公开(公告)号：US09398694B2

公开(公告)日：2016-07-19

申请号：US13348295

申请日：2012-01-11

申请人： Thomas Merkle ,  Stefan Koch ,  Joo-Young Choi

发明人： Thomas Merkle ,  Stefan Koch ,  Joo-Young Choi

IPC分类号： H01L25/00 ,  H05K1/18 ,  H05K1/02 ,  H01L23/66 ,  H01L25/16 ,  H01L23/538 ,  H05K1/16 ,  H01L23/498

CPC分类号： H05K3/4697 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/16 ,  H05K1/185 ,  H05K3/301 ,  H05K3/465 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2203/1469 ,  H01L2924/00

摘要： The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

摘要翻译： 本发明涉及以毫米波和太赫兹频率工作的集成电子系统的领域。 提出了一种单片多芯片封装，这种封装的载体结构以及用于制造这种封装和这种载体结构的制造方法，以获得完全屏蔽mm波/ THz系统的不同功能的封装。 通过聚合光敏单体将包装倒入适当位置。 它逐渐在MMIC（单片微波集成电路）之上和之上增长，连接到MMIC，但使芯片的高频区域变得困难。 所提出的方法导致电磁完全屏蔽的功能块。 这些单元可以根据系统需要进行组合和级联。

公开(公告)号：US08884716B2

公开(公告)日：2014-11-11

申请号：US13360183

申请日：2012-01-27

申请人： Joo-Young Choi ,  Stefan Koch ,  Thomas Merkle

发明人： Joo-Young Choi ,  Stefan Koch ,  Thomas Merkle

IPC分类号： H01P5/107

CPC分类号： H01P5/107

摘要： A feeding structure including a carrier substrate, a top conductor plane of a cavity formed in the carrier substrate, a feedline substrate covering the top conductor plane, a signal conductor of a feedline, the signal conductor being formed in or on the feedline substrate opposite the top conductor plane, a via probe connected to the signal conductor and leading through the feedline substrate and the top conductor plane into the cavity, a ring-shaped aperture formed in the top conductor plane around the via probe, and at least one slot-shaped aperture formed in the top conductor plane starting at the ring-shaped aperture and leading away from the via probe.

摘要翻译： 一种馈送结构，包括载体衬底，形成在载体衬底中的空腔的顶部导体平面，覆盖顶部导体平面的馈线衬底，馈线的信号导体，信号导体形成在馈线衬底上或与衬底相对的馈线衬底上 顶导体平面，连接到信号导体并通过馈线基板并且顶部导体平面进入空腔的通孔探针，形成在通孔探针周围的顶部导体平面中的环形孔，以及至少一个槽形 孔形成在顶部导体平面中，从环形孔开始并远离通孔探针。

公开(公告)号：US20120206219A1

公开(公告)日：2012-08-16

申请号：US13360183

申请日：2012-01-27

申请人： Joo-Young CHOI ,  Stefan Koch ,  Thomas Merkle

发明人： Joo-Young CHOI ,  Stefan Koch ,  Thomas Merkle

IPC分类号： H01P7/06 ,  H01P5/103

CPC分类号： H01P5/107

摘要： The present invention relates to a feeding structure for coupling a feedline to a cavity. To increase the coupling, which can contribute to achieving a broad bandwidth, a feeding structure is proposed comprising a carrier substrate, a top conductor plane of a cavity formed in said carrier substrate, a feedline substrate covering said top conductor plane, a signal conductor of a feedline, said signal conductor being formed in or on said feedline substrate opposite said top conductor plane, a via probe connected to said signal conductor and leading through said feedline substrate and said top conductor plane into said cavity, a ring-shaped aperture formed in said top conductor plane around said via probe, and at least one slot-shaped aperture formed in said top conductor plane starting at said ring-shaped aperture and leading away from said via probe.

摘要翻译： 本发明涉及用于将馈线连接到空腔的馈送结构。 为了增加有助于实现宽带宽的耦合，提出了一种馈电结构，其包括载体衬底，形成在所述载体衬底中的空腔的顶部导体平面，覆盖所述顶部导体平面的馈线衬底， 馈线，所述信号导体形成在与所述顶导体平面相对的所述馈线衬底中或上，所述信号导体连接到所述信号导体并通过所述馈线衬底和所述顶导体平面进入所述空腔中的通孔探针， 围绕所述通孔探针的所述顶部导体平面以及形成在所述顶部导体平面中的至少一个狭槽形孔，从所述环形孔开始并远离所述通孔探针。

公开(公告)号：US20120182066A1

公开(公告)日：2012-07-19

申请号：US13348295

申请日：2012-01-11

申请人： Thomas MERKLE ,  Stefan Koch ,  Joo-Young Choi

发明人： Thomas MERKLE ,  Stefan Koch ,  Joo-Young Choi

IPC分类号： H01L25/00 ,  H05K1/02 ,  H05K13/00 ,  H01L21/56

CPC分类号： H05K3/4697 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/16 ,  H05K1/185 ,  H05K3/301 ,  H05K3/465 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2203/1469 ,  H01L2924/00

摘要： The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

摘要翻译： 本发明涉及以毫米波和太赫兹频率工作的集成电子系统的领域。 提出了一种单片多芯片封装，这种封装的载体结构以及用于制造这种封装和这种载体结构的制造方法，以获得完全屏蔽mm波/ THz系统的不同功能的封装。 通过聚合光敏单体将包装倒入适当位置。 它逐渐在MMIC（单片微波集成电路）之上和之上增长，连接到MMIC，但使芯片的高频区域变得困难。 所提出的方法导致电磁完全屏蔽的功能块。 这些单元可以根据系统需要进行组合和级联。

公开(公告)号：US07374950B2

公开(公告)日：2008-05-20

申请号：US11528800

申请日：2006-09-28

申请人： Jemo Kang ,  Kyung-ah Kim ,  Joo Young Choi ,  George Jackowski

发明人： Jemo Kang ,  Kyung-ah Kim ,  Joo Young Choi ,  George Jackowski

IPC分类号： G01N33/558

CPC分类号： G01N33/54386 ,  G01N33/558 ,  G01N33/6887 ,  G01N2800/325 ,  Y10S435/805 ,  Y10S435/81 ,  Y10S435/97 ,  Y10S435/973 ,  Y10S436/805 ,  Y10S436/81 ,  Y10S436/815

摘要： An immunochemical assay device for determining the presence of NT-proBNP alone or conjunctively with Cardiac Troponin I comprising a base member, an array disposed on the base member, and at least one assay indicia zone. The array comprises (i) a reservoir pad to receive sample liquid, (ii) a wicking membrane, and (iii) at least one filter zone interposed between the wicking membrane and the reservoir pad. The filter zone being operable to permit passage of any specific immunocomplex to the wicking membrane while impeding passage of larger components.

摘要翻译： 一种用于确定单独或与心肌肌钙蛋白I结合的NT-proBNP的存在的免疫化学测定装置，其包含基底构件，设置在基底构件上的阵列和至少一个测定标记区。 阵列包括（i）用于接收样品液体的储存器垫，（ii）芯吸膜，和（iii）置于芯吸膜和储存器垫之间的至少一个过滤区。 过滤区域可操作以允许任何特定的免疫复合物通过芯吸膜，同时阻止较大组分的通过。

公开(公告)号：US20070020769A1

公开(公告)日：2007-01-25

申请号：US11528800

申请日：2006-09-28

申请人： Jemo Kang ,  Kyung-ah Kim ,  Joo Young Choi ,  George Jackowski

发明人： Jemo Kang ,  Kyung-ah Kim ,  Joo Young Choi ,  George Jackowski

IPC分类号： G01N33/558

CPC分类号： G01N33/54386 ,  G01N33/558 ,  G01N33/6887 ,  G01N2800/325 ,  Y10S435/805 ,  Y10S435/81 ,  Y10S435/97 ,  Y10S435/973 ,  Y10S436/805 ,  Y10S436/81 ,  Y10S436/815

摘要： An immunochemical assay device for determining the presence of NT-proBNP alone or conjunctively with Cardiac Troponin I comprising a base member, an array disposed on the base member, and at least one assay indicia zone. The array comprises (i) a reservoir pad to receive sample liquid, (ii) a wicking membrane, and (iii) at least one filter zone interposed between the wicking membrane and the reservoir pad. The filter zone being operable to permit passage of any specific immunocomplex to the wicking membrane while impeding passage of larger components.

摘要翻译： 一种用于确定单独或与心肌肌钙蛋白I结合的NT-proBNP的存在的免疫化学测定装置，其包含基底构件，设置在基底构件上的阵列和至少一个测定标记区。 阵列包括（i）用于接收样品液体的储存器垫，（ii）芯吸膜，和（iii）置于芯吸膜和储存器垫之间的至少一个过滤区。 过滤区域可操作以允许任何特定的免疫复合物通过芯吸膜，同时阻止较大组分的通过。

公开(公告)号：US07135329B2

公开(公告)日：2006-11-14

申请号：US10359047

申请日：2003-02-04

申请人： Jemo Kang ,  Kyung-ah Kim ,  Joo Young Choi ,  George Jackowski

发明人： Jemo Kang ,  Kyung-ah Kim ,  Joo Young Choi ,  George Jackowski

IPC分类号： C12M1/34

CPC分类号： G01N33/54386 ,  G01N33/558 ,  G01N33/6887 ,  G01N2800/325 ,  Y10S435/805 ,  Y10S435/81 ,  Y10S435/97 ,  Y10S435/973 ,  Y10S436/805 ,  Y10S436/81 ,  Y10S436/815

摘要： An immunochemical assay device for determining the presence of NT-proBNP alone or conjunctively with Cardiac Troponin I comprising a base member, an array disposed on the base member, and at least one assay indicia zone. The array comprises (i) a reservoir pad to receive sample liquid, (ii) a wicking membrane, and (iii) at least one filter zone interposed between the wicking membrane and the reservoir pad. The filter zone being operable to permit passage of any specific immunocomplex to the wicking membrane while impeding passage of larger components.

摘要翻译： 一种用于确定单独或与心肌肌钙蛋白I结合的NT-proBNP的存在的免疫化学测定装置，其包含基底构件，设置在基底构件上的阵列和至少一个测定标记区。 阵列包括（i）用于接收样品液体的储存器垫，（ii）芯吸膜，和（iii）置于芯吸膜和储存器垫之间的至少一个过滤区。 过滤区域可操作以允许任何特定的免疫复合物通过芯吸膜，同时阻止较大组分的通过。

公开(公告)号：US20110084406A1

公开(公告)日：2011-04-14

申请号：US12896375

申请日：2010-10-01

申请人： Joo-Young CHOI ,  Stefan Koch

发明人： Joo-Young CHOI ,  Stefan Koch

IPC分类号： H01L23/48

CPC分类号： H01G2/065 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2224/16265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19032 ,  H01L2924/19104 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： The present invention discloses a device in flip chip architecture. The device comprises at least two integrated circuits, which are interconnected by a passive device. The integrated circuits are mounted on a base ground plate, and are each connected to the passive device via conductive elements.For the interconnection of the integrated circuits with the passive device, the device employs the structure of an inverted microstrip line, a suspended microstrip line, a covered microstrip line or a conventional microstrip line.Depending on the interconnection scheme, low transmission loss, low susceptibility to external interferences, easy alignment properties in the assembly process, a compact package size, a high reproducibility and/or low cost can be achieved.

摘要翻译： 本发明公开了一种倒装芯片架构的器件。 该装置包括由无源装置互连的至少两个集成电路。 集成电路安装在基座接地板上，并通过导电元件连接到无源器件。 对于集成电路与无源器件的互连，器件采用反相微带线，悬浮微带线，覆盖微带线或常规微带线的结构。 根据互连方案，低传输损耗，对外部干扰的敏感性低，组装过程中易于对准的特性，可以实现紧凑的封装尺寸，高重现性和/或低成本。

公开(公告)号：US20130092491A1

公开(公告)日：2013-04-18

申请号：US13501691

申请日：2010-10-18

申请人： Nam Pyo Suh ,  Soon Heung Chang ,  Dong Ho Cho ,  Jung Goo Cho ,  Chun Taek Rim ,  Gu Ho Jeong ,  Kyung Hun Lee ,  Bo Yune Song ,  Yang Jin Cho ,  Chae Hun Lim ,  Jong Woo Kim ,  Young Dong Son ,  Joo Young Choi ,  Ji Chul Jang ,  In Lee ,  Eun Ho Kim ,  Myung Koo Kang

发明人： Nam Pyo Suh ,  Soon Heung Chang ,  Dong Ho Cho ,  Jung Goo Cho ,  Chun Taek Rim ,  Gu Ho Jeong ,  Kyung Hun Lee ,  Bo Yune Song ,  Yang Jin Cho ,  Chae Hun Lim ,  Jong Woo Kim ,  Young Dong Son ,  Joo Young Choi ,  Ji Chul Jang ,  In Lee ,  Eun Ho Kim ,  Myung Koo Kang

IPC分类号： B60L5/00 ,  F16L1/028 ,  H05K9/00

CPC分类号： B60L5/005 ,  B60L53/12 ,  B60L2210/20 ,  B60M1/34 ,  F16L1/028 ,  H05K9/0075 ,  Y02T10/7005 ,  Y02T10/7072 ,  Y02T10/725 ,  Y02T90/122 ,  Y02T90/127 ,  Y02T90/14

摘要： A power supply apparatus is for supplying power to an electric vehicle by a magnetic induction mechanism. The apparatus includes a power supply structure including a multiple number of power supply rail modules connected in a forward road direction, each power supply rail module including at least one power supply line passage elongated in the forward road direction, a power supply core of a lattice structure provided below the power supply line passage, and a concrete structure incorporating the power supply line passage and the power supply core; at least one power supply line accommodated in the power supply line passage in the forward road direction and surrounded by an insulating pipe; and at least one common line provided in the forward road direction and surrounded by an insulating pipe, for supplying power to the power supply apparatus.

摘要翻译： 供电装置用于通过磁感应机构向电动车辆供电。 该装置包括电源结构，该电源结构包括沿前进方向连接的多个电源轨模块，每个电源轨模块包括至少一个沿前向道路延伸的电源线通道，格栅的电源芯 设置在供电线路下方的结构，以及并入电源线通路和供电芯的混凝土结构体; 至少一个供电线路，其沿前进道路方向容纳在所述供电线路通道中并被绝缘管包围; 以及至少一条沿前进道路方向设置并被绝缘管包围的公共线，用于向电源装置供电。

公开(公告)号：US20110279191A1

公开(公告)日：2011-11-17

申请号：US13087792

申请日：2011-04-15

申请人： Joo-Young Choi ,  Stefan Koch

发明人： Joo-Young Choi ,  Stefan Koch

IPC分类号： H01P1/10

CPC分类号： H01P5/1015 ,  H01P1/127 ,  H01P1/15

摘要： The present invention provides a space saving and simply implementable planar integrated switching device comprising at least two CPW-slotline transition units each including an access for inputting and/or outputting a transmission signal, a slotline connecting said at least two CPW-slotline transition units, and a switching element arranged on said slotline between said at least two CPW-slotline transition units for switching the transmission signal over said slotline on and off under control of a switch control signal.

摘要翻译： 本发明提供了一种节省空间且简单可实现的平面集成开关装置，其包括至少两个CPW-时隙线转换单元，每个CPW-时隙线转换单元包括用于输入和/或输出发送信号的接入，连接所述至少两个CPW-时隙线转换单元的时隙线， 以及布置在所述缝线之间的所述至少两个CPW-槽线转换单元之间的开关元件，用于在开关控制信号的控制下在所述槽线上接通和断开传输信号。