公开(公告)号：US20060145314A1

公开(公告)日：2006-07-06

申请号：US11202898

申请日：2005-08-12

申请人： Hung-Che Shen ,  Hung-Hsin Liu ,  Geng-Shin Shen

发明人： Hung-Che Shen ,  Hung-Hsin Liu ,  Geng-Shin Shen

IPC分类号： H01L23/495

CPC分类号： H01L23/49572 ,  H01L23/13 ,  H01L24/50 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14

摘要： The invention provides a tape for a tape carrier package. The tape includes a flexible insulating film. The flexible insulating film is divided into a plurality of units arranged successively, and each of the units has a device hole and a plurality of leads. The plurality of leads are formed on the flexible insulating film and protrude to the device hole. The device hole has a plurality of corners formed in a form of a notch for preventing the stress from concentrating on and breaking the leads.

摘要翻译： 本发明提供了一种用于带载包装的带子。 胶带包括柔性绝缘膜。 柔性绝缘膜被分成依次布置的多个单元，并且每个单元具有装置孔和多个引线。 多个引线形成在柔性绝缘膜上并突出到器件孔。 设备孔具有形成为凹口形式的多个拐角，用于防止应力集中和断开引线。

公开(公告)号：US20090267229A1

公开(公告)日：2009-10-29

申请号：US12212173

申请日：2008-09-17

申请人： Hung-Che SHEN

发明人： Hung-Che SHEN

IPC分类号： H01L23/488

CPC分类号： H01L23/4985 ,  H01L21/563 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/50 ,  H01L24/73 ,  H01L24/86 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/73203 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15151 ,  H01L2224/05599

摘要： A chip package structure is provided. The chip package structure comprises different layers of leads electrically connected to different circuits of a chip. The chip package structure comprises a chip and a flexible substrate layer. The chip has an active surface, a plurality of first pads, and a plurality of second pads. The first pads and the second pads are disposed on the active surface. The flexible substrate layer has a first conductive layer, a second conductive layer, a first surface, and a second surface opposite the first surface. The flexible substrate layer has an opening defined therein. The first conductive layer is formed on the first surface of the flexible substrate layer. The first conductive layer includes a plurality of first leads. The first leads electrically connect to the first pads. The second conductive layer is formed on the second surface of the flexible substrate layer. The second conductive layer includes a plurality of second leads. The second leads extend inwards into the opening and electrically connect to the second pads through the opening.

摘要翻译： 提供了芯片封装结构。 芯片封装结构包括电连接到芯片的不同电路的不同层的引线。 芯片封装结构包括芯片和柔性衬底层。 芯片具有有源表面，多个第一焊盘和多个第二焊盘。 第一焊盘和第二焊盘设置在有源表面上。 柔性基板层具有第一导电层，第二导电层，第一表面和与第一表面相对的第二表面。 柔性基底层具有限定在其中的开口。 第一导电层形成在柔性基板层的第一表面上。 第一导电层包括多个第一引线。 第一引线电连接到第一焊盘。 第二导电层形成在柔性基板层的第二表面上。 第二导电层包括多个第二引线。 第二引线向内延伸到开口中，并通过开口电连接到第二焊盘。

公开(公告)号：US20060145315A1

公开(公告)日：2006-07-06

申请号：US11250989

申请日：2005-10-13

申请人： Hung-Che Shen ,  Hung-Hsin Liu ,  Geng-Shin Shen

发明人： Hung-Che Shen ,  Hung-Hsin Liu ,  Geng-Shin Shen

IPC分类号： H01L23/495

CPC分类号： H01L23/3157 ,  H01L23/49572 ,  H01L24/50 ,  H01L24/86 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2224/0401

摘要： The invention provides a flexible substrate for package of a semiconductor die. The flexible substrate includes a flexible insulating film, a plurality of first leads substantially formed on the flexible insulating film, and at least one loop-shaped second lead substantially formed on the flexible insulating film. The at least one second lead is partially disposed at a corner of a device hole of the flexible film, and is designed as being capable of preventing from fracture induced during the package of the semiconductor die. Preferably, the portion of each of the at least one second lead, to be overlapped over the semiconductor die, exhibits an L-shape, a U-shape or a Y-shape.

摘要翻译： 本发明提供一种用于半导体管芯封装的柔性衬底。 柔性基板包括柔性绝缘膜，基本上形成在柔性绝缘膜上的多个第一引线以及基本形成在柔性绝缘膜上的至少一个环形第二引线。 所述至少一个第二引线部分地设置在所述柔性膜的器件孔的角部，并且被设计为能够防止在所述半导体管芯的封装期间引起的断裂。 优选地，要重叠在半导体管芯上的至少一个第二引线中的每一个的部分呈现L形，U形或Y形。

公开(公告)号：US20130032940A1

公开(公告)日：2013-02-07

申请号：US13525354

申请日：2012-06-17

申请人： Hung-Che Shen

发明人： Hung-Che Shen

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L21/563 ,  H01L23/49894 ,  H01L23/60 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81411 ,  H01L2224/81805 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/0401

摘要： A chip package structure includes a chip, a flexible substrate, first leads and second leads. First bumps, second bumps and a seal ring are disposed on an active surface of the chip. The first and second bumps are respectively adjacent to first and second edges of the chip. The seal ring is located between the bumps and the edges. The chip is disposed in a chip mounting region of the flexible substrate. The first and second edges correspond to first and second sides of the chip mounting region respectively. The first leads disposed on the flexible substrate enter the chip mounting region through the first side and extend toward the second side to electrically connect the second bumps respectively. The second leads disposed on the flexible substrate enter the chip mounting region through the second side and extend toward the first side to electrically connect the first bumps respectively.

摘要翻译： 芯片封装结构包括芯片，柔性衬底，第一引线和第二引线。 第一凸起，第二凸起和密封环设置在芯片的有效表面上。 第一和第二凸起分别与芯片的第一和第二边缘相邻。 密封环位于凸块和边缘之间。 芯片设置在柔性基板的芯片安装区域中。 第一和第二边缘分别对应于芯片安装区域的第一和第二边。 设置在柔性基板上的第一引线经由第一侧进入芯片安装区域并朝向第二侧延伸以分别电连接第二凸块。 设置在柔性基板上的第二引线通过第二侧进入芯片安装区域并朝向第一侧延伸以分别电连接第一凸块。