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公开(公告)号：US08450931B2
公开(公告)日：2013-05-28
申请号：US11883992
申请日：2006-05-09
Applicant: Khristopher Edward Alvarez , Nick Evan Shephard , James Steven Tonge
Inventor： Khristopher Edward Alvarez , Nick Evan Shephard , James Steven Tonge
IPC: H01J17/49
CPC classification number: C09D5/086 , H01J9/02 , H01J11/10 , H01J11/22 , H01J2211/225 , H01L21/76838 , H05K3/285 , H05K3/323 , H05K2201/0769 , H05K2203/124
Abstract: A process for reducing Ag electromigration in electronic circuitry includes the step of treating the electronic circuitry with an electromigration resistant composition. This process is useful in fabricating electronic devices having electronic circuitry that is close together, such as resistors, capacitors, and displays, e.g., a plasma display panel (PDP) or a liquid crystal display (LCD).
Abstract translation: 用于减少电子电路中的Ag电迁移的方法包括用电迁移组合物处理电子电路的步骤。 该方法在制造具有诸如电阻器，电容器和显示器（例如等离子体显示面板（PDP）或液晶显示器（LCD））之类的紧密结合的电子电路的电子设备中是有用的。
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公开(公告)号：US07732543B2
公开(公告)日：2010-06-08
申请号：US11792063
申请日：2005-12-13
Applicant: Cheryl Lynn Loch , Dongchan Ahn , Nick Evan Shephard , James Steven Tonge , Patricia Ann Olney
Inventor： Cheryl Lynn Loch , Dongchan Ahn , Nick Evan Shephard , James Steven Tonge , Patricia Ann Olney
IPC: C08F4/52
CPC classification number: C08F230/06 , C08K5/55 , C08L83/06 , Y10T428/24612 , C08L83/00 , C08L2666/28
Abstract: Curable compositions contain (i) a free radical polymerizable organosilicon monomer, oligomer or polymer; (ii) an organoborane amine complex; optionally (iii) an amine reactive compound having amine reactive groups; and optionally (iv) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The curable compositions can be used as a rubber, tape, adhesive, foam, pressure sensitive adhesive, protective coating, thin film, thermoplastic monolithic molded part, thermosetting monolithic molded part, sealant, gasket, seal, or o-ring, die attachment adhesive, lid sealant, encapsulant, potting compound, or conformal coating. The compositions can also be used in composite articles of manufacture such as integrally bonded device including electrical and electronic connectors and scuba diving masks, in which substrates are coated or bonded together with the composition and cured.
Abstract translation: 可固化组合物含有（i）可自由基聚合的有机硅单体，低聚物或聚合物; （ii）有机硼烷胺络合物; 任选地（iii）具有胺反应性基团的胺反应性化合物; 和（iv）当与含有活性氢和催化剂的化合物混合时能产生气体的组分。 可固化组合物可用作橡胶，胶带，粘合剂，泡沫，压敏粘合剂，保护涂层，薄膜，热塑性整体模制部件，热固性整体模制部件，密封剂，垫圈，密封件或O形环，模具附接胶 ，盖密封剂，密封剂，灌封化合物或保形涂层。 组合物还可以用于复合制品中，例如包括电气和电子连接器的整体结合的装置和水肺潜水面罩，其中将基材与组合物一起涂布或粘合在一起并固化。
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公开(公告)号：US20090102089A1
公开(公告)日：2009-04-23
申请号：US12087081
申请日：2007-01-23
Applicant: Wei Chen , Brian Robert Harkness , Sina Maghsoodi , James Steven Tonge
Inventor： Wei Chen , Brian Robert Harkness , Sina Maghsoodi , James Steven Tonge
IPC: B29C33/40
CPC classification number: C08G59/22 , B82Y10/00 , B82Y40/00 , C08G59/38 , C08G59/68 , G03F7/0002 , G03F7/038
Abstract: A method for preparing a patterned feature includes the steps of I) casting a curable silicone composition against a master, II) curing the curable silicone composition to form a silicone mold, II) separating the master and the silicone mold, IV) filling a silicone mold having a patterned surface with a curable epoxy formulation; V) curing the curable epoxy formulation to form a patterned feature; VI) separating the silicone mold and the patterned feature; optionally VIII) etching the patterned feature; optionally IX) cleaning the silicone mold; and optionally X) repeating steps IV) to IX) reusing the silicone mold.
Abstract translation: 制备图案特征的方法包括以下步骤：I）将可固化的聚硅氧烷组合物压在母体上，II）固化可固化的硅氧烷组合物以形成硅氧烷模具，II）分离母体和硅氧烷模具，IV）填充硅树脂 模具具有带有可固化环氧树脂配方的图案化表面; V）固化可固化环氧树脂制剂以形成图案化特征; VI）分离有机硅模具和图案特征; 任选地VIII）蚀刻图案特征; 可选择IX）清洁硅胶模具; 和任选的X）重复步骤IV）至IX）重复使用硅氧烷模具。
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公开(公告)号：US07449536B2
公开(公告)日：2008-11-11
申请号：US10538682
申请日：2003-12-17
Applicant: Brian Douglas Chapman , Loren Dean Durfee , Timothy Paul Mitchell , James Steven Tonge , Paul Cornelius Vandort
Inventor： Brian Douglas Chapman , Loren Dean Durfee , Timothy Paul Mitchell , James Steven Tonge , Paul Cornelius Vandort
CPC classification number: C08G77/38 , C08G77/06 , C08G77/10 , C08G77/44 , C08G77/442 , C08G77/50 , C08L83/14 , C08L83/00
Abstract: A method comprising heating in the presence of a catalyst, a mixture comprising (i) a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation; (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form branched polymers.
Abstract translation: 一种方法，包括在催化剂存在下加热，所述混合物包含（i）通过在含铂族金属的催化剂存在下混合而获得的反应产物，每个分子至少含有至少一个与硅键合的氢原子的有机氢硅化合物 和至少一种具有至少一个脂肪族不饱和键的化合物; （ii）至少一个封端剂，和任选地（iii）至少一种选自水解产物或环硅氧烷的有机硅氧烷，以使组分（i），（ii）和任选的（iii）聚合形成支链聚合物。
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公开(公告)号：US20060116500A1
公开(公告)日：2006-06-01
申请号：US10538680
申请日：2003-12-17
Applicant: Brian Chapman , Loren Durfee , Timothy Mitchell , James Steven Tonge , Paul Vandort
Inventor： Brian Chapman , Loren Durfee , Timothy Mitchell , James Steven Tonge , Paul Vandort
CPC classification number: C08G77/12 , C07F7/21 , C08G77/045 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/24 , C08G77/44 , C08G77/46 , C08G77/50 , C08G77/70 , C08L83/04 , C08L83/00
Abstract: This invention relates to a method comprising (1) heating in the presence of a catalyst a mixture comprising (i) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule or a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation, (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form silicon-bonded hydrogen containing branched polymers.
Abstract translation: 本发明涉及一种方法，其包括（1）在催化剂存在下加热混合物，所述混合物包含（i）每分子至少含有至少一个与硅键合的氢原子的有机氢硅化合物或通过在 含铂族金属的催化剂，每分子含有至少一个与硅键合的氢原子的至少一种有机氢硅化合物和至少一种具有至少一个脂肪族不饱和键的化合物，（ii）至少一个封端剂，和 一种选自水解产物或环硅氧烷的有机硅氧烷，从而引起组分（i），（ii）和任选的（iii）的聚合以形成含硅键合的含氢支链聚合物。
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Patent Agency Ranking
公开(公告)号：US07432338B2
公开(公告)日：2008-10-07
申请号：US10538680
申请日：2003-12-17
Applicant: Brian Douglas Chapman , Loren Dean Durfee , Timothy Paul Mitchell , James Steven Tonge , Paul Cornelius Vandort
Inventor： Brian Douglas Chapman , Loren Dean Durfee , Timothy Paul Mitchell , James Steven Tonge , Paul Cornelius Vandort
CPC classification number: C08G77/12 , C07F7/21 , C08G77/045 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/24 , C08G77/44 , C08G77/46 , C08G77/50 , C08G77/70 , C08L83/04 , C08L83/00
Abstract: This invention relates to a method comprising (1) heating in the presence of a catalyst a mixture comprising (i) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule or a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation, (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form silicon-bonded hydrogen containing branched polymers.
Abstract translation: 本发明涉及一种方法，其包括（1）在催化剂存在下加热混合物，所述混合物包含（i）每分子至少含有至少一个与硅键合的氢原子的有机氢硅化合物或通过在 含铂族金属的催化剂，每分子含有至少一个与硅键合的氢原子的至少一种有机氢硅化合物和至少一种具有至少一个脂肪族不饱和键的化合物，（ii）至少一个封端剂，和 一种选自水解产物或环硅氧烷的有机硅氧烷，从而引起组分（i），（ii）和任选的（iii）的聚合以形成含硅键合的含氢支链聚合物。
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公开(公告)号：US20080058460A1
公开(公告)日：2008-03-06
申请号：US11516010
申请日：2006-09-05
Applicant: Lauren Marie Tonge , James Steven Tonge
Inventor： Lauren Marie Tonge , James Steven Tonge
IPC: C08F8/00
Abstract: A thermoplastic composition. The thermoplastic composition includes a thermoplastic; a silicone hot melt additive; and optional filler. A method of processing the thermoplastic composition is also disclosed.
Abstract translation: 热塑性组合物。 热塑性组合物包括热塑性塑料; 硅胶热熔添加剂; 和可选填料。 还公开了一种加工热塑性组合物的方法。
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公开(公告)号：US06187834B1
公开(公告)日：2001-02-13
申请号：US09392037
申请日：1999-09-08
Applicant: Leroy Elton Thayer , James Steven Tonge , Gary Allen Vincent
Inventor： Leroy Elton Thayer , James Steven Tonge , Gary Allen Vincent
IPC: C08G7708
CPC classification number: C09D183/04 , C08G77/16 , C08G77/80 , C08L83/04 , C09D183/06 , C09D183/10 , C08L2666/14 , C08L2666/28
Abstract: This invention relates to a radiation curable silicone coating composition comprising an alkoxylated resin-polymer organosilicone network containing radiation curable functionality and a cationic photoinitiator. The radiation curable silicone compositions of this invention are useful as fast curing low and high release coating compositions which are especially suitable for release of pressure sensitive adhesives.
Abstract translation: 本发明涉及可辐射固化的硅氧烷涂料组合物，其包含含可辐射固化官能团的烷氧基化树脂 - 聚合物有机硅网络和阳离子光引发剂。 本发明的可辐射固化的硅氧烷组合物可用作特别适用于压敏粘合剂释放的快速固化低和高释放涂料组合物。
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公开(公告)号：US20080276983A1
公开(公告)日：2008-11-13
申请号：US12092150
申请日：2006-11-03
Applicant: Robert Andrew Drake , Jean da la Croix Habimana , Nick Evan Shephard , Mustafa Mohamed , Barry Mark Ketola , James Steven Tonge , Stephen Jenkins , Stephen Altum
Inventor： Robert Andrew Drake , Jean da la Croix Habimana , Nick Evan Shephard , Mustafa Mohamed , Barry Mark Ketola , James Steven Tonge , Stephen Jenkins , Stephen Altum
IPC: H01L31/042
CPC classification number: H01L31/18 , C08L83/14 , H01L31/02167 , H01L31/0481 , Y02E10/50 , C08L2666/44
Abstract: This invention relates to a photovoltaic cell module and a process of applying a silicone based hot melt encapsulant material (102a, 104a) onto photovoltaic cells (103a) to form a photovoltaic cell module. There is provided a photovoltaic array with more efficient manufacturing and better utilization of the solar spectrum by using silicone hot melt sheets (102a, 104a) to give a silicone encapsulant photovoltaic device with the process ease of an organic encapsulant but the optical and chemical advantages of a silicone encapsulant. There is further provided a method for fabricating photovoltaic cells with increased throughput and optical efficiency when compared to prior art encapsulation methods. The preferred silicone material is provided in flexible sheet with hot melt properties and low surface tack.
Abstract translation: 本发明涉及一种光伏电池模块以及将硅树脂热熔体密封材料（102a，104a）施加到光伏电池（103a）上以形成光伏电池模块的方法。 通过使用硅树脂热熔片（102a，104a）提供了更有效的制造和更好地利用太阳光谱的光伏阵列，以提供具有有机密封剂的方法的光学和化学方法的硅树脂密封剂光伏器件 硅胶密封剂的优点。 与现有技术的封装方法相比，还提供了一种具有增加的通量和光学效率的光伏电池的制造方法。 优选的硅氧烷材料以具有热熔性质和低表面粘性的柔性片材提供。
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10.发明申请Flexible Barrier Film, Method Of Forming Same, And Organic Electronic Device Including Same 失效柔性屏障膜，其形成方法和包括其的有机电子器件公开(公告)号：US20110272682A1
公开(公告)日：2011-11-10
申请号：US13144362
申请日：2010-01-13
Applicant: John Blizzard , James Steven Tonge , William Kenneth Weidner
Inventor： John Blizzard , James Steven Tonge , William Kenneth Weidner
IPC: H01L51/44 , B32B27/08 , B32B7/02 , B05D3/00 , C08G77/04 , B05D5/00 , B05D3/06 , B05D7/02 , B05D3/02 , H01L51/52 , C23C16/50
CPC classification number: H01L51/448 , H01L51/0097 , H01L51/5253 , Y02E10/549 , Y10T428/265
Abstract: A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1×10−2 g/m2/day at 22° C. and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy-functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.
Abstract translation: 柔性阻隔膜的厚度大于零至小于5000纳米，水蒸汽透过率在22℃和47％相对湿度下不超过1×10-2克/平方米/天。 柔性阻隔膜由包含多官能丙烯酸酯的组合物形成。 该组合物还包含烷氧基官能的有机金属化合物和烷氧基官能的有机硅化合物的反应产物。 形成柔性阻挡膜的方法包括以下步骤：将组合物设置在基材上并固化组合物以形成柔性阻挡膜。 柔性阻挡膜可用于有机电子器件。
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