摘要:
A sensor system having a sensor element, a housing in which sensor element is situated and which seals the sensor element from the outside world, at least one first electrical contact element which is electrically coupled with the sensor element; a plug connector, which has at least one second electrical contact element, and at least one spring element which is coupled between the at least one second electrical contact element and the at least one first electrical contact element for electrical contacting, so that the sensor element is electrically connected to the second electrical contact element of the plug connector.
摘要:
A method for manufacturing a micromechanical component is described, the micromechanical component having a medium. The medium has settable and changeable volume-elastic properties and generally completely encloses a sensor module and/or a module housing. The medium preferably has a low-pass response.
摘要:
A method for manufacturing a micromechanical component is described, the micromechanical component having a medium. The medium has settable and changeable volume-elastic properties and generally completely encloses a sensor module and/or a module housing. The medium preferably has a low-pass response.
摘要:
A module includes an electrical component having an inner enclosure which surrounds the electrical component and which has first electrical contact means at least on one outer side; having an outer enclosure in the interior of which the inner enclosure is situated, the outer enclosure having second electrical contact means, the second electrical contact means extending from the interior to at least one outer side of the outer enclosure. The first and second contact means are interconnected.
摘要:
In an angular velocity sensor, an acceleration sensor is arranged on a resonator formed of a multilayer substrate and attached to a resonating bar. The multilayer substrate includes a top silicon layer, an insulating sacrificial layer arranged below the top silicon layer, and a bottom silicon layer arranged below the insulating sacrificial layer. An excitor causes the resonator to vibrate while a limit stop, configured out of the multilayer substrate, limits the movement of the resonator.
摘要:
In a method for dicing multi-layer composite wafers, proceeding from an upper side of the wafer, cuts are introduced into an upper layer of the wafer and, proceeding from a lower side of the wafer, cuts are introduced into a lower layer of the wafer.
摘要:
A sensor system has a rotational angle sensor for detecting a rotational angle and a torque sensor for detecting a torque. The rotational angle sensor has a rotatable rotational angle transmitter having index elements. The torque sensor has a rotatable torque transmitter having magnets, which generate a magnetic field, and a magnetic flux unit for amplifying the magnetic field. The index elements and the magnetic flux unit are connected to one another in a rotationally fixed manner.
摘要:
A sensor system is provided having a base plate, a sensor module, a damping element and a support frame, the base plate having a main plane of extension and a recess that is perpendicular to the main plane of extension; the support frame being fastened in the recess; the damping element being situated between the support frame and the recess; and the sensor module further being pressed into the support frame in a form-locking and a force-locking manner.
摘要:
A sensor system is provided having a base plate, a sensor module, a damping element and a support frame, the base plate having a main plane of extension and a recess that is perpendicular to the main plane of extension; the support frame being fastened in the recess; the damping element being situated between the support frame and the recess; and the sensor module further being pressed into the support frame in a form-locking and a force-locking manner.
摘要:
In a sensor and a method for manufacturing a sensor, a movable element is patterned out of a silicon layer and is secured to a substrate. The conducting layer is subdivided into various regions, which are electrically insulated from one another. The electrical connection between the various regions of the silicon layer is established by a conducting layer, which is arranged between a first and a second insulating layer.