MAGNETIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    MAGNETIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    磁性装置及其制造方法

    公开(公告)号:US20140021426A1

    公开(公告)日:2014-01-23

    申请号:US13927090

    申请日:2013-06-25

    Abstract: A magnetic device comprises a memory cell comprising a magnetic resistance device and lower and upper electrodes with the magnetic resistance device interposed therebetween to apply current to the magnetic resistance device. The magnetic resistance device includes: a buffer layer for controlling a crystalline axis for inducing perpendicular magnetic anisotropy (PMA) in the magnetic resistance device, the buffer layer being in contact with the lower electrode; a seed layer being in contact with the buffer layer and being oriented to a hexagonal close-packed lattice (HCP) (0001) crystal plane; and a perpendicularly magnetized pinned layer being in contact with the seed layer and having an L11 type ordered structure.

    Abstract translation: 一种磁性装置包括一个包含一个磁阻装置的存储单元和一个介于它们之间的磁阻装置的下电极和上电极,以向磁阻装置施加电流。 磁阻元件包括:缓冲层,用于控制在磁阻器件中引起垂直磁各向异性(PMA)的晶轴,缓冲层与下电极接触; 种子层与缓冲层接触并取向为六方密堆积晶格(HCP)(0001)晶面; 并且垂直磁化的钉扎层与种子层接触并且具有L11型有序结构。

    METHODS OF MANUFACTURING MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICES
    4.
    发明申请
    METHODS OF MANUFACTURING MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICES 审中-公开
    制造磁性随机访问存储器件的方法

    公开(公告)号:US20150207064A1

    公开(公告)日:2015-07-23

    申请号:US14505995

    申请日:2014-10-03

    CPC classification number: H01L43/12 G11C11/161 H01L27/228 H01L43/10

    Abstract: A MRAM device may include a fixed layer pattern on a substrate, a first tunnel barrier layer pattern on the fixed layer pattern, a free layer pattern on the first tunnel barrier layer pattern, a second tunnel barrier layer pattern on the free layer pattern, the second tunnel barrier layer pattern including a metal oxide, and a capping layer pattern on the second tunnel barrier layer pattern. The capping layer pattern including a metal may have an oxide layer formation energy lower than the oxide layer formation energy of tantalum.

    Abstract translation: MRAM器件可以包括衬底上的固定层图案,固定层图案上的第一隧道势垒层图案,第一隧道势垒层图案上的自由层图案,自由层图案上的第二隧道势垒层图案, 包括金属氧化物的第二隧道势垒层图案和在第二隧道势垒层图案上的覆盖层图案。 包含金属的覆盖层图案可以具有比钽的氧化物层形成能低的氧化层形成能。

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