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公开(公告)号：US12011777B2
公开(公告)日：2024-06-18
申请号：US16768681
申请日：2018-10-30
IPC分类号： B23K26/03 , B23K26/50 , B23K101/40 , H01L21/268
CPC分类号： B23K26/032 , B23K26/50 , H01L21/268 , B23K2101/40
摘要： A laser processing apparatus (1) according to an embodiment includes a processing chamber (18) configured to perform laser processing for an object to be processed (40), a stage (10) disposed inside the processing chamber (18), the stage being configured to convey the object to be processed (40), and a control unit (50) configured to instruct a loading/unloading apparatus (30) about a placement position of the object to be processed (40) over the stage (10), the loading/unloading apparatus (30) being configured to load/unload the object to be processed (40) into/from the processing chamber (18). Further, the processing chamber (18) includes a loading gate (17a) for loading and an unloading gate (17b) for unloading for the object to be processed (40), and the object to be processed (40) is conveyed only in a first direction from the loading gate (17a) toward the unloading gate (17b) over the stage (10).
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2.发明公开公开(公告)号：US20240112910A1
公开(公告)日：2024-04-04
申请号：US18538152
申请日：2023-12-13
发明人： Kenichi OHMORI , Suk-Hwan CHUNG , Ryosuke SATO , Nobuo OKU
IPC分类号： H01L21/02 , B23K26/03 , H01L21/268
CPC分类号： H01L21/02675 , B23K26/032 , H01L21/268
摘要： A laser annealing apparatus according to an embodiment includes a laser light source, an annealing optical system, a linear irradiation region along a Y-direction, a moving mechanism configured to change a relative position of the irradiation region with respect to the substrate along an X-direction, an illumination light source configured to generate illumination light for illuminating the substrate along a third direction, and a detector configured to detect detection light reflected, in a fourth direction, on the substrate illuminated by the illumination light so as to photograph an annealed part of the substrate in a linear field of view along the Y-direction. In a YZ-plane view, the third direction is inclined from the vertical direction and the fourth direction is inclined from the vertical direction.
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3.发明授权公开(公告)号：US11894229B2
公开(公告)日：2024-02-06
申请号：US17375445
申请日：2021-07-14
发明人： Kenichi Ohmori , Suk-Hwan Chung , Ryosuke Sato , Nobuo Oku
IPC分类号： H01L21/02 , B23K26/03 , H01L21/268
CPC分类号： H01L21/02675 , B23K26/032 , H01L21/268
摘要： A laser annealing apparatus according to an embodiment includes a laser light source, an annealing optical system, a linear irradiation region along a Y-direction, a moving mechanism configured to change a relative position of the irradiation region with respect to the substrate along an X-direction, an illumination light source configured to generate illumination light for illuminating the substrate along a third direction, and a detector configured to detect detection light reflected, in a fourth direction, on the substrate illuminated by the illumination light so as to photograph an annealed part of the substrate in a linear field of view along the Y-direction. In a YZ-plane view, the third direction is inclined from the vertical direction and the fourth direction is inclined from the vertical direction.
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公开(公告)号：US11842898B2
公开(公告)日：2023-12-12
申请号：US17259166
申请日：2019-06-19
发明人： Suk-Hwan Chung , Masashi Machida
IPC分类号： H01L21/268 , B23K26/08 , H01L21/02 , H01L21/20 , B23K101/40 , B23K26/03 , B23K26/0622 , B23K26/12 , B23K26/352 , B23K26/00
CPC分类号： H01L21/268 , B23K26/08 , H01L21/02675 , H01L21/20 , B23K2101/40
摘要： Quality of a crystalline film is improved. In a method for manufacturing a panel, a polysilicon film is formed by emission of laser light to an amorphous silicon film 3A through a light-transmittable member 4 that can transmit the laser light.
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公开(公告)号：US20230001518A1
公开(公告)日：2023-01-05
申请号：US17749445
申请日：2022-05-20
发明人： Kenichi Ohmori , Yuzaburo Ohta , Rei Matsushita
摘要： A laser irradiation apparatus is a laser irradiation apparatus including a laser light source, the laser irradiation apparatus including a failure prediction unit configured to perform failure prediction on a movable part used when a substrate is processed by the laser light source, in which the failure prediction unit acquires a physical quantity when the movable part is movable, and derives a failure time of the movable part based on an acquired physical quantity.
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公开(公告)号：US12103790B2
公开(公告)日：2024-10-01
申请号：US17149103
申请日：2021-01-14
CPC分类号： B65G51/03 , B23K26/083 , B23K26/50 , B65G49/065 , H01L21/67115 , H01L21/67784
摘要： A flotation conveyance apparatus according to an embodiment conveys a substrate while floating the substrate by ejecting a gas to a lower surface of the substrate. The flotation conveyance apparatus includes an upper plate disposed on the substrate side including a plurality of ejecting ports for ejecting the gas and a lower plate disposed under the upper plate. Flow-paths for supplying the gas to the plurality of ejecting ports are provided on at least one of the upper plate and the lower plate.
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公开(公告)号：US12090570B2
公开(公告)日：2024-09-17
申请号：US18373617
申请日：2023-09-27
IPC分类号： B23K26/035 , B23K26/384 , B23K101/40
CPC分类号： B23K26/035 , B23K26/384 , B23K2101/40
摘要： A laser processing apparatus and a laser processing method that can effectively prevent a processing time for one semiconductor film from increasing are provided. A laser processing apparatus (1) according to an embodiment includes a laser light source (2) configured to irradiate a semiconductor film (M1) with a laser beam, a film state measuring instrument (5) configured to measure a state of the semiconductor film after the semiconductor film (M1) is irradiated with the laser beam, and a laser light adjusting mechanism configured to adjust a timing at which the semiconductor film (M1) is irradiated with a next laser beam and intensity of the laser beam according to the state of the semiconductor film (M1) measured by the film state measuring instrument (5).
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公开(公告)号：US11964342B2
公开(公告)日：2024-04-23
申请号：US17594127
申请日：2019-11-29
发明人： Teruaki Shimoji , Daisuke Ito , Tatsuro Matsushima , Ryo Shimizu
IPC分类号： B23K26/08 , B23K26/073 , H01L21/26 , H01L21/268 , H01L21/67 , B23K101/40
CPC分类号： B23K26/083 , B23K26/0732 , H01L21/268 , H01L21/67115 , B23K2101/40
摘要： A laser processing apparatus includes: a stage 2 capable of levitating and transporting a substrate 3 by jetting gas from a front surface; a laser oscillator configured to irradiate a laser beam 20a onto the substrate 3; and a gas jetting port arranged at a position overlapping a focus point position of the laser beam 20a in plan view, and being configured to jet inert gas. The front surface of the stage 2 is constituted by upper structures 5a and 5b, and the upper structures 5a and 5b are arranged so as to be spaced apart from each other and face each other. A gap between the upper structures 5a and 5b overlaps the focus point position of the laser beam 20a in plan view. A filling member 8 is arranged between the upper structures 5a and 5b so as to fill the gap between the upper structures 5a and 5b.
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公开(公告)号：US11938563B2
公开(公告)日：2024-03-26
申请号：US16342151
申请日：2017-10-10
发明人： Suk-Hwan Chung
IPC分类号： B23K26/10 , B23K26/08 , B23K26/082 , H01L21/20 , H01L21/268 , H01L21/683
CPC分类号： B23K26/103 , B23K26/082 , B23K26/083 , H01L21/20 , H01L21/268 , H01L21/683
摘要： An annealed workpiece manufacturing method of irradiating a workpiece with laser light and annealing the workpiece includes a support step of supporting the workpiece, and an irradiation step of irradiating the supported workpiece with the laser light. In the support step, at least in a laser light irradiation area for the workpiece, the workpiece is supported by a cam member whose upper end height position is adjusted according to a rotation position.
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公开(公告)号：US11355364B2
公开(公告)日：2022-06-07
申请号：US15769721
申请日：2016-10-25
发明人： Daisuke Ito , Junichi Shida
IPC分类号： H01L21/67 , B23K26/14 , B23K26/142 , C03B25/02 , B23K26/073 , B23K26/08 , B23K26/352 , B23K26/0622 , B23K26/354 , H01L21/02 , B23K103/00 , B23K101/40 , B23K101/18
摘要： A laser treatment device performing treatment by irradiating a target object having a plate surface with laser light, including: a light-transmitting region transmitting laser light emitted onto the target object; a rectifier that has a rectifier surface separated from the target object and extending along the plate surface of the target object and outward from the end of the light-transmitting region; a gas supply unit that feeds a gas to a gap between one side of the rectifier surface and the light-transmitting region, in a position separated from the light-transmitting region; and a gas exhaust unit that exhausts, on the other side that is on the other side of the light-transmitting region from the one side, the gas present in a gap between the rectifier surface and the target object from the gap, in a position separated from the light-transmitting region, thereby generating a stable local gas atmosphere.
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