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    Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers
    3.
    发明申请
    Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers 审中-公开
    具有用于优先冷却晶片的冷却壳的增强连接器支架

    公开(公告)号：US20100243716A1

    公开(公告)日：2010-09-30

    申请号：US12410726

    申请日：2009-03-25

    申请人： Joseph Kuczynski ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    发明人： Joseph Kuczynski ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    IPC分类号： B23K31/02 ,  B23K37/04 ,  H01R43/02 ,  H05K7/20

    CPC分类号： H01R43/0256 ,  B23K1/0016 ,  B23K2101/36 ,  Y10T29/49213

    摘要： A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board.

    摘要翻译： 一种用于经由具有冷却壳的支架优先冷却电路板的方法，系统和装置。 增强的连接器支架通过使用选择性地使得连接器引线达到回流温度水平的冷却部件能够将连接器安全且精确地放置在电路板上。 支架通过支架的梳状结构将电路板对准并牢固地连接到连接器，以形成单个连接器单元。 将热量施加到单个连接器单元以引发结合形成。 支架通过在加热过程中通过冷却部件的循环使选择性地最小化对电路板和其它板部件的热量。 因此，支架限制了连接器引线的回流温度水平。 将连接器牢固地连接到电路板之后，将托架机构从电路板上取下。

    METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE
    4.
    发明申请
    METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE 有权
    石墨纳米纤维对准加强热界面材料性能的方法和系统

    公开(公告)号：US20120018666A1

    公开(公告)日：2012-01-26

    申请号：US12842200

    申请日：2010-07-23

    申请人： Joseph Kuczynski ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    发明人： Joseph Kuczynski ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    IPC分类号： B29C39/42 ,  C09K5/14

    CPC分类号： B82Y40/00 ,  B82Y30/00 ,  C01B32/15 ,  C01B32/20 ,  H01L23/373 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.

    摘要翻译： 本发明的示例性实施例提供了一种用于在石墨纳米纤维中对准热界面材料以提高热界面材料性能的方法和系统。 该方法包括以人字形配置制备石墨纳米纤维，并将石英纳米纤维以人字形构型分散到热界面材料中。 该方法还包括施加足够强度的磁场以使石墨纳米纤维在热界面材料中对准。 该系统包括以人字形配置的石墨纳米纤维和用于将人字形配置中的石墨纳米纤维分散到热界面材料中的装置。 该系统还包括用于施加足够强度的磁场以对准热界面材料中的石墨纳米纤维的装置。

    Piezoelectric chromic impact sensor
    6.
    发明授权
    Piezoelectric chromic impact sensor 有权
    压电式铬冲击传感器

    公开(公告)号：US08544337B2

    公开(公告)日：2013-10-01

    申请号：US12754851

    申请日：2010-04-06

    申请人： Joseph Kuczynski ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    发明人： Joseph Kuczynski ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    IPC分类号： G01L1/00

    CPC分类号： G01L5/0052 ,  G01L1/16 ,  G01L1/24

    摘要： An impact sensor includes a piezoelectric transducer operatively connected to a chromic device. The chromic device includes a chromic material that changes from a first color state to a second color state in response to electric power generated by the piezoelectric transducer when exposed to a given level of impact force. The chromic material is bistable so that the chromic material remains in the second color state for a significant amount of time. An impact force to which the sensor has been subjected may be quantified by observing the chromic device. In one embodiment, the chromic material is an electrochromic material, such as a viologen, that changes through a color gradient of light transmission states from the first color state to the second color state. A printed color gradient may be used to aid in quantifying the impact force. In another embodiment, the chromic device includes a thermochromic material.

    摘要翻译： 冲击传感器包括可操作地连接到铬装置的压电传感器。 铬装置包括当暴露于给定水平的冲击力时响应于由压电换能器产生的电力而从第一颜色状态改变到第二颜色状态的铬材料。 铬材料是双稳态的，使得铬材料在相当长的时间内保持在第二颜色状态。 传感器已经受到的冲击力可以通过观察铬装置来量化。 在一个实施例中，铬材料是电致变色材料，例如紫精，其通过从第一颜色状态到第二颜色状态的光透射状态的颜色梯度变化。 可以使用印刷的色彩梯度来帮助量化冲击力。 在另一个实施方案中，铬装置包括热变色材料。

    IMPLEMENTING REDUCED SIGNAL DEGRADATION FOR FIBER OPTIC MODULES
    7.
    发明申请
    IMPLEMENTING REDUCED SIGNAL DEGRADATION FOR FIBER OPTIC MODULES 失效
    实现光纤模块减少信号降解

    公开(公告)号：US20110182575A1

    公开(公告)日：2011-07-28

    申请号：US12691845

    申请日：2010-01-22

    申请人： Joseph Kuczynski ,  Arvind K. Sinha

    发明人： Joseph Kuczynski ,  Arvind K. Sinha

    IPC分类号： H04B10/08

    CPC分类号： G02B6/4206 ,  G02B3/14 ,  G02B6/4225 ,  G02B26/005

    摘要： A method and circuit are provided for implementing reduced signal degradation for fiber optic modules, and a design structure on which the subject circuit resides. Responsive to a detected signal input, an optical misalignment calculation is performed. A voltage potential for a lens shape control is selected responsive to the optical misalignment calculation. An optical signal loss calculation and threshold compare are performed. Responsive to the optical signal loss calculation less than the threshold, the lens shape and voltage potential are fixed. A fluidic lens provides variable lens shape responsive to the selected voltage potential being applied to the fluidic lens,

    摘要翻译： 提供了一种用于实现光纤模块的降低的信号劣化的方法和电路，以及被摄体电路所在的设计结构。 响应于检测信号输入，执行光学偏移计算。 响应于光学偏移计算选择透镜形状控制的电压电位。 执行光信号丢失计算和阈值比较。 响应于光信号损耗计算小于阈值，透镜形状和电压电位是固定的。 流体透镜提供响应于所选择的电压电位施加到流体透镜的可变透镜形状，

    Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer
    8.
    发明授权
    Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer 失效
    使用非接触式振动传感器，在高温下提供对地形测量的热补偿

    公开(公告)号：US08705050B2

    公开(公告)日：2014-04-22

    申请号：US12898783

    申请日：2010-10-06

    申请人： Arvind K. Sinha

    发明人： Arvind K. Sinha

    IPC分类号： G01B11/30

    CPC分类号： G01B11/24

    摘要： A mechanism for providing thermal compensation when measuring surface topography at an elevated temperature using a non-contact vibration transducer, such as a laser Doppler vibrometer (LDV). Thermal compensation is provided to a detector output signal to correct for thermal diffraction of a reflected portion of a beam of radiant energy directed at a surface of a test object. The thermal compensation is based on a calculated deviation between the detector output signal r2 at an elevated temperature and the detector output signal r1 at approximately room temperature. In one embodiment, the thermal compensation mechanism calculates a stationary signal r3(t) which represents the detector output signal without noise and corrected for thermal diffraction at the elevated temperature according to the following equation: r 3 ⁡ ( t ) = lim T → ∞ ⁢ 1 / T ⁢ ∫ - t / 2 + t / 2 ⁢ r 2 * ⁡ ( t ) * r 2 * ⁡ ( t + Δ ⁢ ⁢ t ) ⁢ ⁢ ⅆ t , wherein T represents the total number of spectrums measured at the elevated temperature at multiple times upon which the compensation is based, and wherein r2*=r2−r2(baseline).

    摘要翻译： 使用诸如激光多普勒振动计（LDV）的非接触式振动传感器在高温测量表面形貌时提供热补偿的机构。 将热补偿提供给检测器输出信号，以校正指向测试对象表面的辐射能束的反射部分的热衍射。 热补偿基于在升高的温度下的检测器输出信号r2与大约室温下的检测器输出信号r1之间的计算偏差。 在一个实施例中，热补偿机构根据以下等式计算表示无噪声的检测器输出信号的稳定信号r3（t），并根据以下等式对升高的温度下的热衍射进行校正：r 3⁡（t）= lim T→∞ 1 /T∫-t / 2 + t / 2r 2 *⁡（t）* r 2 *⁡（t +＆Dgr;⁢t）⁢ⅆt，其中T表示测量的光谱总数 在补偿所基于的多次的高温下，其中r2 * = r2-r2（基线）。

    Electronic module with laterally-conducting heat distributor layer
    9.
    发明授权
    Electronic module with laterally-conducting heat distributor layer 有权
    具有横向导热分布层的电子模块

    公开(公告)号：US08611090B2

    公开(公告)日：2013-12-17

    申请号：US12878710

    申请日：2010-09-09

    申请人： Arvind K. Sinha ,  Kory W. Weckman

    发明人： Arvind K. Sinha ,  Kory W. Weckman

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20509 ,  H01L21/563 ,  H01L23/36 ,  H01L23/433 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/01029 ,  H01L2924/14 ,  H05K3/32 ,  H05K7/205 ,  H05K13/00 ,  Y10T29/49117 ,  H01L2924/00

    摘要： An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure.

    摘要翻译： 提供了一种电子模块，其中芯片设置在衬底上并且通过设置在芯片和衬底之间的多个电连接结构电连接到衬底。 由导热材料制成的热分布器设置在芯片和基板之间，其尺寸设计成延伸超过芯片的边缘，以便于从芯片和基板之间横向导出热量。 热分配器包括尺寸和定位的开口，以允许电连接结构通过热分布器而不与热分布器电接触。 热分配器与电连接结构，芯片和基板电隔离。 在一个实施方式中，热分配器物理地接触电子模块的导热外壳，以便将热量从芯片和衬底之间传导到外壳。