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    METHOD AND SYSTEM FOR INTERNAL LAYER-LAYER THERMAL ENHANCEMENT
    2.
    发明申请
    METHOD AND SYSTEM FOR INTERNAL LAYER-LAYER THERMAL ENHANCEMENT 有权
    内层层热增强方法与系统

    公开(公告)号：US20120306088A1

    公开(公告)日：2012-12-06

    申请号：US13151672

    申请日：2011-06-02

    申请人： Gerald K. BARTLEY ,  Charles L. JOHNSON ,  John E. KELLY, III ,  David R. MOTSCHMAN

    发明人： Gerald K. BARTLEY ,  Charles L. JOHNSON ,  John E. KELLY, III ,  David R. MOTSCHMAN

    IPC分类号： H01L23/48 ,  H01L21/50

    CPC分类号： H01L29/0657 ,  H01L23/3677 ,  H01L23/4275 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589

    摘要： The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.

    摘要翻译： 本发明的示例性实施例提供了一种用于增强半导体芯片的芯片堆叠的冷却的方法和装置。 该方法包括在第一侧上创建具有电路的第一芯片，并通过连接器网格将第二芯片电连接并机械耦合到第一芯片。 该方法还包括在连接器之间的第一芯片的第二侧中形成空腔，并用热材料填充空腔。 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括：其中，连接器之间的第一芯片的第二侧的部分被去除以提供放置热材料的空腔。

    Method and system for internal layer-layer thermal enhancement
    3.
    发明授权
    Method and system for internal layer-layer thermal enhancement 有权
    内层热增强方法和系统

    公开(公告)号：US08367478B2

    公开(公告)日：2013-02-05

    申请号：US13151672

    申请日：2011-06-02

    申请人： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  David R. Motschman

    发明人： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  David R. Motschman

    IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L23/34 ,  H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/538

    CPC分类号： H01L29/0657 ,  H01L23/3677 ,  H01L23/4275 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589

    摘要： The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.

    摘要翻译： 本发明的示例性实施例提供了一种用于增强半导体芯片的芯片堆叠的冷却的方法和装置。 该方法包括在第一侧上创建具有电路的第一芯片，并通过连接器网格将第二芯片电连接并机械耦合到第一芯片。 该方法还包括在连接器之间的第一芯片的第二侧中形成空腔，并用热材料填充空腔。 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括：其中，连接器之间的第一芯片的第二侧的部分被去除以提供放置热材料的空腔。