公开(公告)号：US08367478B2

公开(公告)日：2013-02-05

申请号：US13151672

申请日：2011-06-02

申请人： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  David R. Motschman

发明人： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  David R. Motschman

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L23/34 ,  H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/538

CPC分类号： H01L29/0657 ,  H01L23/3677 ,  H01L23/4275 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589

摘要： The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.

摘要翻译： 本发明的示例性实施例提供了一种用于增强半导体芯片的芯片堆叠的冷却的方法和装置。 该方法包括在第一侧上创建具有电路的第一芯片，并通过连接器网格将第二芯片电连接并机械耦合到第一芯片。 该方法还包括在连接器之间的第一芯片的第二侧中形成空腔，并用热材料填充空腔。 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括：其中，连接器之间的第一芯片的第二侧的部分被去除以提供放置热材料的空腔。

公开(公告)号：US20140070393A1

公开(公告)日：2014-03-13

申请号：US13613564

申请日：2012-09-13

申请人： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  Joseph Kuczynski ,  David R. Motschman ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

发明人： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  Joseph Kuczynski ,  David R. Motschman ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

IPC分类号： H01L23/367 ,  H01L21/02 ,  H01L23/00

CPC分类号： H01L23/367 ,  H01L21/02656 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/4275 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/95 ,  H01L25/0657 ,  H01L2224/10165 ,  H01L2224/13014 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/17519 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83909 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip

摘要翻译： 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括放置在第一芯片和第二芯片之间的热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维，并且纳米纤维垂直于第一芯片和第二芯片的配合表面对齐 芯片和第二芯片

公开(公告)号：US09111899B2

公开(公告)日：2015-08-18

申请号：US13613564

申请日：2012-09-13

申请人： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  Joseph Kuczynski ,  David R. Motschman ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

发明人： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  Joseph Kuczynski ,  David R. Motschman ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

IPC分类号： H01L23/48 ,  H01L23/10 ,  H01L23/34 ,  H01L23/367 ,  H01L23/00 ,  H01L21/02 ,  H01L23/373 ,  H01L23/427 ,  H01L25/065

CPC分类号： H01L23/367 ,  H01L21/02656 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/4275 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/95 ,  H01L25/0657 ,  H01L2224/10165 ,  H01L2224/13014 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/17519 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83909 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip.

摘要翻译： 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括放置在第一芯片和第二芯片之间的热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维，并且纳米纤维垂直于第一芯片和第二芯片的配合表面对齐 芯片和第二芯片。

公开(公告)号：US08140297B2

公开(公告)日：2012-03-20

申请号：US12354958

申请日：2009-01-16

申请人： Gerald K. Bartley ,  Charles L. Johnson ,  Mark M. Thornton ,  Patrick R. Varekamp

发明人： Gerald K. Bartley ,  Charles L. Johnson ,  Mark M. Thornton ,  Patrick R. Varekamp

IPC分类号： G06F11/22 ,  G06F11/00 ,  G06F11/30 ,  G01R31/26 ,  G01R31/00 ,  G01R31/02 ,  G01D21/00

CPC分类号： G06F19/00 ,  H01L22/14 ,  H01L22/20 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/00

摘要： A three-dimensional (3D) chip is fabricated from components that have been cut out of a two-dimensional (2D) chip. The components from the 2D chip are layered and coupled to create the layers of the 3D chip. By testing the 2D chip first, the layers of the 3D chip have been pre-tested, thus reducing testing and production costs.

摘要翻译： 三维（3D）芯片由已经从二维（2D）芯片切出的部件制成。 来自2D芯片的组件被分层和耦合以产生3D芯片的层。 首先通过测试2D芯片，3D芯片的层已经过预先测试，从而降低了测试和生产成本。

公开(公告)号：US20120038057A1

公开(公告)日：2012-02-16

申请号：US12855854

申请日：2010-08-13

申请人： Gerald K. Bartley ,  Russell D. Hoover ,  Charles L. Johnson ,  Steven P. VanderWiel

发明人： Gerald K. Bartley ,  Russell D. Hoover ,  Charles L. Johnson ,  Steven P. VanderWiel

IPC分类号： H01L23/538 ,  G06F17/50 ,  H01L21/50

CPC分类号： H01L23/50 ,  G06F17/5068 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/0612 ,  H01L2224/06181 ,  H01L2224/06519 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05552 ,  H01L2924/00

摘要： A circuit arrangement and method in one aspect utilize thermal-only through vias, extending between the opposing faces of stacked semiconductor dies, to increase the thermal conductivity of a multi-layer semiconductor stack. The thermal vias are provided in addition to data-carrying through vias, which communicate data signals between circuit layers, and power-carrying through vias, which are coupled to a power distribution network for the circuit layers, such that the thermal conductivity is increased above that which may be provided by the data-carrying and power-carrying through vias in the stack. A circuit arrangement and method in another aspect organize the circuit layers in a multi-layer semiconductor stack based upon current density so as to reduce power distribution losses in the stack.

摘要翻译： 一个方面的电路装置和方法利用仅在通孔之间通过在堆叠的半导体管芯的相对表面之间延伸的热，以增加多层半导体堆叠的导热性。 除了通过通孔之类的数据传送之外，提供了热通孔，该通路通过电路层之间传送数据信号，并通过通孔进行通电，通孔与耦合到电路层的配电网络，使得热导率增加到 可以通过堆叠中的通孔的数据携带和供电来提供。 另一方面的电路装置和方法基于电流密度组织多层半导体堆叠中的电路层，以便减少堆叠中的功率分配损失。

公开(公告)号：US06565044B1

公开(公告)日：2003-05-20

申请号：US10097698

申请日：2002-03-14

申请人： Charles L. Johnson ,  Gregory L. Matloff

发明人： Charles L. Johnson ,  Gregory L. Matloff

IPC分类号： B64G140

CPC分类号： B64G1/407 ,  B64G1/24 ,  B64G1/32 ,  B64G1/648

摘要： A propulsion system for a spacecraft includes a solar sail system and an electrodynamic tether system. The solar sail system is used to generate propulsion to propel the spacecraft through space using solar photons and the electrodynamic tether system is used to generate propulsion to steer the spacecraft into orbit and to perform orbital maneuvers around a planet using the planet's magnetic field. The electrodynamic tether system can also be used to generate power for the spacecraft using the planet's magnetic field.

摘要翻译： 用于航天器的推进系统包括太阳帆系统和电动系绳系统。 太阳帆系统用于产生推进力以通过使用太阳光子的太空推进太空船，并且使用电动系绳系统来产生推进力以将航天器引导到轨道中，并且使用行星的磁场来围绕行星执行轨道演习。 电动系绳系统也可用于使用行星磁场为航天器产生电力。

公开(公告)号：US08272381B2

公开(公告)日：2012-09-25

申请号：US12730632

申请日：2010-03-24

申请人： Charles L. Johnson

发明人： Charles L. Johnson

IPC分类号： A62B19/00 ,  A62B9/02

CPC分类号： B63C11/24

摘要： A closed circuit rebreather including a breathing hose assembly, head assembly and internal counterlung assembly having axial and radial gas flow passageways therethrough, wherein the assembly is housed within a tank and includes a scrubber substantially enclosed along its longitudinal length within a water impervious counterlung bladder, the scrubber including foraminous inner and outer tubes having a carbon dioxide absorbent material filling the space therebetween.

摘要翻译： 一种闭路循环呼吸器，包括呼吸软管组件，头部组件和具有穿过其中的轴向和径向气体流动通道的内部对置组件，其中所述组件容纳在容器内，并且包括沿其纵向长度基本上封闭在不透水的对照膀胱内的洗涤器， 洗涤器包括具有填充其间空间的二氧化碳吸收材料的多孔内管和外管。

公开(公告)号：US5371764A

公开(公告)日：1994-12-06

申请号：US905054

申请日：1992-06-26

申请人： Ronald D. Gillingham ,  Charles L. Johnson

发明人： Ronald D. Gillingham ,  Charles L. Johnson

IPC分类号： G06F1/04 ,  G06F1/12 ,  G06F11/00 ,  G06F11/16 ,  H04L7/00

CPC分类号： G06F11/1604 ,  G06F1/12 ,  H04L7/0083 ,  G06F11/20 ,  Y10T307/344 ,  Y10T307/62 ,  Y10T307/696

摘要： A digital computer is provided having a clock generation circuit for generating a clock signal in response to an input signal from a fixed-frequency oscillator, which includes a first fixed-frequency oscillator and a second fixed-frequency oscillator, each providing an output signal. Also included is failure detection circuit for detecting a failure of either of the fixed-frequency oscillators, wherein a failure occurs when the first fixed-frequency oscillator or the second fixed-frequency oscillator ceases generating an output. A circuit synchronizing the output from the oscillators is coupled to both the first fixed-frequency oscillator and to the second fixed-frequency oscillator. This synchronizing circuit modifies the output from the second fixed-frequency oscillator to produce a synchronized output that is substantially synchronous with the output from the first fixed frequency oscillator. A switching circuit is coupled to the failure detection circuit, the output from the first fixed-frequency oscillator and the synchronized output of the second fixed-frequently oscillator. The switching circuit normally couples the output of the first fixed-frequency oscillator as the clock signal and wherein in response to a detection of a failure of the first fixed-frequency oscillator, the synchronized output is provided as the clock signal.

摘要翻译： 提供了一种数字计算机，其具有响应于来自固定频率振荡器的输入信号产生时钟信号的时钟产生电路，固定频率振荡器包括第一固定频率振荡器和第二固定频率振荡器，每个提供输出信号。 还包括用于检测固定频率振荡器中的任一个的故障的故障检测电路，其中当第一固定频率振荡器或第二固定频率振荡器停止产生输出时发生故障。 将来自振荡器的输出同步的电路耦合到第一固定频率振荡器和第二固定频率振荡器。 该同步电路修改来自第二固定频率振荡器的输出，以产生与第一固定频率振荡器的输出基本同步的同步输出。 开关电路耦合到故障检测电路，来自第一固定频率振荡器的输出和第二固定频率振荡器的同步输出。 开关电路通常将第一固定频率振荡器的输出耦合为时钟信号，并且响应于检测到第一固定频率振荡器的故障，提供同步输出作为时钟信号。

公开(公告)号：US3938827A

公开(公告)日：1976-02-17

申请号：US530352

申请日：1974-12-06

申请人： Charles L. Johnson

发明人： Charles L. Johnson

IPC分类号： B62K13/06

CPC分类号： B62K13/06

摘要： Interconnecting bars are employed to connect two standard bicycles in a side-by-side relationship. The bicycles are interconnected adjacent the respective rear axles thereof, adjacent their respective seats and adjacent the front of the frames thereof, for stabilizing the bicycles and are also interconnected at their respective steering mechanisms with a tie rod that is adjustable to allow setting of wheel toe-in for proper steering and handling characteristics.

摘要翻译： 连接杆用于连接两个标准自行车并排关系。 自行车相邻于相应的后轴，邻近其相应的座并且邻近其框架的前部，用于稳定自行车，并且还在其相应的转向机构处与可调节的连杆相互连接，以允许设定车轮脚趾 - 为了正确的转向和处理特性。

公开(公告)号：US08127079B2

公开(公告)日：2012-02-28

申请号：US12355000

申请日：2009-01-16

申请人： Timothy H. Heil ,  Russell D. Hoover ,  Charles L. Johnson ,  Steven P. Vanderwiel

发明人： Timothy H. Heil ,  Russell D. Hoover ,  Charles L. Johnson ,  Steven P. Vanderwiel

IPC分类号： G06F13/00 ,  G06F13/28

CPC分类号： G06F12/128 ,  G06F12/0815

摘要： A first cache simultaneously broadcasts, in a single message, a request for a cache line and a request to accept a future related evicted cache line to multiple other caches. Each of the multiple other caches evaluate their occupancy to derive an occupancy value that reflects their ability to accept the future related evicted cache line. In response to receiving a requested cache line, the first cache evicts the related evicted cache line to the cache with the highest occupancy value.

摘要翻译： 第一缓存器在单个消息中同时广播对高速缓存行的请求以及接受未来相关的逐出高速缓存行到多个其他高速缓存的请求。 多个其他缓存中的每一个都评估其占用率，以得出反映其接受未来相关驱逐缓存行的能力的占用值。 响应于接收到所请求的高速缓存行，第一缓存将相关的逐出高速缓存行驱逐到具有最高占用值的高速缓存。