BIPOLAR JUNCTION TRANSISTOR GUARD RING STRUCTURES AND METHOD OF FABRICATING THEREOF
    6.
    发明申请
    BIPOLAR JUNCTION TRANSISTOR GUARD RING STRUCTURES AND METHOD OF FABRICATING THEREOF 有权
    双极接头晶体管护环结构及其制造方法

    公开(公告)号:US20120104416A1

    公开(公告)日:2012-05-03

    申请号:US13344234

    申请日:2012-01-05

    申请人: John V. VELIADIS

    发明人: John V. VELIADIS

    IPC分类号: H01L29/161

    摘要: Semiconductor devices with multiple floating guard ring edge termination structures and methods of fabricating same are disclosed. A method for fabricating guard rings in a semiconductor device that includes forming a mesa structure on a semiconductor layer stack, the semiconductor stack including two or more layers of semiconductor materials including a first layer and a second layer, said second layer being on top of said first layer, forming trenches for guard rings in the first layer outside a periphery of said mesa, and forming guard rings in the trenches. The top surfaces of said guard rings have a lower elevation than a top surface of said first layer.

    摘要翻译: 公开了具有多个浮动保护环边缘终端结构的半导体器件及其制造方法。 一种在半导体器件中制造保护环的方法,包括在半导体层堆叠上形成台面结构,所述半导体堆叠包括两层或更多层包括第一层和第二层的半导体材料,所述第二层位于所述 第一层,在所述台面的外围的第一层中形成保护环的沟槽,并在沟槽中形成保护环。 所述保护环的顶表面具有比所述第一层的顶表面更低的高度。

    Bipolar junction transistor guard ring structures and method of fabricating thereof
    7.
    发明授权
    Bipolar junction transistor guard ring structures and method of fabricating thereof 有权
    双极结晶体管保护环结构及其制造方法

    公开(公告)号:US08105911B2

    公开(公告)日:2012-01-31

    申请号:US12828646

    申请日:2010-07-01

    申请人: John V. Veliadis

    发明人: John V. Veliadis

    IPC分类号: H01L21/331

    摘要: Semiconductor devices with multiple floating guard ring edge termination structures and methods of fabricating same are disclosed. A method for fabricating guard rings in a semiconductor device that includes forming a mesa structure on a semiconductor layer stack, the semiconductor stack including two or more layers of semiconductor materials including a first layer and a second layer, said second layer being on top of said first layer, forming trenches for guard rings in the first layer outside a periphery of said mesa, and forming guard rings in the trenches. The top surfaces of said guard rings have a lower elevation than a top surface of said first layer.

    摘要翻译: 公开了具有多个浮动保护环边缘终端结构的半导体器件及其制造方法。 一种在半导体器件中制造保护环的方法,包括在半导体层堆叠上形成台面结构,所述半导体堆叠包括两层或更多层包括第一层和第二层的半导体材料,所述第二层位于所述 第一层,在所述台面的外围的第一层中形成保护环的沟槽,并在沟槽中形成保护环。 所述保护环的顶表面具有比所述第一层的顶表面更低的高度。

    Semiconductor devices with minimized current flow differences and methods of same

    公开(公告)号:US08664048B2

    公开(公告)日:2014-03-04

    申请号:US12980005

    申请日:2010-12-28

    申请人: John V. Veliadis

    发明人: John V. Veliadis

    IPC分类号: H01L21/332 H01L21/8238

    摘要: A semiconductor device with minimized current flow differences and method of fabricating same are disclosed. The method includes forming a semiconductor stack including a plurality of layers that include a first layer having a first conductivity type and a second layer having a first conductivity type, in which the second layer is on top of the first layer, forming a plurality of mesas in the semiconductor layer stack, and forming a plurality of gates in the semiconductor layer stack having a second conductivity type and situated partially at a periphery of the mesas, in which the plurality of gates are formed to minimize current flow differences between a current flowing from the first layer to the plurality of mesas at a first applied gate bias and a current flowing from the first layer to the plurality of mesas at a second applied gate bias when voltage is applied to the semiconductor device.