公开(公告)号：US06550136B1

公开(公告)日：2003-04-22

申请号：US09511368

申请日：2000-02-23

申请人： Hiroki Hata ,  Kenichi Yamane ,  Akihiro Nishimura ,  Noriaki Taneko

发明人： Hiroki Hata ,  Kenichi Yamane ,  Akihiro Nishimura ,  Noriaki Taneko

IPC分类号： H05K302

CPC分类号： H01L23/4985 ,  H01L21/4803 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0293 ,  H05K3/0044 ,  H05K3/242 ,  H05K2201/09127 ,  H05K2201/09236 ,  H05K2203/0228 ,  H05K2203/049 ,  H05K2203/175 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention aims to provide a method of fabricating a printed wiring board characterized in that a printed wiring board is fabricated by perforating a slot by a router bit at a central part of a substrate. The method further includes cutting a wiring portion for electric plating by the router bit. According to the method, the occurrence of cut burr on the surfaces of the wiring pattern, caused by electric plating, is prevented, the product yield is promoted and the operational efficiency is improved. The invention also discloses a method of fabricating a printed wiring board by forming a conductor circuit by patterning a metal coating formed on a surface of an insulating substrate, successively subjecting the conductor circuit to a surface treatment by electric plating and thereafter perforating a slot by a router bit. The slot connects the substrate to a semiconductor chip at a central portion thereof by bonding wires. As per the method, a pattern of a wiring portion (a wiring pattern) for the electric plating at a location for perforating the slot is inclined at an acute angle relative to a face orthogonal to a moving direction of the router bit, preferably, an acute angle of approximately 15° or more and a width of the wiring portion for the electric plating being approximately 90 &mgr;m or more.

摘要翻译： 本发明的目的在于提供一种制造印刷电路板的方法，其特征在于，通过在基板的中心部分的路由器钻头穿孔来制造印刷布线板。 该方法还包括切割由路由器位电镀的布线部分。 根据该方法，防止了由电镀引起的布线图案表面上的切割毛刺的发生，提高了产品收率并提高了操作效率。 本发明还公开了一种制造印刷电路板的方法，该方法是通过对形成在绝缘基板表面上的金属涂层进行图案化形成导体电路，依次通过电镀对导体电路进行表面处理，然后通过 路由器位。 槽通过接合线将基板连接到其中心部分的半导体芯片。 根据该方法，用于穿孔的位置处的电镀的布线部分（布线图案）的图案相对于与路由器钻头的移动方向正交的面倾斜成锐角，优选为 约15°以上的锐角，电镀用配线部的宽度为约90μm以上。