Method of manufacturing a semiconductor device with a pn junction
provided through epitaxy
    1.
    发明授权
    Method of manufacturing a semiconductor device with a pn junction provided through epitaxy 失效
    通过外延生产具有pn结的半导体器件的方法

    公开(公告)号:US5915187A

    公开(公告)日:1999-06-22

    申请号:US768482

    申请日:1996-12-18

    摘要: The invention relates to a method of manufacturing a semiconductor device with a pn junction, whereby an epitaxial layer (2) with a first zone (3) of a first conductivity type and with a second zone (4) of a second conductivity type opposed to the first is provided on a silicon substrate (1), a pn junction (5) being formed between the second and first zones (3, 4, respectively). According to the invention, the method is characterized in that the epitaxial layer (2) is provided by means of a CVD process at a temperature below 800.degree. C., the epitaxial layer (2) being provided in that first the first zone (3) and then the second zone (4) are epitaxially provided on the substrate (1), while no heat treatments at temperatures above 800.degree. C. take place after the epitaxial layer (2) has been provided. The measure according to the invention renders it possible to achieve properties of semiconductor devices manufactured in accordance with the invention, for example the capacitance-voltage (CV) relation of varicap diodes, within wide limits according to specifications. In addition, semiconductor devices manufactured by the method according to the invention require no post-diffusion or measurement steps in order to bring the properties of the semiconductor device up to specifications.

    摘要翻译: 本发明涉及制造具有pn结的半导体器件的方法,由此具有第一导电类型的第一区(3)和与第二导电类型相反的第二导电类型的第二区(4)的外延层(2) 第一设置在硅衬底(1)上,pn结(5)分别形成在第二区和第一区之间(3,4)。 根据本发明,该方法的特征在于外延层(2)通过CVD工艺在低于800℃的温度下提供,外延层(2)设置在第一区域(3) ),然后第二区(4)外延地设置在基板(1)上,而在提供了外延层(2)之后,在高于800℃的温度下不进行热处理。 根据本发明的措施使得可以根据本发明制造的半导体器件的性质,例如变容二极管的电容 - 电压(CV)关系在根据规格的宽范围内。 此外,通过根据本发明的方法制造的半导体器件不需要后扩散或测量步骤,以使半导体器件的性能达到规格。

    Semiconductor device having an insulating substrate and Schottky diodes
    3.
    发明授权
    Semiconductor device having an insulating substrate and Schottky diodes 失效
    具有绝缘衬底和肖特基二极管的半导体器件

    公开(公告)号:US5336905A

    公开(公告)日:1994-08-09

    申请号:US907423

    申请日:1992-07-01

    摘要: Semiconductor device and method of manufacturing same, display device and support plate for same provided with such a semiconductor device. A semiconductor device having an insulating substrate on which a Schottky diode is formed between a metal layer and a semiconductor layer of polycrystalline or amorphous silicon extending over the metal layer is used inter alia in matrix display devices, such as LCDs. The Schottky diode forms part of a switching element of such a device and must have a low reverse current up to a reverse voltage of, for example, approximately 10 V. The known semiconductor device having Schottky diodes, in which the semiconductor material extends over a lateral surface of the Schottky metal, is found not to comply with this requirement. To overcome this deficiency a low leakage current is realized over a wide reverse voltage range due to the presence of a dielectric on the lateral surface of the Schottky metal. The dielectric suppresses the leakage current issuing from the lateral surface. Preferably, the dielectric includes an oxide of the Schottky metal. This may be readily formed through local oxidation, for example, by means of an oxygen plasma.

    摘要翻译: 半导体装置及其制造方法,提供有这种半导体装置的显示装置和支撑板。 具有绝缘衬底的半导体器件,其中在金属层和在金属层之上延伸的多晶或非晶硅的半导体层之间形成有肖特基二极管的绝缘衬底尤其用于诸如LCD的矩阵显示器件中。 肖特基二极管构成这种器件的开关元件的一部分,并且必须具有高达例如约10V的反向电压的低反向电流。具有肖特基二极管的已知半导体器件,其中半导体材料在 发现肖特基金属的侧表面不符合这一要求。 为了克服这种缺陷,由于在肖特基金属的侧表面上存在电介质,因此在宽的反向电压范围内实现了低的漏电流。 电介质抑制从侧面发出的漏电流。 优选地,电介质包括肖特基金属的氧化物。 这可以通过局部氧化容易地形成,例如通过氧等离子体形成。

    Method of manufacturing a varicap diode, a varicap diode, a receiver
device, and a TV receiver set
    6.
    发明授权
    Method of manufacturing a varicap diode, a varicap diode, a receiver device, and a TV receiver set 失效
    制造变容二极管,变容二极管,接收器装置和电视接收机组的方法

    公开(公告)号:US5854117A

    公开(公告)日:1998-12-29

    申请号:US715059

    申请日:1996-09-17

    CPC分类号: H01L29/66174 H01L29/93

    摘要: The invention relates to a method of manufacturing a varicap diode whereby a silicon substrate with an epitaxial layer of a first conductivity type is provided with a first zone through the provision of dopant atoms of a first conductivity type in the epitaxial layer and is provided with a second zone adjoining a surface of the epitaxial layer through the provision of dopant atoms of a second conductivity type opposed to the first in the epitaxial layer, a pn junction being formed between the second zone and the first zone. According to the invention, the method is characterized in that the second zone is provided in that a layer of polycrystalline silicon provided with dopant atoms of the second conductivity type is provided on the surface, and in that the dopant atoms are diffused from this layer into the epitaxial layer, whereby a pn junction is formed at a distance of less than 0.3 .mu.m from the polycrystalline silicon. The measure according to the invention leads to the manufacture of a varicap diode with a pn junction which shows a wide variation in capacitance of the depleted region around the pn junction for a comparatively small variation in reverse voltage across the pn junction.

    摘要翻译: 本发明涉及制造变容二极管的方法,其中具有第一导电类型的外延层的硅衬底通过在外延层中提供第一导电类型的掺杂剂原子而设置有第一区,并且设置有 第二区,通过提供与外延层中的第一导电类型相对的第二导电类型的掺杂剂原子邻接外延层的表面,在第二区和第一区之间形成pn结。 根据本发明,该方法的特征在于,第二区域的特征在于,在表面上提供了设置有第二导电类型的掺杂剂原子的多晶硅层,并且掺杂剂原子从该层扩散到 外延层,由此在与多晶硅相距0.3μm的距离处形成pn结。 根据本发明的措施导致制造具有pn结的变容二极管,其在pn结周围的反向电压的相对小的变化中显示出在pn结周围的耗尽区的电容的宽的变化。