公开(公告)号：US07446731B2

公开(公告)日：2008-11-04

申请号：US10793843

申请日：2004-03-08

申请人： Hyung-Jin Yoon

发明人： Hyung-Jin Yoon

IPC分类号： G09G5/00

CPC分类号： G06F3/1438

摘要： A computer system having a main body, a first display device connected to the main body to display a picture and at least one other display device in communication with the main body to display a picture. The computer system has a user selection part to input a selection of displaying an image displayed on the first display device on the at least one other display device until another input selection or release. A control part controls transmission of a video signal corresponding to the selected image to the at least one other display device based on the user selection part. Thus, same or different images can be displayed on a plurality of display devices according to a user selection.

摘要翻译： 一种具有主体的计算机系统，连接到主体以显示图像的第一显示装置和与主体通信的至少一个其他显示装置以显示图像。 计算机系统具有用户选择部分，用于输入在至少一个其他显示设备上显示在第一显示设备上显示的图像的选择，直到另一个输入选择或释放。 基于用户选择部分，控制部件控制与所选图像相对应的视频信号到至少一个其他显示设备的传输。 因此，可以根据用户选择在多个显示设备上显示相同或不同的图像。

公开(公告)号：US5612853A

公开(公告)日：1997-03-18

申请号：US381304

申请日：1995-01-31

申请人： Dong-Goo Kim ,  Min-Kyu Song ,  Seong-Su Park ,  Seung-Goo Kang ,  Hyung-Jin Yoon ,  Hyung-Moo Park

发明人： Dong-Goo Kim ,  Min-Kyu Song ,  Seong-Su Park ,  Seung-Goo Kang ,  Hyung-Jin Yoon ,  Hyung-Moo Park

IPC分类号： H01L21/52 ,  H01L23/02 ,  H01L23/04 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66 ,  H05K7/20

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/60 ,  H01L23/66 ,  H01L24/29 ,  H01L24/49 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49121

摘要： A package for a power semiconductor device is made using the method comprising the steps of preparing a lead frame including a blade or paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus. The method can be applied to produce a plastic package of a power semiconductor device at low cost. The metal cap is grounded through the tie bars as a source electrode to shield a noise.

摘要翻译： 一种用于功率半导体器件的封装是使用以下方法制造的，该方法包括以下步骤：制备包括用于在其顶表面上提供半导体芯片的叶片或桨叶的引线框架，用于支撑所述桨叶的连接杆，其中所述桨叶 水平面比引线高; 通过包覆将散热板附接在桨叶的底面上; 通过焊接将Kovar板附接在桨的顶表面上，所述Kovar板的热膨胀系数与芯片的热膨胀系数相似; 通过焊接在Kovar板上提供芯片; 将所述半导体芯片的引线接合端子分别连接到引线框架的对应引线; 通过旋涂在半导体芯片上涂覆聚酰亚胺; 固化由此涂覆的聚酰亚胺; 通过焊接在所述桨上方形成金属帽，并将成型材料注入成型机中以封闭所述桨叶并固化由此注入的模制材料。 该方法可以用于以低成本生产功率半导体器件的塑料封装。 金属盖通过连杆作为源极接地，以屏蔽噪声。

公开(公告)号：US20120331514A1

公开(公告)日：2012-12-27

申请号：US13534856

申请日：2012-06-27

申请人： Seung-ho YEON ,  Tae-seok SUH ,  Hyung-jin YOON ,  Myung-soon LEE

发明人： Seung-ho YEON ,  Tae-seok SUH ,  Hyung-jin YOON ,  Myung-soon LEE

IPC分类号： H04N21/25 ,  H04N21/262

CPC分类号： H04N21/44008 ,  H04N21/23418 ,  H04N21/47815 ,  H04N21/812 ,  H04N21/8153

摘要： A method of providing image-associated information by an image-associated information providing apparatus includes receiving broadcasting image information from a mobile device, searching an object that matches the broadcasting image information, extracting image-associated information that matches the found object and transmitting the extracted image-associated information to the mobile device.

摘要翻译： 由图像关联信息提供装置提供图像相关信息的方法包括从移动装置接收广播图像信息，搜索与广播图像信息相匹配的对象，提取与发现对象匹配的图像相关信息，并发送所提取的 图像相关信息到移动设备。

公开(公告)号：US5338981A

公开(公告)日：1994-08-16

申请号：US940214

申请日：1992-09-08

申请人： Ki-Hong Kim ,  Chang-Seok Lee ,  Hyung-Moo Park ,  Hyung-Jin Yoon ,  Sin-Chong Park

发明人： Ki-Hong Kim ,  Chang-Seok Lee ,  Hyung-Moo Park ,  Hyung-Jin Yoon ,  Sin-Chong Park

IPC分类号： G06F12/06 ,  G11C8/12 ,  G11C8/00

CPC分类号： G11C8/12

摘要： There is disclosed a semiconductor device having a plurality of chips in which a predetermined extended addresses are allocated for each of the chips to select the chips in a multiple-chip module, the device comprising: a plurality of semiconductor chip selectors equipped in said semiconductor device, for supplying an internal chip select signals to select the chips in response to said extended addresses and a module select signal; and each of said semiconductor chip selectors having a plurality of decoders for receiving the extended addresses and outputting a predetermined logic signal, and an AND gate for receiving said module select signal and said logic signal of each of said decoders and outputting said internal chip select signals. Accordingly, in packaging semiconductor chips in accordance with the invention, a semiconductor chip module can be miniatured more, processing steps of such semiconductor chip module can be reduced, and input and output terminals of such semiconductor chip module can be reduces in the number so that the invention can improve access time or delay time in the module.

摘要翻译： 公开了一种具有多个芯片的半导体器件，其中为每个芯片分配预定的扩展地址以在多芯片模块中选择芯片，该器件包括：多个半导体芯片选择器，配备在所述半导体器件 ，用于提供内部芯片选择信号以响应于所述扩展地址和模块选择信号选择芯片; 并且每个所述半导体芯片选择器具有用于接收扩展地址并输出预定逻辑信号的多个解码器，以及用于接收所述模块选择信号和每个所述解码器的所述逻辑信号的“与”门，并输出所述内部芯片选择信号 。 因此，在根据本发明的封装半导体芯片中，半导体芯片模块可以缩小，可以减少这种半导体芯片模块的处理步骤，并且可以减少这种半导体芯片模块的输入和输出端子，使得 本发明可以改善模块中的访问时间或延迟时间。

公开(公告)号：US08896247B2

公开(公告)日：2014-11-25

申请号：US13562963

申请日：2012-07-31

申请人： Hyung Jin Yoon ,  Jinhyung Lee

发明人： Hyung Jin Yoon ,  Jinhyung Lee

IPC分类号： H02P6/08

CPC分类号： B60L11/14 ,  B60L15/20 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2270/145 ,  Y02T10/645 ,  Y02T10/70 ,  Y02T10/7077 ,  Y02T10/72 ,  Y02T10/7275

摘要： Disclosed is a method for setting a current sensor of a vehicle having a drive motor according to an exemplary embodiment of the present invention may include confirming a first condition that a vehicle stops its movement, confirming a second condition that a required torque of a drive motor of a vehicle is 0, stopping a current that is supplied to the drive motor if the first condition and the second condition are satisfied, and compensating offset of the current sensor of a drive motor control unit controlling the drive motor. The offset may be compensated if the first condition and the second condition are satisfied for a predetermined time. Accordingly, an offset of the current sensor is compensated in a predetermined driving condition that the vehicle stops moving and therefore the creep surge and the motor torque ripple that can be generated in the vehicle are prevented.

摘要翻译： 公开了根据本发明的示例性实施例的具有驱动电动机的车辆的电流传感器的设置方法可以包括确认车辆停止其运动的第一条件，确认驱动电动机的所需扭矩的第二条件 如果满足第一条件和第二条件，则停止提供给驱动电动机的电流，并且控制驱动电动机的驱动电动机控制单元的电流传感器的补偿偏移。 如果在预定时间内满足第一条件和第二条件，则可以补偿偏移。 因此，在车辆停止移动的预定行驶状态下补偿电流传感器的偏移，因此能够防止在车辆中产生的蠕变浪涌和电机转矩脉动。

公开(公告)号：US20120101659A1

公开(公告)日：2012-04-26

申请号：US12950038

申请日：2010-11-19

申请人： Myung Hoe Kim ,  Woo Sung Kim ,  Do Sung Hwang ,  Hyung Jin Yoon ,  Sung Yun Kim ,  Woo Suk Sung ,  Ji-Hwon Kim

发明人： Myung Hoe Kim ,  Woo Sung Kim ,  Do Sung Hwang ,  Hyung Jin Yoon ,  Sung Yun Kim ,  Woo Suk Sung ,  Ji-Hwon Kim

IPC分类号： G06F17/00 ,  H02J7/00

CPC分类号： B60L1/08 ,  B60H1/00257 ,  B60H1/00392 ,  B60L1/003 ,  B60L11/1816 ,  B60L11/1838 ,  B60L11/1861 ,  B60L11/1862 ,  B60L2230/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/662 ,  B60L2250/16 ,  B60L2260/56 ,  G08C17/00 ,  Y02T10/7005 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7088 ,  Y02T10/7291 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/16 ,  Y02T90/163

摘要： A telematics device for an electric vehicle and a remote air-conditioning control method thereof are provided. A vehicle driver remote adjusts an indoor temperature of the electric vehicle by driving an air-conditioning unit of the vehicle during the battery charging, so that a travelable distance based on the battery life can be maximized.

摘要翻译： 提供了一种用于电动车辆的远程信息处理装置及其远程空调控制方法。 车辆驾驶员通过在电池充电期间驾驶车辆的空调单元来远程调节电动车辆的室内温度，从而可以使基于电池寿命的行驶距离最大化。

公开(公告)号：US5446959A

公开(公告)日：1995-09-05

申请号：US268104

申请日：1994-07-06

申请人： Dong-Goo Kim ,  Min-Kyu Song ,  Seong-Su Park ,  Seung-Goo Kang ,  Hyung-Jin Yoon ,  Hyung-Moo Park

发明人： Dong-Goo Kim ,  Min-Kyu Song ,  Seong-Su Park ,  Seung-Goo Kang ,  Hyung-Jin Yoon ,  Hyung-Moo Park

IPC分类号： H01L21/52 ,  H01L23/02 ,  H01L23/04 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66 ,  H01R43/00

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/60 ,  H01L23/66 ,  H01L24/29 ,  H01L24/49 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49121

摘要： A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus the method can be applied to produce a plastic package of a power semiconductor device at low cost. The metal cap is grounded through the tie bars as a source electrode to shield a noise.

摘要翻译： 公开了一种封装功率半导体器件的方法，包括以下步骤：制备引线框架，该引线框架包括用于在其顶表面上提供半导体芯片的焊盘，用于支撑所述焊盘的连接杆，其中所述焊盘设置在水平表面的下方， 线索 通过包覆将散热板附接在桨叶的底面上; 通过焊接将Kovar板附接在桨的顶表面上，所述Kovar板的热膨胀系数与芯片的热膨胀系数相似; 通过焊接在Kovar板上提供芯片; 将所述半导体芯片的引线接合端子分别连接到引线框架的对应引线; 通过旋涂在半导体芯片上涂覆聚酰亚胺; 固化由此涂覆的聚酰亚胺; 通过焊接在所述焊盘上形成金属盖，并且将成型材料注入成型机中以封闭所述焊盘并固化所述方法所注入的模塑材料，可以应用于以低成本生产功率半导体器件的塑料封装。 金属盖通过连杆作为源极接地，以屏蔽噪声。

公开(公告)号：US08504219B2

公开(公告)日：2013-08-06

申请号：US12950038

申请日：2010-11-19

申请人： Myung Hoe Kim ,  Woo Sung Kim ,  Do Sung Hwang ,  Hyung Jin Yoon ,  Sung Yun Kim ,  Woo Suk Sung ,  Ji-Hwon Kim

发明人： Myung Hoe Kim ,  Woo Sung Kim ,  Do Sung Hwang ,  Hyung Jin Yoon ,  Sung Yun Kim ,  Woo Suk Sung ,  Ji-Hwon Kim

IPC分类号： G05D1/00

CPC分类号： B60L1/08 ,  B60H1/00257 ,  B60H1/00392 ,  B60L1/003 ,  B60L11/1816 ,  B60L11/1838 ,  B60L11/1861 ,  B60L11/1862 ,  B60L2230/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/662 ,  B60L2250/16 ,  B60L2260/56 ,  G08C17/00 ,  Y02T10/7005 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7088 ,  Y02T10/7291 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/16 ,  Y02T90/163

摘要： A telematics device for an electric vehicle and a remote air-conditioning control method thereof are provided. A vehicle driver remote adjusts an indoor temperature of the electric vehicle by driving an air-conditioning unit of the vehicle during the battery charging, so that a travelable distance based on the battery life can be maximized.

摘要翻译： 提供了一种用于电动车辆的远程信息处理装置及其远程空调控制方法。 车辆驾驶员通过在电池充电期间驾驶车辆的空调单元来远程调节电动车辆的室内温度，从而可以使基于电池寿命的行驶距离最大化。

公开(公告)号：US20130147405A1

公开(公告)日：2013-06-13

申请号：US13562963

申请日：2012-07-31

申请人： Hyung Jin Yoon ,  Jinhyung Lee

发明人： Hyung Jin Yoon ,  Jinhyung Lee

IPC分类号： H02P3/18

CPC分类号： B60L11/14 ,  B60L15/20 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2270/145 ,  Y02T10/645 ,  Y02T10/70 ,  Y02T10/7077 ,  Y02T10/72 ,  Y02T10/7275

摘要： Disclosed is a method for setting a current sensor of a vehicle having a drive motor according to an exemplary embodiment of the present invention may include confirming a first condition that a vehicle stops its movement, confirming a second condition that a required torque of a drive motor of a vehicle is 0, stopping a current that is supplied to the drive motor if the first condition and the second condition are satisfied, and compensating offset of the current sensor of a drive motor control unit controlling the drive motor. The offset may be compensated if the first condition and the second condition are satisfied for a predetermined time. Accordingly, an offset of the current sensor is compensated in a predetermined driving condition that the vehicle stops moving and therefore the creep surge and the motor torque ripple that can be generated in the vehicle are prevented.

摘要翻译： 公开了根据本发明的示例性实施例的具有驱动电动机的车辆的电流传感器的设置方法可以包括确认车辆停止其运动的第一条件，确认驱动电动机的所需扭矩的第二条件 如果满足第一条件和第二条件，则停止提供给驱动电动机的电流，并且控制驱动电动机的驱动电动机控制单元的电流传感器的补偿偏移。 如果在预定时间内满足第一条件和第二条件，则可以补偿偏移。 因此，在车辆停止移动的预定行驶状态下补偿电流传感器的偏移，因此能够防止在车辆中产生的蠕变浪涌和电机转矩脉动。

公开(公告)号：US5405490A

公开(公告)日：1995-04-11

申请号：US149114

申请日：1993-11-09

申请人： Gyeong-Lyong Park ,  Sin-Chong Park ,  Dong-Goo Kim ,  Hyung-Jin Yoon ,  Chul-Soon Park ,  Min-Kyu Song

发明人： Gyeong-Lyong Park ,  Sin-Chong Park ,  Dong-Goo Kim ,  Hyung-Jin Yoon ,  Chul-Soon Park ,  Min-Kyu Song

IPC分类号： G02F3/00 ,  B81B3/00 ,  C03C17/36 ,  G02B26/02 ,  G02B27/00 ,  G09F9/37 ,  G09G3/20 ,  H01L21/306 ,  B44C1/22 ,  C03C15/00 ,  C23F1/00

CPC分类号： C03C17/3618 ,  B82Y15/00 ,  C03C17/36 ,  C03C17/3639 ,  C03C17/3642 ,  C03C17/3652 ,  C03C17/3671 ,  G02B26/02 ,  C03C2217/948

摘要： A flat display device has a plurality of pixels and a plurality of micro light valves which correspond to each of the pixels thereof, and has a plurality of selection lines and data lines disposed in a matrix the micro light valves each comprise a data electrode to be connected with each of the data lines through a via, a selection electrode to be connected with each of the selection lines, a common electrode formed between the selection and data electrodes, a frame, and a shifting element capable of being moved in the frame by driving signals to be applied to the data and selection electrodes, so as to pass or shut off a light beam. A first driving means is connected to the respective selection lines, for supplying a predetermined selection signal for said light valves; and a second driving means is connected to the respective data lines, for supplying a predetermined data signal for said light valve.

摘要翻译： 平面显示装置具有多个像素和多个与其每个像素相对应的微型光阀，并且具有多个选择线和数据线，矩阵状地设置有微型光阀，每个微型光阀均包括数据电极 与每个数据线通过通孔连接，选择电极与每个选择线连接，形成在选择和数据电极之间的公共电极，框架和能够在框架中移动的移位元件 驱动信号施加到数据和选择电极，以便通过或切断光束。 第一驱动装置连接到各个选择线，用于为所述光阀提供预定的选择信号; 并且第二驱动装置连接到各个数据线，用于为所述光阀提供预定的数据信号。