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8 条记录 (耗时 0.018 秒)

    Component for use in forming printed circuit boards
    1.
    发明申请
    Component for use in forming printed circuit boards 审中-公开
    用于形成印刷电路板的组件

    公开(公告)号：US20020020549A1

    公开(公告)日：2002-02-21

    申请号：US09826623

    申请日：2001-04-05

    申请人： GA-TEK Inc. (dba Gould Electronics Inc.)

    发明人： Michael A. Centanni ,  Mark Kusner

    IPC分类号： H05K001/02

    CPC分类号： H05K3/388 ,  H05K3/025 ,  H05K3/4611

    摘要： A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element. The component is comprised of a film substrate formed of a first polymeric material having a first side and a second side. At least one layer of a tiecoat metal is applied to the first side of the film substrate. At least one layer of copper on the at least one layer of a tiecoat metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of tiecoat metal. A plurality of spaced apart, adhesion promoting areas of a tiecoat metal are provided on the second side of the film substrate defining regions of exposed polymeric material on the second side of the film substrate.

    摘要翻译： 用于制造印刷电路的部件，其在成品印刷电路中构成功能元件。 该部件由具有第一侧面和第二侧面的第一聚合物材料形成的薄膜基底构成。 将至少一层涂层金属施加到膜基材的第一侧。 至少一层铜层，在所述至少一层涂层金属上，所述铜层具有基本上未受污染的暴露表面，其背离所述至少一层粘结金属层。 在薄膜基材的第二面上设置多个间隔开的粘合促进区域，该膜基材在薄膜基材的第二面上限定暴露的聚合物材料的区域。

    Packaging for fiber optic device
    3.
    发明申请
    Packaging for fiber optic device 审中-公开
    光纤设备包装

    公开(公告)号：US20020071637A1

    公开(公告)日：2002-06-13

    申请号：US09734260

    申请日：2000-12-11

    申请人： GA-TEK Inc. (dba Gould Electronics Inc.)

    发明人： Michael A. Centanni ,  Mark Kusner

    IPC分类号： G02B006/36

    CPC分类号： G02B6/2558 ,  G02B6/2821 ,  G02B6/36

    摘要： A package for a fiber optic device or fiber optic component having at least one optical fiber extending therefrom. The package is comprised of a support substrate for supporting the optical device or optic component, the support substrate having at least one optical fiber extending therefrom. A housing surrounds the substrate and has an opening at one end. At least one optical fiber extends through the opening. A layer of metal seals the opening of each end of the tube and the glass fiber cladding where the optical fiber extends through the layer of metal.

    摘要翻译： 一种用于光纤器件或光纤部件的封装，其具有从其延伸的至少一根光纤。 该封装由用于支撑光学器件或光学元件的支撑衬底组成，支撑衬底具有从其延伸的至少一根光纤。 壳体围绕基底并且在一端具有开口。 至少一根光纤延伸穿过开口。 一层金属密封了管的每个端部的开口和玻璃纤维包层，其中光纤延伸穿过金属层。

    Corrosion prevention for CAC component
    5.
    发明申请
    Corrosion prevention for CAC component 失效
    CAC组件的防腐蚀

    公开(公告)号：US20020119342A1

    公开(公告)日：2002-08-29

    申请号：US09792717

    申请日：2001-02-23

    申请人： GA-TEK Inc. (dba Gould Electronics Inc.)

    发明人： R. Richard Steiner

    IPC分类号： B32B015/08

    CPC分类号： B32B15/08 ,  B32B15/20 ,  H05K3/025 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/1275 ,  Y10T428/12903 ,  Y10T428/24777 ,  Y10T428/31663

    摘要： A component for use in manufacturing articles such as printed circuit boards, the component comprising: a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element; a substrate sheet of aluminum which constitutes a discardable element, and a protective coating layer on a surface of said substrate, one surface of the copper sheet and the coating layer on said substrate aluminum sheet being essentially uncontaminated and engageable with each other at an interface, and the uncontaminated surfaces of the sheets being manufactured together to define a substantially uncontaminated central zone inwardly of the edges of the sheets and unjoined at the interface.

    摘要翻译： 一种用于制造诸如印刷电路板的制品的部件，所述部件包括：在成品印刷电路板中构成功能元件的铜箔片; 构成可废弃元件的铝基板，以及在所述基板的表面上的保护涂层，所述铜板的一个表面和所述基板铝板上的涂层基本上未被污染并且在界面处彼此接合， 并且片材的未受污染的表面一起制造以在片材的边缘的内侧限定基本上未受污染的中心区域，并且在界面处未连接。