Process for forming dielectric films
    1.
    发明授权
    Process for forming dielectric films 有权
    电介质膜形成工艺

    公开(公告)号:US08012822B2

    公开(公告)日:2011-09-06

    申请号:US12342360

    申请日:2008-12-23

    IPC分类号: H01L29/72

    摘要: A process for forming dielectric films containing at least metal atoms, silicon atoms, and oxygen atoms on a silicon substrate comprises a first step of oxidizing a surface portion of the silicon substrate to form a silicon dioxide film; a second step of forming a metal film on the silicon dioxide film in a non-oxidizing atmosphere; a third step of heating in a non-oxidizing atmosphere to diffuse the metal atoms constituting the metal film into the silicon dioxide film; and a fourth step of oxidizing the silicon dioxide film containing the diffused metal atoms to form the film containing the metal atoms, silicon atoms, and oxygen atoms.

    摘要翻译: 在硅衬底上形成至少含有金属原子,硅原子和氧原子的介电膜的工艺包括:氧化硅衬底表面部分以形成二氧化硅膜的第一步骤; 在非氧化性气氛中在二氧化硅膜上形成金属膜的第二工序; 在非氧化气氛中加热第三步骤,将构成金属膜的金属原子扩散到二氧化硅膜中; 以及氧化含有扩散金属原子的二氧化硅膜以形成含有金属原子,硅原子和氧原子的膜的第四步骤。

    Method of forming dielectric films
    2.
    发明授权
    Method of forming dielectric films 有权
    形成介电膜的方法

    公开(公告)号:US07923360B2

    公开(公告)日:2011-04-12

    申请号:US12342349

    申请日:2008-12-23

    IPC分类号: H01L21/425

    摘要: A method of forming dielectric films including a metal silicate on a silicon substrate comprises a first step of oxidizing a surface layer portion of the silicon substrate and forming a silicon dioxide film; a second step of irradiating ion on the surface of the silicon dioxide film and making the surface layer portion of the silicon dioxide film into a reaction-accelerating layer with Si—O cohesion cut; a third step of laminating a metal film on the reaction-accelerating layer in a non-oxidizing atmosphere; and a fourth step of oxidizing the metal film and forming a metal silicate film that diffuses a metal from the metal film to the silicon dioxide film.

    摘要翻译: 在硅衬底上形成包括金属硅酸盐的电介质膜的方法包括:氧化硅衬底的表层部分并形成二氧化硅膜的第一步骤; 在二氧化硅膜的表面上照射离子并使二氧化硅膜的表层部分成为具有Si-O内聚力的反应促进层的第二步骤; 在非氧化性气氛中将金属膜层叠在反应促进层上的第3工序; 以及将金属膜氧化并形成将金属从金属膜扩散到二氧化硅膜的金属硅酸盐膜的第四工序。

    PROCESS FOR FORMING DIELECTRIC FILMS
    3.
    发明申请
    PROCESS FOR FORMING DIELECTRIC FILMS 有权
    形成电介质膜的工艺

    公开(公告)号:US20090170341A1

    公开(公告)日:2009-07-02

    申请号:US12342360

    申请日:2008-12-23

    IPC分类号: H01L21/768

    摘要: A process for forming dielectric films containing at least metal atoms, silicon atoms, and oxygen atoms on a silicon substrate comprises a first step of oxidizing a surface portion of the silicon substrate to form a silicon dioxide film; a second step of forming a metal film on the silicon dioxide film in a non-oxidizing atmosphere; a third step of heating in a non-oxidizing atmosphere to diffuse the metal atoms constituting the metal film into the silicon dioxide film; and a fourth step of oxidizing the silicon dioxide film containing the diffused metal atoms to form the film containing the metal atoms, silicon atoms, and oxygen atoms.

    摘要翻译: 在硅衬底上形成至少含有金属原子,硅原子和氧原子的介电膜的工艺包括:氧化硅衬底的表面部分以形成二氧化硅膜的第一步骤; 在非氧化性气氛中在二氧化硅膜上形成金属膜的第二工序; 在非氧化气氛中加热第三步骤,将构成金属膜的金属原子扩散到二氧化硅膜中; 以及氧化含有扩散金属原子的二氧化硅膜以形成含有金属原子,硅原子和氧原子的膜的第四步骤。

    PLASMA PROCESSING METHOD
    4.
    发明申请
    PLASMA PROCESSING METHOD 审中-公开
    等离子体处理方法

    公开(公告)号:US20070281107A1

    公开(公告)日:2007-12-06

    申请号:US11755233

    申请日:2007-05-30

    申请人: Hideo Kitagawa

    发明人: Hideo Kitagawa

    IPC分类号: H05H1/24

    摘要: A method for irradiating plasma of a material to a substrate and introducing the material into the substrate includes an irradiation step of irradiating the plasma to the substrate during an irradiation time period in which the material is not diffused in the substrate, and a non-irradiation step of stopping irradiation of the plasma to the substrate during a non-irradiation time period in which the plasma disappears, wherein the irradiation step and the non-irradiation step are repeated.

    摘要翻译: 将材料的等离子体照射到基板并将材料引入基板的方法包括:照射步骤,在材料不在基板中扩散的照射时间段内照射等离子体到基板,并且不照射 在等离子体消失的非照射时间段期间停止将等离子体照射到基板的步骤,其中重复照射步骤和非照射步骤。

    Process for producing semiconductor device
    6.
    发明授权
    Process for producing semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号:US06426302B2

    公开(公告)日:2002-07-30

    申请号:US09778943

    申请日:2001-02-08

    申请人: Hideo Kitagawa

    发明人: Hideo Kitagawa

    IPC分类号: H01L21302

    CPC分类号: H01J37/32357 H01J37/32422

    摘要: A plasma processing apparatus having a vacuum vessel and a supporting means for supporting a processing target in the vacuum vessel, the apparatus comprising means for introducing a gas into a plasma generating space, means for feeding electric energy to the gas in the plasma generating space to generate a plasma, a metal member for forming negative ions which is provided on the downstream side of the plasma generating space in such a way that it comes into contact with particles of the plasma, and means for feeding the negative ions to the processing target. Utilizing the electric charge exchange reaction between plasma particles and metal surfaces, negative ions can be formed continuously and in a high density and also the negative ions can be made incident on a processing target to make ashing, etching or cleaning of the processing target to remove unwanted matter therefrom, so that a high processing rate and less charge-up damage can be achieved.

    摘要翻译: 一种等离子体处理装置,其具有真空容器和用于在真空容器内支撑加工对象的支撑装置,该装置包括用于将气体引入等离子体产生空间的装置,用于将电能馈送到等离子体产生空间中的气体的装置 产生等离子体,用于形成负离子的金属构件,其以与等离子体的粒子接触的方式设置在等离子体产生空间的下游侧,以及用于将负离子供给到处理对象的装置。 利用等离子体颗粒和金属表面之间的电荷交换反应,可以连续地和高密度地形成负离子,并且还可以使负离子入射到处理对象上,以使加工对象的灰化,蚀刻或清洁以去除 从而可以实现高处理速率和较少的充电损伤。

    Plasma processing apparatus
    8.
    发明授权
    Plasma processing apparatus 有权
    等离子体处理装置

    公开(公告)号:US06217703B1

    公开(公告)日:2001-04-17

    申请号:US09399112

    申请日:1999-09-20

    申请人: Hideo Kitagawa

    发明人: Hideo Kitagawa

    IPC分类号: H05H100

    CPC分类号: H01J37/32357 H01J37/32422

    摘要: A plasma processing apparatus having a vacuum vessel and a supporting means for supporting a processing target in the vacuum vessel, the apparatus comprising means for introducing a gas into a plasma generating space, means for feeding electric energy to the gas in the plasma generating space to generate a plasma, a metal member for forming negative ions which is provided on the downstream side of the plasma generating space in such a way that it comes into contact with particles of the plasma, and means for feeding the negative ions to the processing target. Utilizing the electric charge exchange reaction between plasma particles and metal surfaces, negative ions can be formed continuously and in a high density and also the negative ions can be made incident on a processing target to make ashing, etching or cleaning of the processing target to remove unwanted matter therefrom, so that a high processing rate and less charge-up damage can be achieved.

    摘要翻译: 一种等离子体处理装置,其具有真空容器和用于在真空容器内支撑加工对象的支撑装置,该装置包括用于将气体引入等离子体产生空间的装置,用于将电能馈送到等离子体产生空间中的气体的装置 产生等离子体,用于形成负离子的金属构件,其以与等离子体的粒子接触的方式设置在等离子体产生空间的下游侧,以及用于将负离子供给到处理对象的装置。 利用等离子体颗粒和金属表面之间的电荷交换反应,可以连续地和高密度地形成负离子,并且还可以使负离子入射到处理对象上,以使加工对象的灰化,蚀刻或清洁以去除 从而可以实现高处理速率和较少的充电损伤。

    Ink washing device for a printing machine
    9.
    再颁专利
    Ink washing device for a printing machine 失效
    印刷机用油墨清洗装置

    公开(公告)号:USRE35444E

    公开(公告)日:1997-02-11

    申请号:US554363

    申请日:1995-11-06

    IPC分类号: B41F35/04 B41F35/00 B41F33/00

    CPC分类号: B41F35/04 B41P2235/40

    摘要: An ink washing device is disclosed, for use in a printing machine having a deposit roller with a variable luminance outer surface. The washing device includes a blade disposed adjacent to the deposit roller, for removing excess deposit of ink on the outer surface of the deposit roller, thus causing its luminance to vary. A luminance sensor detects changes in the luminance of the outer surface. The washing operation is interrupted or continued based on the detected luminance changes.

    摘要翻译: 公开了一种用于具有可变亮度外表面的沉积辊的印刷机中的油墨清洗装置。 洗涤装置包括邻近沉积辊设置的刀片,用于去除沉积辊外表面上的墨水的过量沉积,从而使其亮度发生变化。 亮度传感器检测外表面的亮度变化。 基于检测到的亮度变化,洗涤操作中断或继续。

    Ink washing device for a printing machine
    10.
    发明授权
    Ink washing device for a printing machine 失效
    印刷机用油墨清洗装置

    公开(公告)号:US5325780A

    公开(公告)日:1994-07-05

    申请号:US28798

    申请日:1993-03-09

    IPC分类号: B41F35/00 B41F33/00

    CPC分类号: B41F35/00

    摘要: An ink washing device is disclosed, for use in a printing machine having a deposit roller with a variable luminance outer surface. The washing device includes a blade disposed adjacent to the deposit roller, for removing excess deposit of ink on the outer surface of the deposit roller, thus causing its luminance to vary. A luminance sensor detects changes in the luminance of the outer surface. The washing operation is interrupted or continued based on the detected luminance changes.

    摘要翻译: 公开了一种用于具有可变亮度外表面的沉积辊的印刷机中的油墨清洗装置。 洗涤装置包括邻近沉积辊设置的刀片,用于去除沉积辊外表面上的墨水的过量沉积,从而使其亮度发生变化。 亮度传感器检测外表面的亮度变化。 基于检测到的亮度变化,洗涤操作中断或继续。