Plasma processing method and plasma processing apparatus
    3.
    发明申请
    Plasma processing method and plasma processing apparatus 有权
    等离子体处理方法和等离子体处理装置

    公开(公告)号:US20060171093A1

    公开(公告)日:2006-08-03

    申请号:US11069551

    申请日:2005-03-02

    IPC分类号: H01H1/00

    摘要: In a plasma processing apparatus using electrostatic chuck, increase of plasma potential is prevented and abnormal discharge is avoided. The plasma processing apparatus comprises an RF source for generating plasma in a vacuum container, another RF source for applying an RF bias power to a sample, a sample stage having an electrostatic chuck electrode, a DC power supply for applying an electrostatic chuck voltage to the electrode, and a controller for shifting the electrostatic chuck voltage to negative by a potential difference of quarter to half of peak-to-peak voltage of the RF bias power for suppressing increase of plasma potential.

    摘要翻译: 在使用静电卡盘的等离子体处理装置中,防止等离子体电位的增加,避免异常放电。 等离子体处理装置包括用于在真空容器中产生等离子体的RF源,用于向样品施加RF偏置功率的另一RF源,具有静电卡盘电极的样品台,用于向静电卡盘电压施加静电卡盘电压的DC电源 电极,以及控制器,用于将静电卡盘电压转换为负值,以抑制RF偏置功率的峰 - 峰电压的四分之一到一半的电位差,以抑制等离子体电位的增加。

    OVERCHARGE PROTECTION CIRCUIT, BATTERY PACK, AND CHARGING SYSTEM
    7.
    发明申请
    OVERCHARGE PROTECTION CIRCUIT, BATTERY PACK, AND CHARGING SYSTEM 审中-公开
    超大型保护电路,电池组和充电系统

    公开(公告)号:US20110156656A1

    公开(公告)日:2011-06-30

    申请号:US13000565

    申请日:2009-11-17

    申请人: Go Saito

    发明人: Go Saito

    IPC分类号: H02J7/04

    CPC分类号: H02J7/0031 H02J2007/0037

    摘要: An overcharge protection circuit includes: a voltage detection portion which detects a terminal voltage of a secondary battery; and a control portion, having a normal state in which the secondary battery can be charged, a judgment execution state in which judgement as to whether the secondary battery is in an overcharged state is performed, and a first charging prohibition state in which charging of the secondary battery is prohibited, wherein in the normal state, when a terminal voltage detected by the voltage detection portion exceeds a first overcharge detection voltage set in advance as a voltage at which charging of the secondary battery is to be prohibited, the control portion transitions to the judgment execution state, in the judgment execution state, when an accumulated value, after the judgment execution state is established, of a time interval during which the terminal voltage detected by the voltage detection portion exceeds the first overcharge detection voltage, exceeds a first reference time set in advance, the control portion transitions to the first charging prohibition state, and in the judgment execution state, when the terminal voltage detected by the voltage detection portion falls below a judgment cancellation voltage lower than the first overcharge detection voltage, the control portion transitions to the normal state and enables charging of the secondary battery.

    摘要翻译: 过充电保护电路包括:检测二次电池的端子电压的电压检测部; 以及具有二次电池可以充电的正常状态的控制部分执行关于二次电池是否处于过充电状态的判断的判断执行状态,以及第二充电禁止状态, 禁止二次电池,其中在正常状态下,当由电压检测部分检测到的端电压超过预先设定的第二过充电检测电压作为要禁止二次电池的充电的电压时,控制部分转变为 判断执行状态在判断执行状态下,当在判定执行状态被建立之后,在电压检测部分检测到的端子电压超过第一过充电检测电压的时间间隔内的累加值超过第一参考值 预先设定的时间,控制部分转变到第一充电禁止状态,并在判断中 在由电压检测部检测到的端子电压低于低于第一过充电检测电压的判定抵消电压的情况下,控制部转变为正常状态,能够对二次电池进行充电。

    METHOD OF SEMICONDUCTOR PROCESSING
    9.
    发明申请
    METHOD OF SEMICONDUCTOR PROCESSING 失效
    半导体加工方法

    公开(公告)号:US20090325388A1

    公开(公告)日:2009-12-31

    申请号:US12198222

    申请日:2008-08-26

    申请人: Tetsuo Ono Go Saito

    发明人: Tetsuo Ono Go Saito

    IPC分类号: H01L21/302

    摘要: In a semiconductor that has a structure in which a work function controlling metal conductor is provided on a high dielectric insulation film, fine processing is performed without deteriorating a device. In a method of semiconductor processing, in which the semiconductor has an insulation film containing Hf or Zr formed on a semiconductor substrate and a conductor film containing Ti or Ta or Ru formed on an insulation film, and the conductor film is processed by using a resist formed on the conductor film under a plasma atmosphere, the resist is removed under the plasma atmosphere of gas that contains hydrogen and does not contain oxygen.

    摘要翻译: 在具有在高介电绝缘膜上设置功函数控制金属导体的结构的半导体中,进行精细处理而不会使器件恶化。 在半导体处理方法中,其中半导体具有包含在半导体衬底上形成的Hf或Zr的绝缘膜和在绝缘膜上形成的含有Ti或Ta或Ru的导体膜,并且通过使用抗蚀剂来处理导体膜 在等离子体气氛下在导体膜上形成,在含氢气体的等离子体气氛下除去抗蚀剂,不含氧。

    Plasma processing method and plasma processing apparatus
    10.
    发明授权
    Plasma processing method and plasma processing apparatus 有权
    等离子体处理方法和等离子体处理装置

    公开(公告)号:US07224568B2

    公开(公告)日:2007-05-29

    申请号:US11069551

    申请日:2005-03-02

    IPC分类号: H01L21/683

    摘要: In a plasma processing apparatus using electrostatic chuck, increase of plasma potential is prevented and abnormal discharge is avoided. The plasma processing apparatus comprises an RF source for generating plasma in a vacuum container, another RF source for applying an RF bias power to a sample, a sample stage having an electrostatic chuck electrode, a DC power supply for applying an electrostatic chuck voltage to the electrode, and a controller for shifting the electrostatic chuck voltage to negative by a potential difference of quarter to half of peak-to-peak voltage of the RF bias power for suppressing increase of plasma potential.

    摘要翻译: 在使用静电卡盘的等离子体处理装置中,防止等离子体电位的增加,避免异常放电。 等离子体处理装置包括用于在真空容器中产生等离子体的RF源,用于向样品施加RF偏置功率的另一RF源,具有静电卡盘电极的样品台,用于向静电卡盘电压施加静电卡盘电压的DC电源 电极,以及控制器,用于将静电卡盘电压转换为负值,以抑制RF偏置功率的峰 - 峰电压的四分之一到一半的电位差,以抑制等离子体电位的增加。