-
公开(公告)号：US09099326B2
公开(公告)日：2015-08-04
申请号：US14099860
申请日：2013-12-06
申请人： Yonghoon Kim , Keung Beum Kim , Inho Choi
发明人： Yonghoon Kim , Keung Beum Kim , Inho Choi
IPC分类号： H01L23/02 , H01L25/065
CPC分类号： H01L25/0657 , G11C5/025 , H01L25/0652 , H01L25/105 , H01L25/18 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： Provided is a stack-type semiconductor package comprising a first semiconductor package with a first package substrate and a logic chip mounted thereon, a second semiconductor package including a second package substrate disposed on the first semiconductor package and first and second memory chips stacked on the second package substrate, and connection pads disposed between the first and second package substrates to connect the first and second semiconductor packages electrically to each other. The first package substrate has first and second edges that are substantially perpendicular to each other. The first package substrate may include first DQ connection pads electrically connected to the first memory chip, and second DQ connection pads electrically connected to the second memory chip. The first DQ connection pads may be arranged adjacent to the first edge and the second DQ connection pads may be arranged adjacent to the second edge.
摘要翻译： 提供了一种堆叠型半导体封装，其包括具有第一封装衬底和安装在其上的逻辑芯片的第一半导体封装，第二半导体封装，包括设置在第一半导体封装上的第二封装衬底和堆叠在第二半导体封装上的第一和第二存储器芯片 封装衬底和设置在第一和第二封装衬底之间的连接焊盘，以将第一和第二半导体封装彼此电连接。 第一封装衬底具有基本上彼此垂直的第一和第二边缘。 第一封装衬底可以包括电连接到第一存储器芯片的第一DQ连接焊盘和电连接到第二存储器芯片的第二DQ连接焊盘。 第一DQ连接焊盘可以布置成与第一边缘相邻，并且第二DQ连接焊盘可以布置成与第二边缘相邻。
-
公开(公告)号：US08668460B2
公开(公告)日：2014-03-11
申请号：US13030920
申请日：2011-02-18
申请人： Sungwon Han , Inho Choi , Kyunghwan Kim , Kidong Kim
发明人： Sungwon Han , Inho Choi , Kyunghwan Kim , Kidong Kim
IPC分类号： F04D29/38
CPC分类号： F04D29/281 , F04D29/30
摘要： A turbo fan includes a main plate for rotation in a rotational direction about a rotational axis and a plurality of blades arranged at intervals around the rotational axis of the main plate. At least one blade includes: a first blade section having a leading end and a trailing end; a second blade section having a leading end and a trailing end, wherein the first blade section is between the main plate and the second blade section; and a third blade section having a leading end and a trailing end, wherein the third blade section is between the first blade section and the second blade section.
摘要翻译： 涡轮风扇包括用于沿旋转轴线旋转的方向旋转的主板和围绕主板的旋转轴线间隔开的多个叶片。 至少一个叶片包括：具有前端和后端的第一叶片部分; 第二叶片部分，其具有前端和后端，其中所述第一叶片部分在所述主板和所述第二叶片部分之间; 以及具有前端和后端的第三叶片部分，其中所述第三叶片部分在所述第一叶片部分和所述第二叶片部分之间。
-
公开(公告)号：US20120042662A1
公开(公告)日：2012-02-23
申请号：US13196146
申请日：2011-08-02
申请人： Kidong KIM , Hojung Kim , Sungwon Han , Inho Choi , Kyunghwan Kim
发明人： Kidong KIM , Hojung Kim , Sungwon Han , Inho Choi , Kyunghwan Kim
CPC分类号： F24F1/0007 , F24F1/0047 , F24F11/30 , F24F11/70 , F24F11/74 , F24F13/14 , F24F2110/00 , F24F2110/10
摘要： Provided is an indoor unit for an air conditioner buried in a ceiling and including a heat exchanger with respect to an indoor space defined by a bottom surface, the ceiling, and a plurality of wall surface, including: a front panel where a suction part suctioning air of the indoor space; a discharge hole placed on at least one side of the suction part and discharging heat-exchanged air from the heat exchanger; an opening member provided movably to selectively open the discharge hole; a distance sensing unit sensing at least one of a distance up to the bottom surface from the front panel or the indoor unit and a distance up to the wall surface from the indoor unit; and a controller controlling the opening degree of the opening member based on a sensing result sensed by the distance sensing unit.
摘要翻译： 本发明提供一种埋藏在天花板中的空调机的室内机，其具有由底面，天花板和多个壁面构成的室内空间的热交换器，所述室内机组包括：前面板，吸入部抽吸 室内空气; 排出孔，其设置在所述吸引部的至少一侧，并从所述热交换器排出热交换空气; 打开构件，其可移动地设置成选择性地打开排出孔; 距离感测单元，感测距离前面板或室内单元直到底面的距离中的至少一个，距离室内单元的墙壁的距离; 以及控制器，其基于由所述距离感测单元感测到的感测结果来控制所述打开构件的开度。
-
公开(公告)号：US20110025480A1
公开(公告)日：2011-02-03
申请号：US12841004
申请日：2010-07-21
申请人： Hyokune HWANG , Inho Choi , Jaeyeol Kim , Sunuk Kim , Jaecheon Sa , Munchae Joung
发明人： Hyokune HWANG , Inho Choi , Jaeyeol Kim , Sunuk Kim , Jaecheon Sa , Munchae Joung
IPC分类号： H04B3/36
CPC分类号： H04M19/047
摘要： A mobile device for controlling a vibration includes an input unit configured to receive an input from a user or an external device; an output unit configured to generate an output; a vibration pattern generation unit configured to generate a vibration, and to move a center of the vibration within the mobile device according to the input from the input unit or the output from the output unit; and a control unit configured to control the vibration pattern generation unit so as to create a moving vibration sensation from a movement of the center of the vibration.
摘要翻译： 一种用于控制振动的移动设备包括被配置为从用户或外部设备接收输入的输入单元; 输出单元，被配置为生成输出; 振动模式生成单元，其被配置为产生振动，并且根据来自所述输入单元的输入或所述输出单元的输出来移动所述移动设备内的所述振动的中心; 以及控制单元，其被配置为控制所述振动模式生成单元，以根据所述振动的中心的运动产生移动的振动。
-
公开(公告)号：US08466778B2
公开(公告)日：2013-06-18
申请号：US12840988
申请日：2010-07-21
申请人： Hyokune Hwang , Inho Choi , Sunuk Kim , Jaecheon Sa , Munchae Joung
发明人： Hyokune Hwang , Inho Choi , Sunuk Kim , Jaecheon Sa , Munchae Joung
CPC分类号： H04M19/047 , B06B1/0207 , B06B1/045 , B06B2201/53 , B06B2201/70 , G06F3/016 , H04M1/026
摘要： An apparatus for controlling a vibration includes a vibration transfer unit; at least one pair of oscillators disposed spaced apart from each other in the vibration transfer unit, and configured to generate a vibration in the vibration transfer unit; at least one driver configured to selectively drive the at least one pair of oscillators; and a controller configured to control the at least one driver and thereby move a center of the vibration within the vibration transfer unit so as to create a moving vibration sensation.
摘要翻译： 用于控制振动的装置包括振动传递单元; 至少一对振荡器，其在所述振动传递单元中彼此间隔开设置，并且构造成在所述振动传递单元中产生振动; 至少一个驱动器，被配置为选择性地驱动所述至少一对振荡器; 以及控制器，被配置为控制所述至少一个驱动器，从而移动所述振动传递单元内的振动的中心，以产生移动的振动。
-
公开(公告)号：US20140246788A1
公开(公告)日：2014-09-04
申请号：US14099860
申请日：2013-12-06
申请人： YONGHOON KIM , KEUNG BEUM KIM , INHO CHOI
发明人： YONGHOON KIM , KEUNG BEUM KIM , INHO CHOI
IPC分类号： H01L25/065
CPC分类号： H01L25/0657 , G11C5/025 , H01L25/0652 , H01L25/105 , H01L25/18 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： Provided is a stack-type semiconductor package comprising a first semiconductor package with a first package substrate and a logic chip mounted thereon, a second semiconductor package including a second package substrate disposed on the first semiconductor package and first and second memory chips stacked on the second package substrate, and connection pads disposed between the first and second package substrates to connect the first and second semiconductor packages electrically to each other. The first package substrate has first and second edges that are substantially perpendicular to each other. The first package substrate may include first DQ connection pads electrically connected to the first memory chip, and second DQ connection pads electrically connected to the second memory chip. The first DQ connection pads may be arranged adjacent to the first edge and the second DQ connection pads may be arranged adjacent to the second edge.
摘要翻译： 提供了一种堆叠型半导体封装，其包括具有第一封装衬底和安装在其上的逻辑芯片的第一半导体封装，第二半导体封装，包括设置在第一半导体封装上的第二封装衬底和堆叠在第二半导体封装上的第一和第二存储器芯片 封装衬底和设置在第一和第二封装衬底之间的连接焊盘，以将第一和第二半导体封装彼此电连接。 第一封装衬底具有基本上彼此垂直的第一和第二边缘。 第一封装衬底可以包括电连接到第一存储器芯片的第一DQ连接焊盘和电连接到第二存储器芯片的第二DQ连接焊盘。 第一DQ连接焊盘可以布置成与第一边缘相邻，并且第二DQ连接焊盘可以布置成与第二边缘相邻。
-
公开(公告)号：US08451103B2
公开(公告)日：2013-05-28
申请号：US12841004
申请日：2010-07-21
申请人： Hyokune Hwang , Inho Choi , Jaeyeol Kim , Sunuk Kim , Jaecheon Sa , Munchae Joung
发明人： Hyokune Hwang , Inho Choi , Jaeyeol Kim , Sunuk Kim , Jaecheon Sa , Munchae Joung
IPC分类号： H04B3/36
CPC分类号： H04M19/047
摘要： A mobile device for controlling a vibration includes an input unit configured to receive an input from a user or an external device; an output unit configured to generate an output; a vibration pattern generation unit configured to generate a vibration, and to move a center of the vibration within the mobile device according to the input from the input unit or the output from the output unit; and a control unit configured to control the vibration pattern generation unit so as to create a moving vibration sensation from a movement of the center of the vibration.
摘要翻译： 一种用于控制振动的移动设备包括被配置为从用户或外部设备接收输入的输入单元; 输出单元，被配置为生成输出; 振动模式生成单元，其被配置为产生振动，并且根据来自所述输入单元的输入或所述输出单元的输出来移动所述移动设备内的所述振动的中心; 以及控制单元，被配置为控制所述振动模式生成单元，以根据所述振动的中心的运动产生移动的振动。
-
公开(公告)号：US20110025479A1
公开(公告)日：2011-02-03
申请号：US12840988
申请日：2010-07-21
申请人： Hyokune HWANG , Inho Choi , Sunuk Kim , Jaecheon Sa , Munchae Joung
发明人： Hyokune HWANG , Inho Choi , Sunuk Kim , Jaecheon Sa , Munchae Joung
IPC分类号： H04B3/36
CPC分类号： H04M19/047 , B06B1/0207 , B06B1/045 , B06B2201/53 , B06B2201/70 , G06F3/016 , H04M1/026
摘要： An apparatus for controlling a vibration includes a vibration transfer unit; at least one pair of oscillators disposed spaced apart from each other in the vibration transfer unit, and configured to generate a vibration in the vibration transfer unit; at least one driver configured to selectively drive the at least one pair of oscillators; and a controller configured to control the at least one driver and thereby move a center of the vibration within the vibration transfer unit so as to create a moving vibration sensation.
摘要翻译： 用于控制振动的装置包括振动传递单元; 至少一对振荡器，其在所述振动传递单元中彼此间隔开设置，并且构造成在所述振动传递单元中产生振动; 至少一个驱动器，被配置为选择性地驱动所述至少一对振荡器; 以及控制器，被配置为控制所述至少一个驱动器，从而移动所述振动传递单元内的振动的中心，以产生移动的振动。
-
-
公开(公告)号：US20140217586A1
公开(公告)日：2014-08-07
申请号：US14047120
申请日：2013-10-07
申请人： Yonghoon KIM , Hyo-Soon KANG , Inho CHOI
发明人： Yonghoon KIM , Hyo-Soon KANG , Inho CHOI
IPC分类号： H01L25/065 , H01L23/00
CPC分类号： H01L25/105 , H01L23/3128 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/04042 , H01L2224/06135 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/00012 , H01L2924/00
摘要： A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package. Further, data and command pads of a logic chip may be located to be adjacent to data and command pads of the memory chips. Accordingly, a routing distance between pads can be contracted and thus signal delivery speed can be improved. This makes it possible to improve an operation speed of the device.
摘要翻译： 包装封装器件在封装衬底上并排地包括存储器芯片。 因此，可以减小半导体封装的厚度。 此外，逻辑芯片的数据和指令板可以被定位成与存储器芯片的数据和指令焊盘相邻。 因此，焊盘之间的布线距离可以缩小，因此可以提高信号传送速度。 这使得可以提高装置的操作速度。
-
-
-
-
-
-
-
-
-
搜索结果
19 条记录 (耗时 0.017 秒)
