摘要:
A MEMS structure includes a generating diaphragm, one or more wave channels, and one or more sensing diaphragm. A method for inertial sensing comprises driving the generating diaphragm to generate an acoustic wave, passing the acoustic wave through a channel in the MEMS structure to the sensing diaphragm, and measuring a relative phase of the wave at the sensing diaphragm to determine acceleration or rotation of the MEMS structure.
摘要:
A method to quantify a plurality of digital data sharing in a multi-threaded execution includes the steps of: providing at least one processor; providing a computer readable non-transitory storage medium including a computer readable multi-threaded executable code and a computer readable executable code to calculate a plurality of shared footprint values and an average shared footprint value; running the multi-threaded executable code on the at least one computer processor; running the computer readable executable code configured to calculate a plurality of shared footprint values and an average shared footprint value; calculating a plurality of shared footprint values by use of a linear-time process for a corresponding plurality of executable windows in time; and calculating and saving an average shared footprint value based on the plurality of shared footprint values to quantify by a metric the data sharing by the multi-threaded execution. A system to perform the method is also described.
摘要:
The invention provides an organosilicon amine electrolyte material containing a polyether chain, which has a wide range of applications, as well as an application of the electrolyte material in a lithium ion battery. The chemical structure thereof is as shown in Formula 1, wherein R1 and R2 are selected from the same or different C1-C10 alkyls; A is a polyether chain segment having the structure of (CH2)nO[(CH2)mO]x(CH2)y, where n and m are integers from 0 to 10, and x is an integer from 1 to 10; R3, R4 and R5 are selected from the same or the different C1-C10 alkyls or alkoxyl groups, or are equivalent to ANR1R2 or —O—SiR6R7R8 in structure; wherein R6, R7 and R8 are C1-C10 alkyls.
摘要:
A MEMS device comprises a proof mass suspended above a substrate, one or more driving combs, and one or more sensing combs. During operation, a DC actuating potential in series with an AC modulation potential is applied to the proof mass, and an AC actuating potential is applied to the one or more driving combs such that the proof mass moves in an oscillatory manner. An inertial sensing system further comprises a sensing element configured to detect a rotation information coupled with an AC signal and an acceleration information coupled with a DC signal.
摘要:
This invention provides a method for reducing the effects of process, supply voltage and temperature variations in integrated circuits and its circuit implementation. The disclosed method builds up a detecting-feedback loop with a plurality of target MOS transistors in main circuits, an induction MOS transistor and a current-to-voltage conversion circuit, and performs a body modulation to effectively reduce the parameter fluctuations of the target MOS transistors in a sub-threshold region or a saturated region due to process, supply voltage and temperature variations. A body-modulated circuit achieves the disclosed method with only a few circuit elements, which effectively improves the stability, reliability and product yield of integrated circuits, especially sub-threshold integrated circuits, without significantly increasing the circuit complexity and power consumption.
摘要:
The methods and compositions described herein are based, in part, on the discovery that the introduction of a disulfide bond into an integrin polypeptide by the substitution of at least one cysteine residue in the polypeptide permits stabilization of the integrin in a “closed/inactive” state. This stabilizing disulfide bond permits integrins to be screened for a candidate molecule that can bind to the closed state. In particular, this approach can be used to screen for agents that bind to the closed state of an integrin polypeptide, and are useful as therapeutic treatments to prevent integrin activation.
摘要:
An integrated line selection apparatus within active matrix arrays is described. The circuit includes multiple gate line drive transistor devices, each gate line drive transistor device having a drain coupled to a gate line of multiple gate lines in a gate line driver circuit coupled to an active matrix array and a source to receive an input signal. The circuit further includes at least one address line transistor device corresponding to each gate line transistor device, each address line transistor device having a drain coupled to a gate of the corresponding gate line drive transistor device and a gate coupled to a corresponding address line, such that by asserting a predetermined combination of voltages on the plurality of address lines, a single gate line of said plurality of gate lines is selected to receive the input signal to be transmitted to a corresponding pixel within the corresponding active matrix array.
摘要:
An aspect of the present invention is a logical arrangement of memory arrays. The logical arrangement includes a plurality of memory arrays deposed in a row-column configuration, a controller coupled to the plurality of memory arrays and at least one power line, at least one sense line and at least one address line coupled to the controller wherein a number of connections from the controller to the at least one power line, the at least one sense line and the at least one address line is minimized.
摘要:
An assembly of metallic MEMS structures directly fabricated on planarized CMOS substrates, containing the application-specific integrated circuit (ASIC), by direct deposition and subsequent microfabrication steps on the ASIC interconnect layers, with integrated capping for packaging, is provided. The MEMS structures comprise at least one MEMS device element, with or without moveable parts anchored on the CMOS ASIC wafer with electrical contact provided via the metallic interconnects of the ASIC. The MEMS structures can also be made of metallic alloys, conductive oxides and amorphous semiconductors. The integrated capping, which provides a sealed cavity, is accomplished through bonding pads defined in the post-processing of the CMOS substrate.