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公开(公告)号:US20140239434A1
公开(公告)日:2014-08-28
申请号:US14134580
申请日:2013-12-19
申请人: Jae Choon KIM , Jin-Kwon BAE , Eunho JUNG
发明人: Jae Choon KIM , Jin-Kwon BAE , Eunho JUNG
IPC分类号: H01L23/34
CPC分类号: H01L23/34 , H01L23/3675 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/49866 , H01L25/105 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/15311 , H01L2924/19043 , H01L2924/19104 , H01L2924/00014 , H01L2924/00
摘要: According to example embodiments, a semiconductor package may include a first package substrate, a first semiconductor chip on the first package substrate, and a thermistor array film on the first semiconductor chip. The thermistor array film may include a variable resistive film that covers the first semiconductor chip, and an array of electrode patterns that are connected to the variable resistive film. The array of electrode patterns may be connected to at least one of the upper and lower surfaces of the variable resistive film.
摘要翻译: 根据示例性实施例,半导体封装可以包括第一封装衬底,第一封装衬底上的第一半导体芯片和第一半导体芯片上的热敏电阻阵列膜。 热敏电阻阵列膜可以包括覆盖第一半导体芯片的可变电阻膜和连接到可变电阻膜的电极图案阵列。 电极图案的阵列可以连接到可变电阻膜的上表面和下表面中的至少一个。
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公开(公告)号:US20110032679A1
公开(公告)日:2011-02-10
申请号:US12833470
申请日:2010-07-09
申请人: Joong-hyun Baek , Hee-jin Lee , Jin-kwon Bae
发明人: Joong-hyun Baek , Hee-jin Lee , Jin-kwon Bae
IPC分类号: H05K7/20
CPC分类号: H05K7/20472 , H01L23/38 , H01L2924/0002 , H05K7/20409 , H01L2924/00
摘要: A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.
摘要翻译: 半导体模块包括产生热能的半导体封装,将热能从半导体封装传递到集热构件中的集热区的集热构件,将从集热构件和封装传递热能的散热构件传送到 以及通过热电效应将热能通过集热区域传递到散热构件的热电装置。 集热构件和散热构件可以以其他方式绝缘,因此热能由热电装置传递和控制。 封装可以是动态随机存取存储器(DRAM),微处理器,中央处理单元(CPU),图形处理单元(GPU)或闪存。 散热构件可以是固态盘(SSD)的外部壳体,并且热电装置可以是通过电力线控制的珀耳帖冷却器。
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公开(公告)号:US09391009B2
公开(公告)日:2016-07-12
申请号:US14289900
申请日:2014-05-29
申请人: Eon Soo Jang , Kyol Park , Jongwoo Park , Jin-Kwon Bae , Yunhyeok Im , Jichul Kim , Soojae Park
发明人: Eon Soo Jang , Kyol Park , Jongwoo Park , Jin-Kwon Bae , Yunhyeok Im , Jichul Kim , Soojae Park
IPC分类号: H01L23/36 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/00 , H01L23/433 , H01L23/00
CPC分类号: H01L23/49816 , H01L23/36 , H01L23/4334 , H01L24/73 , H01L25/0652 , H01L25/105 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06562 , H01L2225/06568 , H01L2225/06572 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00012 , H01L2924/00
摘要: According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.
摘要翻译: 根据示例实施例,半导体封装包括下封装,下封装上的上封装并且彼此横向间隔开,下封装和上封装之间的下热排出部分,位于上封装之间的中间热排出部 并连接到下部散热部,以及上部热封装上的上部散热部,并与中间散热部连接。
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公开(公告)号:US09202773B2
公开(公告)日:2015-12-01
申请号:US13547595
申请日:2012-07-12
申请人: Jin-Kwon Bae , Eun-Seok Cho
发明人: Jin-Kwon Bae , Eun-Seok Cho
IPC分类号: H05K7/20 , H01L23/467
CPC分类号: H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.
摘要翻译: 提供了一种半导体模块。 半导体模块包括包括第一表面和与第一表面相对的第二表面的基板。 半导体器件设置在衬底的第一表面上。 气流引导件设置在基板的第二表面上。 气流引导件包括一个包括远离第二表面的端部的板。
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公开(公告)号:US20130077239A1
公开(公告)日:2013-03-28
申请号:US13547595
申请日:2012-07-12
申请人: Jin-Kwon BAE , Eun-Seok CHO
发明人: Jin-Kwon BAE , Eun-Seok CHO
IPC分类号: H01L23/467
CPC分类号: H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.
摘要翻译: 提供了一种半导体模块。 半导体模块包括包括第一表面和与第一表面相对的第二表面的基板。 半导体器件设置在衬底的第一表面上。 气流引导件设置在基板的第二表面上。 气流引导件包括一个包括远离第二表面的端部的板。
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公开(公告)号:US20170229373A1
公开(公告)日:2017-08-10
申请号:US15495324
申请日:2017-04-24
申请人: JAE CHOON KIM , JICHUL KIM , Jin-Kwon BAE , EUNSEOK CHO
发明人: JAE CHOON KIM , JICHUL KIM , Jin-Kwon BAE , EUNSEOK CHO
CPC分类号: H01L23/38 , F25B21/02 , F25B2321/0212 , F25B2700/2107 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/105 , H01L25/18 , H01L35/32 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.
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7.
公开(公告)号:US09228763B2
公开(公告)日:2016-01-05
申请号:US13692394
申请日:2012-12-03
申请人: Jae Choon Kim , Jichul Kim , Jin-Kwon Bae , Eunseok Cho
发明人: Jae Choon Kim , Jichul Kim , Jin-Kwon Bae , Eunseok Cho
CPC分类号: F25B21/02 , F25B2321/0212 , F25B2700/2107 , H01L35/32 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要: Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.
摘要翻译: 提供热电冷却封装及其热管理方法。 该方法可以包括测量包括半导体芯片和热电冷却器的热电冷却封装的温度,将热电冷却封装的温度与目标温度进行比较,当热电冷却封装的温度高于 目标温度,并且当热电冷却封装的温度变得低于目标温度时,停止热电冷却器的操作。
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公开(公告)号:US20130135823A1
公开(公告)日:2013-05-30
申请号:US13597628
申请日:2012-08-29
申请人: Ji-Chul Kim , Jin-Kwon Bae , Mi-Na Choi , Hee-Jung Hwang
发明人: Ji-Chul Kim , Jin-Kwon Bae , Mi-Na Choi , Hee-Jung Hwang
IPC分类号: H05K7/20
CPC分类号: H01L23/467 , G06F1/203 , H01L23/043 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/16151 , H01L2924/181 , H01L2924/1816 , H05K7/20136 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.
摘要翻译: 可与移动设备一起使用的半导体封装包括其中包括导电布线的电路板及其后表面上的接触端子,集成电路芯片,其位于电路板的前表面上并电连接到导电布线, 至少一个开口,并且覆盖集成电路芯片,使得在集成电路芯片周围设置流动空间,并且开口与流动空间连通;以及空气流发生器,其定位在盖上以产生通过流动的强制空气流 空间和开口,从而通过强制气流从集成电路芯片散发出半导体封装的热量。
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公开(公告)号:US08184439B2
公开(公告)日:2012-05-22
申请号:US12833470
申请日:2010-07-09
申请人: Joong-hyun Baek , Hee-jin Lee , Jin-kwon Bae
发明人: Joong-hyun Baek , Hee-jin Lee , Jin-kwon Bae
IPC分类号: H05K7/20
CPC分类号: H05K7/20472 , H01L23/38 , H01L2924/0002 , H05K7/20409 , H01L2924/00
摘要: A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.
摘要翻译: 半导体模块包括产生热能的半导体封装,将热能从半导体封装传递到集热构件中的集热区的集热构件,将从集热构件和封装传递热能的散热构件传送到 以及通过热电效应将热能通过集热区域传递到散热构件的热电装置。 集热构件和散热构件可以以其他方式绝缘,因此热能由热电装置传递和控制。 封装可以是动态随机存取存储器(DRAM),微处理器,中央处理单元(CPU),图形处理单元(GPU)或闪存。 散热构件可以是固态盘(SSD)的外部壳体,并且热电装置可以是通过电力线控制的珀耳帖冷却器。
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10.
公开(公告)号:US20160084542A1
公开(公告)日:2016-03-24
申请号:US14961167
申请日:2015-12-07
申请人: JAE CHOON KIM , JICHUL KIM , Jin-Kwon BAE , EUNSEOK CHO
发明人: JAE CHOON KIM , JICHUL KIM , Jin-Kwon BAE , EUNSEOK CHO
IPC分类号: F25B21/02
CPC分类号: F25B21/02 , F25B2321/0212 , F25B2700/2107 , H01L35/32 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要: A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.
摘要翻译: 一种装置包括具有第一区域和不与第一区域重叠的第二区域的第一板; 以及设置在所述第一板和所述第二板之间的热电半导体,所述热电半导体被配置为向所述热电半导体提供电压; 一个包装,设置在第一板的第二区域。
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