Heating resistor film, recording head substrate, recording head, and recording apparatus
    3.
    发明授权
    Heating resistor film, recording head substrate, recording head, and recording apparatus 有权
    加热电阻膜,记录头基板,记录头和记录装置

    公开(公告)号:US06964471B2

    公开(公告)日:2005-11-15

    申请号:US10270527

    申请日:2002-10-16

    IPC分类号: B41J2/05 B41J2/14 H01C7/00

    CPC分类号: B41J2/14129 B41J2202/03

    摘要: To provide a heating resistor film having a sufficiently high durability to repetitive pulse applications, a recording head substrate including the heating resistor film, a recording head, and a recording apparatus. A heating resistor film that generates heat energy using currents flowing from a wire in a heat acting portion of a recording head substrate, is made of amorphous tantalum silicon nitride having a sheet resistance of 200 Ω/□ to 400 Ω/□, and has a thickness of 30 nm to 80 nm.

    摘要翻译: 为了提供对重复脉冲应用具有足够高的耐久性的加热电阻膜,包括加热电阻膜,记录头和记录装置的记录头基板。 使用从记录头基板的热作用部分中的线流动的电流产生热能的加热电阻膜由具有200Ω/□至400Ω/□的薄层电阻的非晶态氮化钽氮化硅制成,并且具有 厚度为30nm至80nm。

    Structure provided with through hole, method of manufacture therefor, and liquid discharge head
    4.
    发明授权
    Structure provided with through hole, method of manufacture therefor, and liquid discharge head 有权
    具有通孔的结构,制造方法和排液头

    公开(公告)号:US06799839B2

    公开(公告)日:2004-10-05

    申请号:US10273336

    申请日:2002-10-18

    IPC分类号: B41J205

    摘要: A structure having a base plate, such as silicon, provided with a through hole makes it possible to curtail the process numbers at the time of manufacture, while enhancing the reliability thereof. When the through hole is provided by anisotropic etching from the backside of the base plate, a silicon nitride film, which becomes membrane on the surface side of the base plate is formed so as not to allow etching solution from leaking to the surface side of the base plate. It is preferable to form the silicon nitride film using plasma CVD method to make the inner stress of the silicon nitride film a compression stress of 3×108 Pa or less.

    摘要翻译: 具有通孔的具有硅的基板的结构使得可以在制造时缩短处理次数,同时提高其可靠性。 当从基板的背面通过各向异性蚀刻提供通孔时,形成在基板的表面侧成为膜的氮化硅膜,以便不使蚀刻溶液泄漏到基板的表面侧 底盘。 优选使用等离子体CVD法形成氮化硅膜,以使氮化硅膜的内应力为3×10 8 Pa以下的压缩应力。

    Solid-state imaging apparatus
    9.
    发明授权
    Solid-state imaging apparatus 有权
    固态成像装置

    公开(公告)号:US09000343B2

    公开(公告)日:2015-04-07

    申请号:US13807002

    申请日:2011-06-23

    IPC分类号: H01L27/146 H01L31/00

    摘要: The present invention relates to a solid-state imaging apparatus including a first substrate having a plurality of photoelectric conversion units and a second substrate having a plurality of readout circuits. The first substrate is provided with a plurality of first conductive patterns that are electrically separated from one another and the second substrate is provided with a plurality of second conductive patterns that are electrically separated from one another. The first conductive patterns each include a first partial pattern extending in a first direction. The second conductive patterns each include a partial pattern extending in a second direction different from the first direction. The first partial pattern has a length extending in the first direction longer than a length thereof in the second direction.

    摘要翻译: 固态摄像装置技术领域本发明涉及具有多个光电转换单元的第一基板和具有多个读出电路的第二基板的固体摄像装置。 第一基板设置有彼此电分离的多个第一导电图案,并且第二基板设置有彼此电分离的多个第二导电图案。 第一导电图案各自包括沿第一方向延伸的第一部分图案。 第二导电图案各自包括沿与第一方向不同的第二方向延伸的部分图案。 第一部分图案具有在第一方向上比第二方向上的长度长的长度。