公开(公告)号：US20150084170A1

公开(公告)日：2015-03-26

申请号：US14493379

申请日：2014-09-23

申请人： Hohyeuk IM ,  JONGKOOK KIM ,  Gowoon SEONG ,  SeokWon LEE ,  BYOUNGWOOK JANG ,  EUNSEOK CHO

发明人： Hohyeuk IM ,  JONGKOOK KIM ,  Gowoon SEONG ,  SeokWon LEE ,  BYOUNGWOOK JANG ,  EUNSEOK CHO

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1438 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599

摘要： Provided is a semiconductor package including a lower package, an interposer on the lower package, and an upper package on the interposer. The lower package may include a lower package substrate, a lower semiconductor chip on the lower package substrate, and a lower heat-transfer layer on the lower semiconductor chip. The interposer may include an interposer substrate, first and second heat-transfer openings defined by recessed bottom and top surfaces, respectively, of the interposer substrate, an upper interposer heat-transfer pad disposed in the second heat-transfer opening, and an upper heat-transfer layer disposed on the upper interposer heat-transfer pad. The upper package may include an upper package substrate, an upper package heat-transfer pad, which may be disposed in a third heat-transfer opening defined by a recessed bottom surface of the upper package substrate, and an upper semiconductor chip disposed on the upper package substrate.

摘要翻译： 提供了一种半导体封装，其包括下封装，下封装上的插入件和插入件上的上封装。 下封装可以包括下封装衬底，下封装衬底上的下半导体芯片和下半导体芯片上的下传热层。 插入器可以包括插入器基板，分别由插入器基板的凹入的底部和顶部表面限定的第一和第二传热开口，设置在第二传热开口中的上插入件传热垫，以及上部热 - 转移层，设置在上部插入件传热垫上。 上封装可以包括上封装衬底，上封装传热垫，其可以设置在由上封装衬底的凹陷底表面限定的第三传热开口中，以及设置在上封装衬底上的上半导体芯片 封装衬底。