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    Copper foil composite including a release layer
    3.
    发明授权
    Copper foil composite including a release layer 失效
    包括剥离层的铜箔复合材料

    公开(公告)号：US06689268B2

    公开(公告)日：2004-02-10

    申请号：US09842454

    申请日：2001-04-26

    申请人： Szuchain Chen ,  Julius Fister ,  Andrew Vacco ,  Nina Yukov ,  A. James Brock

    发明人： Szuchain Chen ,  Julius Fister ,  Andrew Vacco ,  Nina Yukov ,  A. James Brock

    IPC分类号： C25D1102

    CPC分类号： H05K3/025 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/265

    摘要： A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.

    摘要翻译： 复合材料包括结构载体层和由剥离层分离的相对薄的金属箔层。 可以是诸如镍或铬的金属和非金属如氧化铬，氧化镍，磷酸铬或磷酸镍的混合物的释放层提供了金属箔层与载体带的剥离强度， 通常为0.1磅/英寸至2磅/英寸。 这提供了足够的粘合力以防止金属箔层从载体层过早分离，但是当需要时容易除去载体层。 通常，金属箔层随后结合到电介质上，然后移除载体层。 然后将金属箔层成像为印刷电路板和柔性电路的制造中的电路特征。

    Treatment to reduce solder plating whisker formation
    4.
    发明授权
    Treatment to reduce solder plating whisker formation 失效
    处理以减少焊料电镀晶须的形成

    公开(公告)号：US5320737A

    公开(公告)日：1994-06-14

    申请号：US391754

    申请日：1989-08-10

    申请人： Chung-Yao Chao ,  Julius Fister

    发明人： Chung-Yao Chao ,  Julius Fister

    IPC分类号： C23C22/24 ,  C23C22/33 ,  C23G1/10 ,  C25D3/60 ,  C25D5/34 ,  H05K3/34

    CPC分类号： H05K3/3473 ,  C23C22/24 ,  C23C22/33 ,  C23G1/103 ,  C25D3/60 ,  C25D5/34 ,  H05K2203/0392 ,  H05K2203/0723

    摘要： The formation of whiskers during tin or tin-lead solder electroplating of a copper base alloy substrate in a methane sulfonate solder plating bath is inhibited by passivating the surface of the substrate prior to electroplating. Preferred passivating solutions include an aqueous solution of sodium dichromate and phosphoric acid, and an aqueous solution of chromic acid and phosphoric acid. Passivation is preferably followed by treatment with a basic solution having a pH of at least 8.

    摘要翻译： 铜基合金基板在甲烷磺酸盐焊料镀液中的锡或锡铅焊料电镀期间形成晶须在电镀之前钝化基板的表面被抑制。 优选的钝化溶液包括重铬酸钠和磷酸的水溶液和铬酸和磷酸的水溶液。 优选通过用pH至少为8的碱性溶液处理钝化。

    Tin coatings incorporating selected elemental additions to reduce discoloration
    5.
    发明授权
    Tin coatings incorporating selected elemental additions to reduce discoloration 有权
    含有选择元素添加剂的锡涂层以减少变色

    公开(公告)号：US06183886B2

    公开(公告)日：2001-02-06

    申请号：US09213545

    申请日：1998-12-17

    申请人： Szuchain Chen ,  Julius Fister ,  Christopher Laurello

    发明人： Szuchain Chen ,  Julius Fister ,  Christopher Laurello

    IPC分类号： H01R1303

    CPC分类号： C23C28/021 ,  C23C28/00 ,  C23C28/023 ,  Y10S428/929 ,  Y10T428/12715 ,  Y10T428/12792

    摘要： A tin coated electrical or electronic component has enhanced resistance to oxidation and tarnishing as well a smaller increase in contact resistance when exposed to elevated temperatures. These benefits are achieved by depositing a relatively thin, on the order of 5-50 angstroms thick, layer of zinc on the tin coating prior to heating. A subsequent step of heating the sample to a temperature and time effective to convert all free tin to an intermetallic imparts the additional advantage of reducing the coefficient of friction.

    摘要翻译： 镀锡的电气或电子部件具有增强的抗氧化和变色性，以及当暴露于升高的温度时接触电阻的增加较小。 这些优点通过在加热之前在锡涂层上沉积约5-50埃厚的锌层来实现。 将样品加热至有效将所有游离锡转化为金属间化合物的温度和时间的后续步骤赋予降低摩擦系数的额外优点。

    Copper foil composite including a release layer
    7.
    发明授权
    Copper foil composite including a release layer 有权
    包括剥离层的铜箔复合材料

    公开(公告)号：US06346335B1

    公开(公告)日：2002-02-12

    申请号：US09522544

    申请日：2000-03-10

    申请人： Szuchain Chen ,  Julius Fister ,  Andrew Vacco ,  Nina Yukov ,  A. James Brock

    发明人： Szuchain Chen ,  Julius Fister ,  Andrew Vacco ,  Nina Yukov ,  A. James Brock

    IPC分类号： B32B1520

    CPC分类号： H05K3/025 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/265

    摘要： A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.

    摘要翻译： 复合材料包括结构载体层和由剥离层分离的相对薄的金属箔层。 可以是诸如镍或铬的金属和非金属如氧化铬，氧化镍，磷酸铬或磷酸镍的混合物的释放层提供了金属箔层与载体带的剥离强度， 通常为0.1磅/英寸至2磅/英寸。 这提供了足够的粘合力以防止金属箔层从载体层过早分离，但是当需要时容易除去载体层。 通常，金属箔层随后结合到电介质上，然后移除载体层。 然后将金属箔层成像为印刷电路板和柔性电路的制造中的电路特征。