公开(公告)号：US20140083842A1

公开(公告)日：2014-03-27

申请号：US13626769

申请日：2012-09-25

Applicant: Hitoshi USUDA ,  Tomohiro Noda

Inventor： Hitoshi USUDA ,  Tomohiro Noda

IPC: C25D17/28

CPC classification number: C25D17/12 ,  C25D5/022 ,  C25D5/08 ,  C25D17/06 ,  C25D21/10

Abstract: A serial plating system includes a plurality of nozzles that are disposed in a plating tank at a position opposite to a plurality of workpieces, and that discharge a plating solution toward the plurality of workpieces, and a plurality of anodes that are disposed in the plating tank at a position opposite to the plurality of workpieces that are serially transferred in the plating tank, one nozzle among the plurality of nozzles and at least one anode among the plurality of anodes being alternately and repeatedly disposed along a transfer direction in which the plurality of workpieces are serially transferred. The plurality of nozzles and the plurality of anodes may be disposed to overlap in a side view along the transfer direction.

Abstract translation: 串联电镀系统包括多个喷嘴，其布置在与多个工件相对的位置处的镀槽中，并且向多个工件排放电镀液，并且设置在镀槽中的多个阳极 在与电镀槽中串联传送的多个工件相对的位置处，多个喷嘴中的一个喷嘴和多个阳极中的至少一个阳极沿着传送方向交替重复地设置，在该传送方向上，多个工件 连续转移。 多个喷嘴和多个阳极可以设置成沿着传送方向在侧视图中重叠。

公开(公告)号：US5891509A

公开(公告)日：1999-04-06

申请号：US905714

申请日：1997-08-04

Applicant: Eishiro Kawana ,  Hitoshi Usuda ,  Kenji Mimura

Inventor： Eishiro Kawana ,  Hitoshi Usuda ,  Kenji Mimura

IPC: B05D1/28 ,  B05C1/02 ,  B05C1/08 ,  B05C1/16 ,  B05C9/04 ,  B05C11/10 ,  B05C13/00 ,  B05D3/00 ,  B05D3/02 ,  B05D3/12 ,  B05D7/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/28

CPC classification number: B05C1/0834 ,  B05C1/165 ,  B05C9/04 ,  B05D1/28 ,  B05D3/0263 ,  B05D3/12 ,  H05K3/0091 ,  B05D2252/10 ,  B05D7/542 ,  H05K2201/0989 ,  H05K2203/0143 ,  H05K2203/1509 ,  H05K2203/163

Abstract: A method of applying a coating material to two surfaces of a plate includes the steps of applying the coating material to the two surfaces simultaneously such that holding areas in the absence of the coating material are provided on the two surfaces in proximity of side ends of the plate with respect to a travel direction of the plate, and conveying the plate by holding the holding areas.

Abstract translation: 将涂层材料施加到板的两个表面的方法包括以下步骤：同时将涂层材料施加到两个表面，使得在不存在涂层材料的情况下的保持区域设置在邻近的两个表面的两个表面上 相对于板的行进方向的板，并且通过保持保持区域来输送板。

公开(公告)号：US5102521A

公开(公告)日：1992-04-07

申请号：US740509

申请日：1991-08-05

Applicant: Hitoshi Usuda ,  Ryoei Yamakawa ,  Kenichi Ueno ,  Kazuhiro Hirao

Inventor： Hitoshi Usuda ,  Ryoei Yamakawa ,  Kenichi Ueno ,  Kazuhiro Hirao

IPC: C25D7/00 ,  C25D17/00 ,  C25D17/10 ,  C25D17/12 ,  C25D21/04 ,  H05K3/24

CPC classification number: C25D17/008 ,  C25D17/001 ,  C25D17/002 ,  C25D21/04 ,  H05K3/241

Abstract: According to the present invention, an upper electrode and a lower electrode are integrally assembled with insoluble electrodes and diaphragmn in diaphragm electrode structure. Small holes are furnished on the upper electrode, and the diaphragm of the upper electrode is installed obliquely with degassing means. By simply carrying the objects to be plated in horizontal direction, uniform and high quality electroplating can be continuously performed with extensive increase in productivity, while enjoying all of the benefits such as shorter interpolar distance between two electrodes, compact design of the apparatus, saving of expensive additives, etc. Further, the inspection of the diaphragm and the like can be rapidly and easily accomplished, and perfect protection of the diaphragm is assured, thus providing a horizontal carrying type electroplating apparatus suitable for practical use.