公开(公告)号：US20140225236A1

公开(公告)日：2014-08-14

申请号：US14254969

申请日：2014-04-17

申请人： Yong-Hoon KIM ,  In-Ho CHOI ,  Keung-Beum KIM

发明人： Yong-Hoon KIM ,  In-Ho CHOI ,  Keung-Beum KIM

IPC分类号： H01L23/552 ,  H01L21/48

CPC分类号： H01L23/552 ,  H01L21/4814 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3192 ,  H01L23/49816 ,  H01L23/5225 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.

摘要翻译： 提供半导体器件，半导体封装和电子器件。 电子设备包括设置在电路基板上的第一半导体封装。 第二半导体封装设置在电路基板上并与第一半导体封装间隔开。 绝缘电磁屏蔽结构设置在第一半导体封装的顶表面和侧表面上。 导电电磁屏蔽结构设置在电路基板上以覆盖第一和第二半导体封装和绝缘电磁屏蔽结构。

公开(公告)号：US08736032B2

公开(公告)日：2014-05-27

申请号：US13437285

申请日：2012-04-02

申请人： Yong-Hoon Kim ,  In-Ho Choi ,  Keung-Beum Kim

发明人： Yong-Hoon Kim ,  In-Ho Choi ,  Keung-Beum Kim

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L21/4814 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3192 ,  H01L23/49816 ,  H01L23/5225 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.

摘要翻译： 提供半导体器件，半导体封装和电子器件。 电子设备包括设置在电路基板上的第一半导体封装。 第二半导体封装设置在电路基板上并与第一半导体封装间隔开。 绝缘电磁屏蔽结构设置在第一半导体封装的顶表面和侧表面上。 导电电磁屏蔽结构设置在电路基板上以覆盖第一和第二半导体封装和绝缘电磁屏蔽结构。

公开(公告)号：US10553514B2

公开(公告)日：2020-02-04

申请号：US14972341

申请日：2015-12-17

申请人： Keung Beum Kim ,  Wonchul Lim ,  Dongsuk Kim ,  Yonghoon Kim

发明人： Keung Beum Kim ,  Wonchul Lim ,  Dongsuk Kim ,  Yonghoon Kim

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/31 ,  H01L23/498

摘要： A substrate includes a substrate body including a plurality of chip mounting regions and a peripheral region surrounding the plurality of chip mounting regions, each of the chip mounting regions including a conductive plane. The substrate further includes a conductive support structure located in the peripheral region, first conductive lines connected between the conductive planes of adjacent chip mounting regions, and second conductive lines connected between the conductive support structure and the conductive planes of chip mounting regions located adjacent the peripheral region.

公开(公告)号：US10037938B2

公开(公告)日：2018-07-31

申请号：US15499233

申请日：2017-04-27

申请人： Keung Beum Kim ,  Hyunjong Moon ,  Seung-Yong Cha

发明人： Keung Beum Kim ,  Hyunjong Moon ,  Seung-Yong Cha

IPC分类号： H01L23/538 ,  H01L25/10 ,  H01L23/522 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L25/11

CPC分类号： H01L23/5227 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/19 ,  H01L24/20 ,  H01L24/46 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/14131 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/96 ,  H01L2225/0652 ,  H01L2225/1017 ,  H01L2225/107 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/19105 ,  H05K2201/10378 ,  H01L2924/00014

摘要： A semiconductor package includes a first package and a second package stacked on the first package. The first package includes a redistribution substrate, a first semiconductor chip on the redistribution substrate, a connection substrate provided on the redistribution substrate to surround the first semiconductor chip as viewed in plan, and an inductor structure provided within a first region of the connection substrate and electrically connected to the first semiconductor chip through the redistribution substrate. The second package includes at least one outer terminal electrically connected to the first package. The outer terminal is provided on a second region of the connection substrate, and when viewed in plan, the first region and the second region are spaced apart from each other.

公开(公告)号：US20120074540A1

公开(公告)日：2012-03-29

申请号：US13181920

申请日：2011-07-13

申请人： Kyong-Soon CHO ,  Chang-Su KIM ,  Kwan-Jai LEE ,  Kyoung-Sei CHOI ,  Jae-Hyok KO ,  Keung-Beum Kim

发明人： Kyong-Soon CHO ,  Chang-Su KIM ,  Kwan-Jai LEE ,  Kyoung-Sei CHOI ,  Jae-Hyok KO ,  Keung-Beum Kim

IPC分类号： H01L23/552

CPC分类号： H01L23/60 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A structure of a semiconductor chip package is provided. The semiconductor chip package includes: a substrate; a semiconductor chip mounted on a first surface of the substrate; a plurality of electrode pads on a second surface, different from the first surface, of the substrate; and an electrostatic discharge protection pad overlapping a portion of a first electrode pad and a portion of a second electrode pad among the plurality of electrode pads.

摘要翻译： 提供半导体芯片封装的结构。 半导体芯片封装包括：基板; 安装在所述基板的第一表面上的半导体芯片; 与基板的第一表面不同的第二表面上的多个电极焊盘; 以及与所述多个电极焊盘中的第一电极焊盘的一部分和第二电极焊盘的一部分重叠的静电放电保护焊盘。

公开(公告)号：US09557616B2

公开(公告)日：2017-01-31

申请号：US13242394

申请日：2011-09-23

申请人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

发明人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

IPC分类号： G06F3/038 ,  H03K3/00 ,  G02F1/1345

CPC分类号： H01L27/1244 ,  G02F1/13452 ,  G09G3/20 ,  G09G2300/0426 ,  G09G2310/08 ,  G09G2330/021 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13124 ,  H01L2224/13639 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/1426 ,  H05K1/148

摘要： An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

摘要翻译： 图像显示面板组件包括柔性印刷电路（FPC），图像显示面板，栅极驱动器集成电路（IC）封装以及源极驱动器IC封装。 FPC被配置为接收门和源驱动信号。 图像显示面板电连接到FPC，并且包括沿着图像显示面板的第一边缘的栅极驱动信号传递图案，沿着与第一端相邻的第二边缘的源极驱动信号传递图案，以及多个像素 。 栅极驱动器集成电路（IC）封装被配置为通过栅极驱动信号传输图案接收栅极驱动信号，并将栅极驱动信号提供给多个像素。 源极驱动器IC封装被配置为通过源极驱动信号传输图案接收源极驱动信号，并将源极驱动信号提供给多个像素。

公开(公告)号：US20160181195A1

公开(公告)日：2016-06-23

申请号：US14972341

申请日：2015-12-17

申请人： KEUNG BEUM KIM ,  WONCHUL LIM ,  DONGSUK KIM ,  YONGHOON KIM

发明人： KEUNG BEUM KIM ,  WONCHUL LIM ,  DONGSUK KIM ,  YONGHOON KIM

IPC分类号： H01L23/498 ,  H01L23/31

摘要： A substrate includes a substrate body including a plurality of chip mounting regions and a peripheral region surrounding the plurality of chip mounting regions, each of the chip mounting regions including a conductive plane. The substrate further includes a conductive support structure located in the peripheral region, first conductive lines connected between the conductive planes of adjacent chip mounting regions, and second conductive lines connected between the conductive support structure and the conductive planes of chip mounting regions located adjacent the peripheral region.

摘要翻译： 基板包括：基板主体，包括多个芯片安装区域和围绕多个芯片安装区域的周边区域，每个芯片安装区域包括导电平面。 基板还包括位于周边区域中的导电支撑结构，连接在相邻芯片安装区域的导电平面之间的第一导电线和连接在导电支撑结构与位于周边的芯片安装区域的导电平面之间的第二导线 地区。

公开(公告)号：US20140246788A1

公开(公告)日：2014-09-04

申请号：US14099860

申请日：2013-12-06

申请人： YONGHOON KIM ,  KEUNG BEUM KIM ,  INHO CHOI

发明人： YONGHOON KIM ,  KEUNG BEUM KIM ,  INHO CHOI

IPC分类号： H01L25/065

CPC分类号： H01L25/0657 ,  G11C5/025 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a stack-type semiconductor package comprising a first semiconductor package with a first package substrate and a logic chip mounted thereon, a second semiconductor package including a second package substrate disposed on the first semiconductor package and first and second memory chips stacked on the second package substrate, and connection pads disposed between the first and second package substrates to connect the first and second semiconductor packages electrically to each other. The first package substrate has first and second edges that are substantially perpendicular to each other. The first package substrate may include first DQ connection pads electrically connected to the first memory chip, and second DQ connection pads electrically connected to the second memory chip. The first DQ connection pads may be arranged adjacent to the first edge and the second DQ connection pads may be arranged adjacent to the second edge.

摘要翻译： 提供了一种堆叠型半导体封装，其包括具有第一封装衬底和安装在其上的逻辑芯片的第一半导体封装，第二半导体封装，包括设置在第一半导体封装上的第二封装衬底和堆叠在第二半导体封装上的第一和第二存储器芯片 封装衬底和设置在第一和第二封装衬底之间的连接焊盘，以将第一和第二半导体封装彼此电连接。 第一封装衬底具有基本上彼此垂直的第一和第二边缘。 第一封装衬底可以包括电连接到第一存储器芯片的第一DQ连接焊盘和电连接到第二存储器芯片的第二DQ连接焊盘。 第一DQ连接焊盘可以布置成与第一边缘相邻，并且第二DQ连接焊盘可以布置成与第二边缘相邻。

公开(公告)号：US20120075268A1

公开(公告)日：2012-03-29

申请号：US13242394

申请日：2011-09-23

申请人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

发明人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

IPC分类号： G09G5/00 ,  H03L5/00

CPC分类号： H01L27/1244 ,  G02F1/13452 ,  G09G3/20 ,  G09G2300/0426 ,  G09G2310/08 ,  G09G2330/021 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13124 ,  H01L2224/13639 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/1426 ,  H05K1/148

摘要： An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

摘要翻译： 图像显示面板组件包括柔性印刷电路（FPC），图像显示面板，栅极驱动器集成电路（IC）封装以及源极驱动器IC封装。 FPC被配置为接收门和源驱动信号。 图像显示面板电连接到FPC，并且包括沿着图像显示面板的第一边缘的栅极驱动信号传递图案，沿着与第一端相邻的第二边缘的源极驱动信号传递图案，以及多个像素 。 栅极驱动器集成电路（IC）封装被配置为通过栅极驱动信号传输图案接收栅极驱动信号，并将栅极驱动信号提供给多个像素。 源极驱动器IC封装被配置为通过源极驱动信号传输图案接收源极驱动信号，并将源极驱动信号提供给多个像素。

公开(公告)号：US20180122772A1

公开(公告)日：2018-05-03

申请号：US15499233

申请日：2017-04-27

申请人： KEUNG BEUM KIM ,  HYUNJONG MOON ,  SEUNG-YONG CHA

发明人： KEUNG BEUM KIM ,  HYUNJONG MOON ,  SEUNG-YONG CHA

IPC分类号： H01L25/065 ,  H01L23/522 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L23/5227 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/19 ,  H01L24/20 ,  H01L24/46 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/14131 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/96 ,  H01L2225/0652 ,  H01L2225/1017 ,  H01L2225/107 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/19105 ,  H05K2201/10378 ,  H01L2924/00014

摘要： A semiconductor package includes a first package and a second package stacked on the first package. The first package includes a redistribution substrate, a first semiconductor chip on the redistribution substrate, a connection substrate provided on the redistribution substrate to surround the first semiconductor chip as viewed in plan, and an inductor structure provided within a first region of the connection substrate and electrically connected to the first semiconductor chip through the redistribution substrate. The second package includes at least one outer terminal electrically connected to the first package. The outer terminal is provided on a second region of the connection substrate, and when viewed in plan, the first region and the second region are spaced apart from each other.