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1.发明申请DEVICE AND METHOD FOR TESTING INTEGRATED CIRCUIT DICE IN AN INTEGRATED CIRCUIT MODULE 失效用于在集成电路模块中测试集成电路的装置和方法公开(公告)号：US20090027076A1
公开(公告)日：2009-01-29
申请号：US12233334
申请日：2008-09-18
IPC分类号： G01R31/26
CPC分类号： G11C29/785 , G01R31/2884 , G01R31/31701 , G01R31/31719 , G01R31/318513 , G11C29/1201 , G11C29/46 , G11C29/80 , G11C29/808 , H01L22/22 , H01L2224/48091 , H01L2224/48227 , H04J2203/0062 , H01L2924/00014
摘要： An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.
摘要翻译： 诸如多芯片模块（MCM）的IC模块包括多个IC芯片，每个具有测试模式使能焊盘，例如输出使能焊盘。 集成到MCM基板中的保险丝将每个管芯的测试模式使能接合焊盘连接到MCM的无连接（N / C）引脚之一，并且连接到衬底中的电阻将测试模式使能焊盘连接到MCM的一个接地 针脚。 通过向测试模式施加电源电压，使焊盘通过N / C引脚，在骰子中启动测试模式。 一旦测试完成，保险丝可能会被熔断，并且施加到测试模式的接地电压使得接合焊盘通过接地引脚，使得电阻器禁用骰子中的测试模式并启动操作模式。 因此，封装在IC模块中的裸片可以在封装后进行测试。
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公开(公告)号：US07034560B2
公开(公告)日：2006-04-25
申请号：US10801254
申请日：2004-03-16
IPC分类号： G01R31/28
CPC分类号： G11C29/785 , G01R31/2884 , G01R31/31701 , G01R31/31719 , G01R31/318513 , G11C29/1201 , G11C29/46 , G11C29/80 , G11C29/808 , H01L22/22 , H01L2224/48091 , H01L2224/48227 , H04J2203/0062 , H01L2924/00014
摘要： An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.
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3.发明授权Device and method for testing integrated circuit dice in an integrated circuit module 失效在集成电路模块中测试集成电路芯片的装置和方法公开(公告)号：US06801048B2
公开(公告)日：2004-10-05
申请号：US10396163
申请日：2003-03-25
IPC分类号： G01R3128
CPC分类号： G11C29/785 , G01R31/2884 , G01R31/31701 , G01R31/31719 , G01R31/318513 , G11C29/1201 , G11C29/46 , G11C29/80 , G11C29/808 , H01L22/22 , H01L2224/48091 , H01L2224/48227 , H04J2203/0062 , H01L2924/00014
摘要： An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements' addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the re-tested dice, and evaluating the response signals to confirm all repairs.
摘要翻译： 诸如多芯片模块（MCM）的IC模块包括多个IC芯片，每个具有测试模式使能焊盘，例如输出使能焊盘。 集成到MCM基板中的保险丝将每个管芯的测试模式使能接合焊盘连接到MCM的无连接（N / C）引脚之一，并且连接到衬底中的电阻将测试模式使能焊盘连接到MCM的一个接地 针脚。 通过向测试模式施加电源电压，使焊盘通过N / C引脚，在骰子中启动测试模式。 一旦测试完成，保险丝可能会被熔断，并且施加到测试模式的接地电压使得接合焊盘通过接地引脚，使得电阻器禁用骰子中的测试模式并启动操作模式。 因此，封装在IC模块中的裸片可以在封装后进行测试。 一旦测试模式已经启动并且用于修复在测试期间发现的任何故障元件，执行这种测试的方法包括向骰子提供测试信号，从骰子接收响应信号，评估响应信号以识别骰子中的任何故障元件， 使用编程电压将故障元件的地址编程为骰子中的防熔丝，确认通过确定防熔丝的电阻，重新测试骰子，从重新测试的骰子接收响应信号来编程地址， 并评估响应信号以确认所有维修。
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4.发明授权Device and method for testing integrated circuit dice in an integrated circuit module 失效在集成电路模块中测试集成电路芯片的装置和方法公开(公告)号：US06240535B1
公开(公告)日：2001-05-29
申请号：US09097427
申请日：1998-06-15
IPC分类号： G11C2900
CPC分类号： G11C29/785 , G01R31/2884 , G01R31/31701 , G01R31/31719 , G01R31/318513 , G11C29/1201 , G11C29/46 , G11C29/80 , G11C29/808 , H01L22/22 , H01L2224/48091 , H01L2224/48227 , H04J2203/0062 , H01L2924/00014
摘要： An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements' addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the re-tested dice, and evaluating the response signals to confirm all repairs.
摘要翻译： 诸如多芯片模块（MCM）的IC模块包括多个IC芯片，每个具有测试模式使能焊盘，例如输出使能焊盘。 集成到MCM基板中的保险丝将每个管芯的测试模式使能接合焊盘连接到MCM的无连接（N / C）引脚之一，并且连接到衬底中的电阻将测试模式使能焊盘连接到MCM的一个接地 针脚。 通过向测试模式施加电源电压，使焊盘通过N / C引脚，在骰子中启动测试模式。 一旦测试完成，保险丝可能会被熔断，并且施加到测试模式的接地电压使得接合焊盘通过接地引脚，使得电阻器禁用骰子中的测试模式并启动操作模式。 因此，封装在IC模块中的裸片可以在封装后进行测试。 一旦测试模式已经启动并且用于修复在测试期间发现的任何故障元件，执行这种测试的方法包括向骰子提供测试信号，从骰子接收响应信号，评估响应信号以识别骰子中的任何故障元件， 使用编程电压将故障元件的地址编程为骰子中的防熔丝，确认通过确定防熔丝的电阻，重新测试骰子，从重新测试的骰子接收响应信号来编程地址， 并评估响应信号以确认所有维修。
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公开(公告)号：US20110274385A1
公开(公告)日：2011-11-10
申请号：US13101228
申请日：2011-05-05
申请人： Eric S. NELSON
发明人： Eric S. NELSON
CPC分类号： F16C33/546 , F16C19/30
摘要： The axial roller bearing cage has an inner ring, an outer ring, and a plurality of alternating cage bars and roller pockets, which are formed between the inner ring and the outer ring. The roller pockets of the axial roller bearing cage extend along the entire length of the cage bars, accommodating rollers of maximum length, which also enables a compact cage design for a given roller length. The cage enhances the friction characteristics between the ends of the rollers and the cage bars. The ends of the rollers are supported on a centerline, which reduces frictional torque by reducing the length of the frictional moment arm on each roller, allowing for a symmetric loading. The ends of the rollers are also supported by the inboard smooth surface of the formed flanges of the connecting elements, which increases oil film development and allows the bearing to operate at higher speeds.
摘要翻译： 轴向滚子轴承保持架具有形成在内圈和外圈之间的内圈，外圈和多个交替的保持架杆和滚子袋。 轴向滚子轴承保持架的滚子槽沿着保持架的整个长度延伸，容纳最大长度的滚轮，这也可以为给定的滚筒长度提供紧凑的保持架设计。 保持架增强了滚子端部和保持架杆之间的摩擦特性。 辊的端部支撑在中心线上，通过减小每个辊上的摩擦力矩臂的长度来减小摩擦力矩，允许对称加载。 辊的端部也由连接元件的形成的凸缘的内侧光滑表面支撑，这增加了油膜显影并允许轴承以更高的速度运行。
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6.发明授权Device and method for testing integrated circuit dice in an integrated circuit module 失效在集成电路模块中测试集成电路芯片的装置和方法公开(公告)号：US07519881B2
公开(公告)日：2009-04-14
申请号：US11389874
申请日：2006-03-27
IPC分类号： G01R31/28
CPC分类号： G11C29/785 , G01R31/2884 , G01R31/31701 , G01R31/31719 , G01R31/318513 , G11C29/1201 , G11C29/46 , G11C29/80 , G11C29/808 , H01L22/22 , H01L2224/48091 , H01L2224/48227 , H04J2203/0062 , H01L2924/00014
摘要： An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.
摘要翻译： 诸如多芯片模块（MCM）的IC模块包括多个IC芯片，每个具有测试模式使能焊盘，例如输出使能焊盘。 集成到MCM基板中的保险丝将每个管芯的测试模式使能接合焊盘连接到MCM的无连接（N / C）引脚之一，并且连接到衬底中的电阻将测试模式使能焊盘连接到MCM的一个接地 针脚。 通过向测试模式施加电源电压，使焊盘通过N / C引脚，在骰子中启动测试模式。 一旦测试完成，保险丝可能会被熔断，并且施加到测试模式的接地电压使得接合焊盘通过接地引脚，使得电阻器禁用骰子中的测试模式并启动操作模式。 因此，封装在IC模块中的裸片可以在封装后进行测试。
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公开(公告)号：US5154444A
公开(公告)日：1992-10-13
申请号：US680837
申请日：1991-04-05
申请人： Eric S. Nelson
发明人： Eric S. Nelson
IPC分类号： B60R21/2165
CPC分类号： B60R21/2165 , B60R2021/21652
摘要： A cover assembly for an air bag restraint system has a smooth outer skin with a backing layer of foam located between the outer skin cover and a retainer member. The retainer member is located above the outlet of an air bag casing and includes a plurality of flaps therein each having a pointed end located in a hidden position beneath the foam and outer skin cover and at a point generally centrally of the outlet of the casing. Each of the flaps is connected to the retainer member by integral hinge segments in the retainer member. When the air bag is inflated, it will cause the segments to pivot outwardly about the hinge segments to pierce both the foam layer and the outer skin and peel them apart so as to form a multi-sided opening through the cover assembly for deployment of the air bag.
摘要翻译： 用于气囊约束系统的盖组件具有光滑的外表皮，其具有位于外表皮罩和保持构件之间的泡沫背衬层。 保持器构件位于气囊壳体的出口上方，并且包括多个翼片，每个翼片具有位于泡沫和外蒙皮罩下面的隐藏位置的尖端，并且在壳体的出口的大致中心的点处。 每个翼片通过保持构件中的整体铰链节段连接到保持器构件。 当气囊膨胀时，它将使得节段围绕铰链段向外枢转以刺穿泡沫层和外皮，并将它们分开，以便形成通过盖组件的多侧开口，用于部署 气囊
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8.发明授权Device and method for testing integrated circuit dice in an integrated circuit module 失效在集成电路模块中测试集成电路芯片的装置和方法公开(公告)号：US07730372B2
公开(公告)日：2010-06-01
申请号：US12233334
申请日：2008-09-18
IPC分类号： G01R31/28
CPC分类号： G11C29/785 , G01R31/2884 , G01R31/31701 , G01R31/31719 , G01R31/318513 , G11C29/1201 , G11C29/46 , G11C29/80 , G11C29/808 , H01L22/22 , H01L2224/48091 , H01L2224/48227 , H04J2203/0062 , H01L2924/00014
摘要： An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.
摘要翻译： 诸如多芯片模块（MCM）的IC模块包括多个IC芯片，每个具有测试模式使能焊盘，例如输出使能焊盘。 集成到MCM基板中的保险丝将每个管芯的测试模式使能接合焊盘连接到MCM的无连接（N / C）引脚之一，并且连接到衬底中的电阻将测试模式使能焊盘连接到MCM的一个接地 针脚。 通过向测试模式施加电源电压，使焊盘通过N / C引脚，在骰子中启动测试模式。 一旦测试完成，保险丝可能会被熔断，并且施加到测试模式的接地电压使得接合焊盘通过接地引脚，使得电阻器禁用骰子中的测试模式并启动操作模式。 因此，封装在IC模块中的裸片可以在封装后进行测试。
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9.发明授权Device and method for testing integrated circuit dice in an integrated circuit module 有权在集成电路模块中测试集成电路芯片的装置和方法公开(公告)号：US06605956B2
公开(公告)日：2003-08-12
申请号：US09797368
申请日：2001-03-01
IPC分类号： G01R3128
CPC分类号： G11C29/785 , G01R31/2884 , G01R31/31701 , G01R31/31719 , G01R31/318513 , G11C29/1201 , G11C29/46 , G11C29/80 , G11C29/808 , H01L22/22 , H01L2224/48091 , H01L2224/48227 , H04J2203/0062 , H01L2924/00014
摘要： An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements' addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the retested dice, and evaluating the response signals to confirm all repairs.
摘要翻译： 诸如多芯片模块（MCM）的IC模块包括多个IC芯片，每个具有测试模式使能焊盘，例如输出使能焊盘。 集成到MCM基板中的保险丝将每个管芯的测试模式使能接合焊盘连接到MCM的无连接（N / C）引脚之一，并且连接到衬底中的电阻将测试模式使能焊盘连接到MCM的一个接地 针脚。 通过向测试模式施加电源电压，使焊盘通过N / C引脚，在骰子中启动测试模式。 一旦测试完成，保险丝可能会被熔断，并且施加到测试模式的接地电压使得接合焊盘通过接地引脚，使得电阻器禁用骰子中的测试模式并启动操作模式。 因此，封装在IC模块中的裸片可以在封装后进行测试。 一旦测试模式已经启动并且用于修复在测试期间发现的任何故障元件，执行这种测试的方法包括向骰子提供测试信号，从骰子接收响应信号，评估响应信号以识别骰子中的任何故障元件， 使用编程电压将故障元件的地址编程为骰子中的防熔丝，通过确定抗熔丝的电阻，重新测试骰子，接收重新测试的骰子的响应信号，并评估 响应信号确认所有维修。
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10.发明授权Device and method for testing integrated circuit dice in an integrated circuit module 失效在集成电路模块中测试集成电路芯片的装置和方法
公开(公告)号：US5796746A
公开(公告)日：1998-08-18
申请号：US718173
申请日：1996-09-19
IPC分类号： H01L23/12 , G01R31/28 , G11C5/00 , G11C29/00 , G11C29/14 , G11C29/46 , H01L21/66 , H01L25/04 , H01L25/18 , H04Q11/04 , G06F11/00
CPC分类号： H01L22/22 , G11C29/46 , G11C29/785 , G11C29/80 , G11C29/808 , G01R31/2884 , H01L2224/48091 , H04J2203/0062
摘要： An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable pads to one of the MCM's reference voltage pins. By applying a supply voltage to the test mode enable pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a reference voltage applied to the test mode enable pads through the reference voltage pins and the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing, includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the re-tested dice, and evaluating the response signals to confirm all repairs.
摘要翻译： 诸如多芯片模块（MCM）的IC模块包括多个具有测试模式使能接合焊盘（例如输出使能焊盘）的IC芯片。 集成到MCM基板中的保险丝将每个管芯的测试模式使能焊盘连接到MCM的无连接（N / C）引脚之一，并且将衬底中的电阻连接到测试模式使能焊盘，将MCM的参考电压引脚 。 通过向测试模式使能焊盘通过N / C引脚施加电源电压，在骰子中启动测试模式。 一旦测试完成，保险丝可能会被熔断，并且施加到测试模式的参考电压使得焊盘能够通过参考电压引脚，并且电阻器将禁用骰子中的测试模式并启动操作模式。 因此，封装在IC模块中的裸片可以在封装后进行测试。 一旦测试模式被启动并且用于修复在测试期间发现的任何故障元件，执行这种测试的方法包括向骰子提供测试信号，从骰子接收响应信号，评估响应信号以识别骰子中的任何故障元件 将故障元件地址编程为具有编程电压的骰子中的抗熔丝，通过确定反熔丝的电阻，重新测试骰子，从重新测试的骰子接收响应信号来确认地址被编程， 并评估响应信号以确认所有维修。
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