公开(公告)号：US09391009B2

公开(公告)日：2016-07-12

申请号：US14289900

申请日：2014-05-29

申请人： Eon Soo Jang ,  Kyol Park ,  Jongwoo Park ,  Jin-Kwon Bae ,  Yunhyeok Im ,  Jichul Kim ,  Soojae Park

发明人： Eon Soo Jang ,  Kyol Park ,  Jongwoo Park ,  Jin-Kwon Bae ,  Yunhyeok Im ,  Jichul Kim ,  Soojae Park

IPC分类号： H01L23/36 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/433 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.

摘要翻译： 根据示例实施例，半导体封装包括下封装，下封装上的上封装并且彼此横向间隔开，下封装和上封装之间的下热排出部分，位于上封装之间的中间热排出部 并连接到下部散热部，以及上部热封装上的上部散热部，并与中间散热部连接。

公开(公告)号：US20150054148A1

公开(公告)日：2015-02-26

申请号：US14289900

申请日：2014-05-29

申请人： Eon-Soo JANG ,  Kyol PARK ,  Jongwoo PARK ,  Jin-Kwon BAE ,  Yun-Hyeok IM ,  Ji-Chul KIM ,  Soojae PARK

发明人： Eon-Soo JANG ,  Kyol PARK ,  Jongwoo PARK ,  Jin-Kwon BAE ,  Yun-Hyeok IM ,  Ji-Chul KIM ,  Soojae PARK

IPC分类号： H01L23/34

CPC分类号： H01L23/49816 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.

摘要翻译： 根据示例实施例，半导体封装包括下封装，下封装上的上封装并且彼此横向间隔开，下封装和上封装之间的下热排出部分，位于上封装之间的中间热排出部 并连接到下部散热部，以及上部热封装上的上部散热部，并与中间散热部连接。