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    PROCESS FOR MAKING CONTAINED LAYERS AND DEVICES MADE WITH SAME
    4.
    发明申请
    PROCESS FOR MAKING CONTAINED LAYERS AND DEVICES MADE WITH SAME 审中-公开
    用于制造包含层的工艺和与其相同的器件

    公开(公告)号：US20110260137A1

    公开(公告)日：2011-10-27

    申请号：US12764490

    申请日：2010-04-21

    Applicant: Daniel David Lecloux ,  Eric Maurice Smith ,  Gary A. Johansson

    Inventor： Daniel David Lecloux ,  Eric Maurice Smith ,  Gary A. Johansson

    IPC: H01L51/00 ,  H01L21/20

    CPC classification number: H01L51/0003 ,  H01L51/56

    Abstract: There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy; forming an intermediate layer over and in direct contact with the first layer, said intermediate layer having a second surface energy which is lower than the first surface energy; removing selected portions of the intermediate layer to form a pattern comprising uncovered areas of the first layer and covered areas of the first layer; and forming a contained second layer over the uncovered areas of the first layer. There is also provided an organic electronic device made by the process.

    Abstract translation: 提供了一种用于在第一层上形成包含的第二层的方法，包括以下步骤：形成具有第一表面能的第一层; 在所述第一层上形成中间层并与其直接接触，所述中间层具有低于所述第一表面能的第二表面能; 去除所述中间层的所选部分以形成包括所述第一层的未覆盖区域和所述第一层的被覆盖区域的图案; 以及在所述第一层的未覆盖区域上形成包含的第二层。 还提供了通过该方法制造的有机电子装置。

    Method for preventing adhesive bleed onto surfaces
    6.
    发明授权
    Method for preventing adhesive bleed onto surfaces 失效
    防止粘合剂渗透到表面上的方法

    公开(公告)号：US06420253B2

    公开(公告)日：2002-07-16

    申请号：US09881466

    申请日：2001-06-14

    Applicant: Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    Inventor： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    IPC: H01L2144

    CPC classification number: B82Y30/00 ,  B82Y10/00 ,  H01L21/4864 ,  H01L23/49894 ,  H01L24/80 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14

    Abstract: A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface. The hydrocarbon segment presents a surface on the noble metal that has the characteristics of the hydrocarbon portion of the molecule which has a low surface tension, and, thus, prevents wetting of the noble metal by an epoxy adhesive component. The SAMs, once they provide protection from the bleed of the die attach adhesives, self desorb during the wire bonding or soldering temperatures.

    Abstract translation: 提供了一种方法和结构，用于当将I / C芯片附接到基板时，防止粘合剂（例如环氧树脂）在电介质基板的表面上的贵金属引线接合焊盘上的润湿或渗出。 该方法包括用化学成分处理引线接合焊盘，该化学组合物防止由环氧树脂的部件渗透到引线接合焊盘的表面上。 化学成分是一种在金表面提供“自组装单层”（SAM）的化学成分。 这些组合物的特征在于具有连接到烃部分如（CH 2）x链的至少一个基团的硫醇或二硫化物的分子。 与贵金属化学键合的分子的硫醇或含硫部分的亲和性提供了分子与金属表面相对较强的附着。 碳氢化合物段在贵金属上呈现具有低分子表面张力的分子的特征的表面，从而防止了环氧粘合剂组分对贵金属的润湿。 SAMs一旦提供防止裸片附着胶粘剂的泄漏，在引线接合或焊接温度期间自解吸。

    High optical contrast resin composition and electronic package utilizing same
    7.
    发明授权
    High optical contrast resin composition and electronic package utilizing same 失效
    高光学造影树脂组合物和使用其的电子封装

    公开(公告)号：US06190759B1

    公开(公告)日：2001-02-20

    申请号：US09025513

    申请日：1998-02-18

    Applicant: Gary A. Johansson ,  Konstantinos I. Papathomas

    Inventor： Gary A. Johansson ,  Konstantinos I. Papathomas

    IPC: B32B300

    CPC classification number: H05K1/0269 ,  H05K1/0373 ,  H05K3/4644 ,  H05K2203/161 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31522

    Abstract: A composition for use in making high optical contrast and UV light fluorescing dielectric material usuable in printed circuit boards, which in turn may form part of an electronic package. The composition comprises a resin, a coloring agent, and a fluorescing agent. A dielectric material is also defined that comprises a reinforcing material combined with the composition, the dielectric material forming at least one layer in combination with at least one conductive layer for the electronic package.

    Abstract translation: 用于制造印刷电路板中使用的高光学对比度和UV光荧光介质材料的组合物，其可以形成电子封装的一部分。 组合物包含树脂，着色剂和荧光剂。 还定义了一种电介质材料，其包括与该组合物组合的增强材料，该电介质材料与用于电子封装的至少一个导电层组合形成至少一层。

    Hole transport materials
    9.
    发明授权
    Hole transport materials 有权
    空孔运输材料

    公开(公告)号：US09012037B2

    公开(公告)日：2015-04-21

    申请号：US12129729

    申请日：2008-05-30

    Applicant: Gary A. Johansson ,  Eric Maurice Smith ,  Daniel David Lecloux

    Inventor： Gary A. Johansson ,  Eric Maurice Smith ,  Daniel David Lecloux

    IPC: H01L51/52 ,  C07C211/57 ,  C07C211/54 ,  C07C211/58 ,  H01L51/00

    CPC classification number: C07C211/58 ,  C07C211/54 ,  H01L51/001 ,  H01L51/0035 ,  H01L51/0059 ,  H01L51/006

    Abstract: There is provided a hole transport compound having Formula I or Formula II: Ar1 is the same or different at each occurrence and can be phenylene, naphthylene, or binaphthylene. Ar2 is the same or different at each occurrence and can be phenyl, biphenyl, terphenyl, naphthyl, or binaphthyl. m and n are the same or different and are an integer greater than 0. T is the same or different at each occurrence and is a conjugated moiety including at least one triarylamino group. The T moiety is connected in a non-planar configuration.

    Abstract translation: 提供具有式I或式II的空穴传输化合物：Ar1在每次出现时相同或不同，可以是亚苯基，亚萘基或亚萘基。 Ar2在每次出现时相同或不同，可以是苯基，联苯基，三联苯基，萘基或联萘。 m和n相同或不同，为大于0的整数.T在每次出现时相同或不同，为包含至少一个三芳基氨基的共轭部分。 T部分以非平面构型连接。

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