公开(公告)号：US08737544B2

公开(公告)日：2014-05-27

申请号：US13598184

申请日：2012-08-29

申请人： Seokho Yoon ,  Dahae Chong ,  Junhwan Kim ,  Seung Goo Kang ,  Youngpo Lee

发明人： Seokho Yoon ,  Dahae Chong ,  Junhwan Kim ,  Seung Goo Kang ,  Youngpo Lee

IPC分类号： H04L27/06

CPC分类号： H04L27/2657 ,  H04L27/2672 ,  H04L27/2675

摘要： A method and an apparatus of estimating a frequency offset in a wireless communication system are provided. An orthogonal frequency division multiplexing (OFDM) receiver performs envelope equalized processing (EEP) with respect to a reception signal and calculates a partial periodogram with a plurality of test values based on the reception signal which goes through the EEP. The OFDM receiver estimates a first frequency offset, a second frequency offset, and a third frequency offset based on two partial periodograms adjacent to each other among the partial periodograms for the plurality of test values.

摘要翻译： 提供了一种在无线通信系统中估计频率偏移的方法和装置。 正交频分复用（OFDM）接收机对接收信号执行包络均衡处理（EEP），并且基于通过EEP的接收信号计算具有多个测试值的部分周期图。 OFDM接收机基于多个测试值的部分周期图中的彼此相邻的两个部分周期图来估计第一频率偏移，第二频率偏移和第三频率偏移。

公开(公告)号：US20130051447A1

公开(公告)日：2013-02-28

申请号：US13598184

申请日：2012-08-29

申请人： Seokho YOON ,  Dahae CHONG ,  Junhwan KIM ,  Seung Goo KANG ,  Youngpo LEE

发明人： Seokho YOON ,  Dahae CHONG ,  Junhwan KIM ,  Seung Goo KANG ,  Youngpo LEE

IPC分类号： H04B17/00

CPC分类号： H04L27/2657 ,  H04L27/2672 ,  H04L27/2675

摘要： A method and an apparatus of estimating a frequency offset in a wireless communication system are provided. An orthogonal frequency division multiplexing (OFDM) receiver performs envelope equalized processing (EEP) with respect to a reception signal and calculates a partial periodogram with a plurality of test values based on the reception signal which goes through the EEP. The OFDM receiver estimates a first frequency offset, a second frequency offset, and a third frequency offset based on two partial periodograms adjacent to each other among the partial periodograms for the plurality of test values.

摘要翻译： 提供了一种在无线通信系统中估计频率偏移的方法和装置。 正交频分复用（OFDM）接收机对接收信号执行包络均衡处理（EEP），并且基于通过EEP的接收信号计算具有多个测试值的部分周期图。 OFDM接收机基于多个测试值的部分周期图中的彼此相邻的两个部分周期图来估计第一频率偏移，第二频率偏移和第三频率偏移。

公开(公告)号：US6087621A

公开(公告)日：2000-07-11

申请号：US177480

申请日：1998-10-23

申请人： Seung Goo Kang ,  Min Kyu Song ,  Hee Tae Lee

发明人： Seung Goo Kang ,  Min Kyu Song ,  Hee Tae Lee

IPC分类号： G02B6/02 ,  B23K26/20 ,  G02B6/42 ,  G02B7/00 ,  B23K26/22

CPC分类号： G02B6/4237 ,  B23K26/22 ,  G02B6/422 ,  G02B6/4226

摘要： A method for correcting or hammering a deformation which occurs in the multi-channel optoelectronic module and is caused by a post welding shift. The multi-channel optoelectronic module has an optical fiber support member for supporting an optical fiber array. The method includes the steps of: assembling the multi-channel optoelectronic module by using a laser welding process; and forming at least one welded portion on a predetermined position of said optical fiber supporting member corresponding to the deformation to thereby recover the deformation by using a shrinkage effect of the welded portion.

摘要翻译： 一种用于校正或锤击在多通道光电子模块中发生并且由后焊移位引起的变形的方法。 多通道光电子模块具有用于支撑光纤阵列的光纤支撑构件。 该方法包括以下步骤：通过使用激光焊接工艺组装多通道光电子模块; 并且在与所述变形相对应的所述光纤支撑构件的预定位置上形成至少一个焊接部分，从而通过使用所述焊接部分的收缩效应来恢复所述变形。

公开(公告)号：US5673350A

公开(公告)日：1997-09-30

申请号：US573553

申请日：1995-12-15

申请人： Min-Kyu Song ,  Seung-Goo Kang ,  Hee-Tae Lee ,  Nam Hwang ,  Seong-Su Park ,  Dong-Goo Kim

发明人： Min-Kyu Song ,  Seung-Goo Kang ,  Hee-Tae Lee ,  Nam Hwang ,  Seong-Su Park ,  Dong-Goo Kim

IPC分类号： G02B6/32 ,  B23K26/00 ,  B23K26/06 ,  B23K26/20 ,  G02B6/42 ,  H01S5/00 ,  G02B6/36

CPC分类号： G02B6/4237 ,  G02B6/4204 ,  G02B6/4225 ,  G02B6/4208

摘要： The present invention relates to an accurate method using laser welding for mounting an optical focusing lens utilized in a semi-conductor laser module for optical transmission and optical amplification through an optical fiber and a laser module so produced. The laser module includes an aligned laser diode, a lens fixture mounting the laser diode, a focusing lens mounted within a lens housing which in turn is mounted by a lens ring to the lens fixture. In the method, the steps include aligning mutual positions between the laser diode and the optical focusing lens in the vertical and horizontal directions so that the magnitude of the optical signal output from the optical fiber is maximized after the distance between the optical focusing lens and the optical fiber is adjusted and fixed to obtain a maximum optical coupling efficiency between the laser diode and the optical fiber. Next a laser-welding step is performed at an interval between the lens housing and the lens ring. The mutual positions between the laser diode and the optical focusing lens are aligned in the vertical and horizontal directions so that the magnitude of the optical signal output from the optical fiber is maximized. Finally a laser-welding step is performed at an interval between the lens fixture and the lens ring.

摘要翻译： 本发明涉及一种使用激光焊接的光学聚焦透镜，用于通过光纤和如此制造的激光模块在用于光传输和光放大的半导体激光器模块中安装光聚焦透镜的精确方法。 激光模块包括对准的激光二极管，安装激光二极管的透镜夹具，安装在透镜壳体内的聚焦透镜，透镜壳体又由透镜环安装到透镜夹具。 在该方法中，步骤包括在垂直和水平方向上对准激光二极管和光学聚焦透镜之间的相互位置，使得从光纤输出的光信号的大小在光聚焦透镜和 光纤被调整和固定，以获得激光二极管与光纤之间的最大光耦合效率。 接下来，在透镜壳体和透镜环之间的间隔进行激光焊接步骤。 激光二极管和光聚焦透镜之间的相互位置在垂直和水平方向上对准，使得从光纤输出的光信号的幅度最大化。 最后，以透镜夹具和透镜环之间的间隔进行激光焊接步骤。

公开(公告)号：US5612853A

公开(公告)日：1997-03-18

申请号：US381304

申请日：1995-01-31

申请人： Dong-Goo Kim ,  Min-Kyu Song ,  Seong-Su Park ,  Seung-Goo Kang ,  Hyung-Jin Yoon ,  Hyung-Moo Park

发明人： Dong-Goo Kim ,  Min-Kyu Song ,  Seong-Su Park ,  Seung-Goo Kang ,  Hyung-Jin Yoon ,  Hyung-Moo Park

IPC分类号： H01L21/52 ,  H01L23/02 ,  H01L23/04 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66 ,  H05K7/20

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/60 ,  H01L23/66 ,  H01L24/29 ,  H01L24/49 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49121

摘要： A package for a power semiconductor device is made using the method comprising the steps of preparing a lead frame including a blade or paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus. The method can be applied to produce a plastic package of a power semiconductor device at low cost. The metal cap is grounded through the tie bars as a source electrode to shield a noise.

摘要翻译： 一种用于功率半导体器件的封装是使用以下方法制造的，该方法包括以下步骤：制备包括用于在其顶表面上提供半导体芯片的叶片或桨叶的引线框架，用于支撑所述桨叶的连接杆，其中所述桨叶 水平面比引线高; 通过包覆将散热板附接在桨叶的底面上; 通过焊接将Kovar板附接在桨的顶表面上，所述Kovar板的热膨胀系数与芯片的热膨胀系数相似; 通过焊接在Kovar板上提供芯片; 将所述半导体芯片的引线接合端子分别连接到引线框架的对应引线; 通过旋涂在半导体芯片上涂覆聚酰亚胺; 固化由此涂覆的聚酰亚胺; 通过焊接在所述桨上方形成金属帽，并将成型材料注入成型机中以封闭所述桨叶并固化由此注入的模制材料。 该方法可以用于以低成本生产功率半导体器件的塑料封装。 金属盖通过连杆作为源极接地，以屏蔽噪声。

公开(公告)号：US09817128B2

公开(公告)日：2017-11-14

申请号：US14125734

申请日：2011-11-02

申请人： Youngpo Lee ,  Dahae Chong ,  Junhwan Kim ,  Seung Goo Kang ,  Seokho Yoon

发明人： Youngpo Lee ,  Dahae Chong ,  Junhwan Kim ,  Seung Goo Kang ,  Seokho Yoon

IPC分类号： G08C17/02 ,  G01S19/29 ,  G01S19/01 ,  G01S19/13 ,  G01S19/30

CPC分类号： G01S19/29 ,  G01S19/01 ,  G01S19/13 ,  G01S19/30

摘要： Disclosed herein are a method of generating a correlation function with no side-peak and a system for tracking a BOC signal in order to synchronize the BOC signal. The method of generating a correlation function includes step S1 of generating sub-correlation functions {Sl(τ)}l=0N−1, step S2 of generating a first final correlation function R0(τ) by combining some of the sub-correlation functions, and step S3 of generating a second final correlation function Rproposed(τ) by combining R0(τ) with each of the remaining sub-correlation functions that have not been used for the combination at step S2. The BOC signal is one or more of BOCsin(kn,n) and BOCcos(kn,n) signals.

公开(公告)号：US5446959A

公开(公告)日：1995-09-05

申请号：US268104

申请日：1994-07-06

申请人： Dong-Goo Kim ,  Min-Kyu Song ,  Seong-Su Park ,  Seung-Goo Kang ,  Hyung-Jin Yoon ,  Hyung-Moo Park

发明人： Dong-Goo Kim ,  Min-Kyu Song ,  Seong-Su Park ,  Seung-Goo Kang ,  Hyung-Jin Yoon ,  Hyung-Moo Park

IPC分类号： H01L21/52 ,  H01L23/02 ,  H01L23/04 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66 ,  H01R43/00

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/60 ,  H01L23/66 ,  H01L24/29 ,  H01L24/49 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49121

摘要： A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus the method can be applied to produce a plastic package of a power semiconductor device at low cost. The metal cap is grounded through the tie bars as a source electrode to shield a noise.

摘要翻译： 公开了一种封装功率半导体器件的方法，包括以下步骤：制备引线框架，该引线框架包括用于在其顶表面上提供半导体芯片的焊盘，用于支撑所述焊盘的连接杆，其中所述焊盘设置在水平表面的下方， 线索 通过包覆将散热板附接在桨叶的底面上; 通过焊接将Kovar板附接在桨的顶表面上，所述Kovar板的热膨胀系数与芯片的热膨胀系数相似; 通过焊接在Kovar板上提供芯片; 将所述半导体芯片的引线接合端子分别连接到引线框架的对应引线; 通过旋涂在半导体芯片上涂覆聚酰亚胺; 固化由此涂覆的聚酰亚胺; 通过焊接在所述焊盘上形成金属盖，并且将成型材料注入成型机中以封闭所述焊盘并固化所述方法所注入的模塑材料，可以应用于以低成本生产功率半导体器件的塑料封装。 金属盖通过连杆作为源极接地，以屏蔽噪声。

公开(公告)号：US20110274219A1

公开(公告)日：2011-11-10

申请号：US12893579

申请日：2010-09-29

申请人： Chonghan Song ,  Junhwan Kim ,  Youngpo Lee ,  Seung Goo Kang ,  Seokhe Yoon

发明人： Chonghan Song ,  Junhwan Kim ,  Youngpo Lee ,  Seung Goo Kang ,  Seokhe Yoon

IPC分类号： H04L27/06

CPC分类号： H04L27/266 ,  H04L27/2671 ,  H04L27/2675 ,  H04L27/2688 ,  H04L27/2692

摘要： Provided is an apparatus for estimating a frequency offset by one training symbol including two symbols having the same structure and value in an OFDM system. The apparatus includes a first likelihood function calculator for modeling non-Gaussian impulsive noise included in the training symbol to a Cauchy probability density function in which a characteristic exponent of a BISαS probability density function is 1, and calculating a likelihood function of a Cauchy distribution using the Cauchy probability density function, and a first frequency offset estimator for estimating an effective frequency offset value in which the likelihood function of the Cauchy distribution of the first likelihood function calculator becomes highest as a frequency offset estimation value. Thereby, it is possible to improve the performance of frequency offset estimation in non-Gaussian impulsive noise environments.

摘要翻译： 提供了一种用于在OFDM系统中估计包括具有相同结构和值的两个符号的一个训练符号的频率偏移的装置。 该装置包括：第一似然函数计算器，用于将训练符号中包含的非高斯脉冲噪声建模为其中BISαS概率密度函数的特征指数为1的柯西概率密度函数，并且使用以下方法计算柯西分布的似然函数： 柯西概率密度函数，以及用于估计有效频率偏移值的第一频率偏移估计器，其中第一似然函数计算器的柯西分布的似然函数变得最高，作为频率偏移估计值。 因此，可以提高非高斯脉冲噪声环境中的频率偏移估计的性能。

公开(公告)号：US07065867B2

公开(公告)日：2006-06-27

申请号：US10293933

申请日：2002-11-14

申请人： Woon-bae Kim ,  Hyung-jae Shin ,  Chang-ho Cho ,  Seung-goo Kang

发明人： Woon-bae Kim ,  Hyung-jae Shin ,  Chang-ho Cho ,  Seung-goo Kang

IPC分类号： H05K3/30

CPC分类号： B81C1/00269 ,  H01L21/50 ,  H01L23/10 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/163 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49789 ,  Y10T29/49794 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A hermetic sealing method, which is capable of preventing oxidation of a micro-electromechanical system (MEMS) and sealing the MEMS at a low temperature. A low temperature hermetic sealing method having a passivation layer includes depositing a junction layer, a wetting layer, and a solder layer on a prepared lid frame, depositing a first protection layer for preventing oxidation on the solder layer and forming a lid, preparing a package base on which a device is disposed, and in which a metal layer and a second protection layer are formed around the device, and assembling the lid and the package base, heating, and sealing them. The protection layer is laminated on the solder layer that is formed by the lid, thereby preventing oxidation without using a flux. The low temperature hermetic sealing method having a passivation layer is suitable for sealing a device, such as the MEMS, which is sensitive to heat, water and other by-products.

公开(公告)号：US06266470B1

公开(公告)日：2001-07-24

申请号：US09167537

申请日：1998-10-07

申请人： Seung Goo Kang ,  Min Kyu Song ,  Hee Tae Lee ,  Sang Hwan Lee ,  Nam Hwang ,  Seong Su Park

发明人： Seung Goo Kang ,  Min Kyu Song ,  Hee Tae Lee ,  Sang Hwan Lee ,  Nam Hwang ,  Seong Su Park

IPC分类号： G02B600

CPC分类号： G02B6/4201 ,  G02B6/30 ,  G02B6/4225 ,  G02B6/4237 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4267 ,  G02B6/4268 ,  G02B6/4271

摘要： An optical switch module for aligning and fixing an optical fiber array relative to an optical switch device includes an optical fiber support member for fixing the optical fiber array; a first support device forming a homo-junction with the optical fiber support member and including a first thermal deformation buffer device; and a second support device forming a hetero-junction with the first support device to support the first support device and including a second thermal deformation buffer device.

摘要翻译： 一种用于相对于光开关装置对准和固定光纤阵列的光开关模块，包括用于固定光纤阵列的光纤支撑件; 第一支撑装置，与所述光纤支撑构件形成同点，并包括第一热变形缓冲装置; 以及与所述第一支撑装置形成异质结以支撑所述第一支撑装置并包括第二热变形缓冲装置的第二支撑装置。