a main scanning direction and a sub-scanning direction, which is prepared by a molding method using a die. The element includes: a main body including at least two optically functional surfaces, which are transfer surfaces formed by contacted with transfer surfaces of the die and through which the light beam passes; and at least two ribs located on surfaces of the main body other than the optically functional surfaces and extending in parallel in the main scanning direction. A recessed portion is present on a surface of at least one of the ribs, and the recessed portion has a side transfer surface and a bottom surface, which is a non-transfer surface, and the distance between the optically functional surfaces is less than the length of the main body in the sub-scanning direction.
摘要:
Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 μm or below.
摘要:
In switching by failure, no switching is performed when a packet of IP packet is lost or a packet has not arrived even when a predetermined time has elapsed, which are not recognized as a failure. There is provided a duplicate transmission path switching device for data packets having the same information configuration to a main transmission path and an auxiliary transmission path. The device includes a transmission failure monitoring unit for monitoring a transmission failure of the main transmission path; a switching receiving unit arranged at the downstream of the transmission failure monitoring unit capable of receiving a packet from the main transmission path during a normal mode, and switching to the auxiliary transmission path to acquire a packet from the auxiliary transmission path in a predetermined mode; and a switching command output unit used when the monitoring result shows that a transmission failure is present, for outputting a switching command capable of switching to the auxiliary transmission path before the transmission failure reaches the switching/receiving unit, to the switching/receiving unit.
摘要:
The present invention discloses an image processor, in which an inverter for driving a fluorescent lamp is disposed in separation into parts at both ends of a carriage mounting the fluorescent lamp thereon in a direction perpendicular to a scanning direction of the carriage, so as to shorten a harness between the fluorescent lamp and the inverter and dispense with a part projecting in the scanning direction of the carriage, thereby achieving miniaturization. Inverters for driving a fluorescent lamp are disposed in appropriate separation at both ends of a full-rate carriage mounting the fluorescent lamp thereon in a scanning direction of the full-rate carriage and does not project in the scanning direction of the full-rate carriage. Thus, it is unnecessary to provide space in a casing for accommodating a projecting inverter in the case at a scanning ending end, thereby allowing miniaturizing the casing.
摘要:
A polyester-surfaced heat-shrinkable multilayer film exhibiting good printability and adaptability to various automatic packaging processes is provided, including an outer surface layer (a) comprising a polyester resin, an intermediate layer (b) comprising a polyamide resin and an inner surface layer (c) comprising a sealable resin. The film exhibits a heat-shrinkable stress at 50° C. of at most 3 MPa both in longitudinal direction and in transverse direction, and a hot water shrinkability at 90° C. of at least 20%.