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    Method for cleaning a substrate
    3.
    发明申请
    Method for cleaning a substrate 有权
    清洗基材的方法

    公开(公告)号：US20070157668A1

    公开(公告)日：2007-07-12

    申请号：US10586967

    申请日：2005-01-21

    申请人： Nicolas Nadaud ,  Eric Mattman ,  Jean-Paul Rousseau ,  Marcus Loergen

    发明人： Nicolas Nadaud ,  Eric Mattman ,  Jean-Paul Rousseau ,  Marcus Loergen

    IPC分类号： C03C17/00 ,  B32B3/00 ,  B05D3/10

    CPC分类号： C23C14/022 ,  C03C23/006 ,  C03C23/0075 ,  C03C2218/31 ,  C23C16/0245 ,  Y10T428/24612

    摘要： Method for the continuous vacuum cleaning of a substrate, characterized in that: a species is chosen that has a low sputtering efficiency and is chemically active with regard to the soiling matter; using at least one linear ion source, a plasma is generated from a gas mixture comprising predominantly the species having a low sputtering efficiency, especially one based on oxygen; and at least one surface portion of said substrate is subjected to said plasma so that said ionized species at least partly eliminates, by chemical reaction, the soiling matter possibly adsorbed or located on said surface portion.

    摘要翻译： 用于基材的连续真空清洁的方法，其特征在于：选择具有低溅射效率并且在污染物质上具有化学活性的物质; 使用至少一个线性离子源，从主要是具有低溅射效率的物质，特别是基于氧的物质的气体混合物产生等离子体; 并且所述衬底的至少一个表面部分经受所述等离子体，使得所述离子化物质通过化学反应至少部分地消除可能吸附或位于所述表面部分上的污染物质。

    VACUUM DEPOSITION METHOD
    5.
    发明申请
    VACUUM DEPOSITION METHOD 审中-公开
    真空沉积法

    公开(公告)号：US20090226735A1

    公开(公告)日：2009-09-10

    申请号：US11578938

    申请日：2005-04-15

    申请人： Nicolas Nadaud ,  Eric Mattman

    发明人： Nicolas Nadaud ,  Eric Mattman

    IPC分类号： B32B9/00 ,  C23C14/46 ,  C23C14/35

    CPC分类号： C03C17/3618 ,  C03C17/002 ,  C03C17/3411 ,  C03C17/36 ,  C03C17/3626 ,  C03C17/3644 ,  C03C17/3652 ,  C03C2217/734 ,  C23C14/0052 ,  C23C14/46

    摘要： Vacuum deposition process for depositing at least one thin film on a surface portion of a substrate, characterized in that: at least one sputtering species that is chemically inactive or active with respect to a material to be sputtered is selected; a collimated beam of ions comprising predominantly said sputtering species is generated using at least one linear ion source positioned within an installation of industrial size; said beam is directed onto at least one target based on the material to be sputtered; and at least one surface portion of said substrate is positioned so as to face said target in such a way that said material sputtered by the ion bombardment of the target or a material resulting from the reaction of said sputtered material with at least one of the sputtering species is deposited on said surface portion.

    摘要翻译： 真空沉积工艺，用于在衬底的表面部分上沉积至少一个薄膜，其特征在于：选择至少一种相对于要溅射的材料具有化学惰性或活性的溅射物质; 主要由所述溅射物质构成的准直的离子束是使用位于工业尺寸的设备内的至少一个线性离子源产生的; 所述光束基于待溅射的材料被引导到至少一个靶上; 并且所述基底的至少一个表面部分被定位成面对所述靶，使得由靶溅射的所述材料或由所述溅射材料与至少一个溅射产生的反应产生的材料 物种沉积在所述表面部分上。

    Method for cleaning a substrate
    6.
    发明授权
    Method for cleaning a substrate 有权
    清洗基材的方法

    公开(公告)号：US08080108B2

    公开(公告)日：2011-12-20

    申请号：US10586967

    申请日：2005-01-21

    申请人： Nicolas Nadaud ,  Eric Mattman ,  Jean-Paul Rousseau ,  Marcus Loergen

    发明人： Nicolas Nadaud ,  Eric Mattman ,  Jean-Paul Rousseau ,  Marcus Loergen

    IPC分类号： B08B6/00

    CPC分类号： C23C14/022 ,  C03C23/006 ,  C03C23/0075 ,  C03C2218/31 ,  C23C16/0245 ,  Y10T428/24612

    摘要： A method for the continuous vacuum cleaning of a substrate, characterized in that: a species is chosen that has a low sputtering efficiency and is chemically active with regard to the soiling matter; using at least one linear ion source, a plasma is generated from a gas mixture comprising predominantly the species having a low sputtering efficiency, especially one based on oxygen; and at least one surface portion of the substrate is subjected to the plasma so that said ionized species at least partly eliminates, by chemical reaction, the soiling matter possibly adsorbed or located on the surface portion.

    摘要翻译： 一种用于基材的连续真空清洁的方法，其特征在于：选择具有低溅射效率并且对于污染物质具有化学活性的物质; 使用至少一个线性离子源，从主要是具有低溅射效率的物质，特别是基于氧的物质的气体混合物产生等离子体; 并且基板的至少一个表面部分经受等离子体，使得所述离子化物质通过化学反应至少部分地消除可能吸附或位于表面部分上的污染物质。