公开(公告)号：US06893742B2

公开(公告)日：2005-05-17

申请号：US09948166

申请日：2001-09-06

申请人： Szuchain F. Chen ,  William L. Brenneman ,  Andrew Vacco ,  Nina Yukov

发明人： Szuchain F. Chen ,  William L. Brenneman ,  Andrew Vacco ,  Nina Yukov

IPC分类号： B32B15/01 ,  C25D1/04 ,  H05K3/02 ,  H05K3/38 ,  B32B15/00 ,  B32B15/04 ,  B32B15/20

CPC分类号： H05K3/384 ,  C25D1/04 ,  H05K3/025 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12993 ,  Y10T428/265

摘要： A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

公开(公告)号：US06689268B2

公开(公告)日：2004-02-10

申请号：US09842454

申请日：2001-04-26

申请人： Szuchain Chen ,  Julius Fister ,  Andrew Vacco ,  Nina Yukov ,  A. James Brock

发明人： Szuchain Chen ,  Julius Fister ,  Andrew Vacco ,  Nina Yukov ,  A. James Brock

IPC分类号： C25D1102

CPC分类号： H05K3/025 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/265

摘要： A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.

摘要翻译： 复合材料包括结构载体层和由剥离层分离的相对薄的金属箔层。 可以是诸如镍或铬的金属和非金属如氧化铬，氧化镍，磷酸铬或磷酸镍的混合物的释放层提供了金属箔层与载体带的剥离强度， 通常为0.1磅/英寸至2磅/英寸。 这提供了足够的粘合力以防止金属箔层从载体层过早分离，但是当需要时容易除去载体层。 通常，金属箔层随后结合到电介质上，然后移除载体层。 然后将金属箔层成像为印刷电路板和柔性电路的制造中的电路特征。

公开(公告)号：US5300158A

公开(公告)日：1994-04-05

申请号：US889036

申请日：1992-05-26

申请人： Szuchain Chen ,  Nina Yukov

发明人： Szuchain Chen ,  Nina Yukov

IPC分类号： C23C22/33 ,  H01L23/495 ,  H05K3/28 ,  H05K3/38 ,  C25D7/06

CPC分类号： H01L23/49582 ,  C23C22/33 ,  H05K3/282 ,  H05K3/385 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041

摘要： There is provided a method of treating a copper or copper alloy substrate to provide improved resistance to both oxidation and to chemical attack. The substrate is immersed in an aqueous solution containing both chromium (VI) ion and phosphate ions. The treatment is particularly effective for protecting imaged printed circuit boards during storage, handling and use.

摘要翻译： 提供了一种处理铜或铜合金基底以提供改善的对氧化和化学侵蚀的抵抗力的方法。 将基底浸入含有铬（VI）离子和磷酸根离子的水溶液中。 该处理对于在存储，处理和使用期间保护成像的印刷电路板特别有效。

公开(公告)号：US20050123782A1

公开(公告)日：2005-06-09

申请号：US11035468

申请日：2005-01-13

申请人： Szuchain Chen ,  William Brenneman ,  Andrew Vacco ,  Nina Yukov

发明人： Szuchain Chen ,  William Brenneman ,  Andrew Vacco ,  Nina Yukov

IPC分类号： B32B15/01 ,  C25D1/04 ,  H05K3/02 ,  H05K3/38 ,  B32B15/00 ,  B21D39/00

CPC分类号： H05K3/384 ,  C25D1/04 ,  H05K3/025 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12993 ,  Y10T428/265

摘要： A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

摘要翻译： 一种复合材料，其包括载体带，所述载体带包括第一侧，所述第一侧包含基本上均匀的粗糙度，电解沉积的铜箔层具有相对的第一和第二侧，厚度为0.1微米至15微米，并且整个金属 已经由含铜碱性电解质沉积的箔层厚度以及有利于有助于将金属箔层与载体带分离的剥离层，所述载体带设置在载体带的第一侧和金属箔的第二面之间并接触 层。

公开(公告)号：US06346335B1

公开(公告)日：2002-02-12

申请号：US09522544

申请日：2000-03-10

申请人： Szuchain Chen ,  Julius Fister ,  Andrew Vacco ,  Nina Yukov ,  A. James Brock

发明人： Szuchain Chen ,  Julius Fister ,  Andrew Vacco ,  Nina Yukov ,  A. James Brock

IPC分类号： B32B1520

CPC分类号： H05K3/025 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/265

摘要： A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.

摘要翻译： 复合材料包括结构载体层和由剥离层分离的相对薄的金属箔层。 可以是诸如镍或铬的金属和非金属如氧化铬，氧化镍，磷酸铬或磷酸镍的混合物的释放层提供了金属箔层与载体带的剥离强度， 通常为0.1磅/英寸至2磅/英寸。 这提供了足够的粘合力以防止金属箔层从载体层过早分离，但是当需要时容易除去载体层。 通常，金属箔层随后结合到电介质上，然后移除载体层。 然后将金属箔层成像为印刷电路板和柔性电路的制造中的电路特征。

公开(公告)号：US5800930A

公开(公告)日：1998-09-01

申请号：US879689

申请日：1997-06-24

申请人： Szuchain Chen ,  Nina Yukov

发明人： Szuchain Chen ,  Nina Yukov

IPC分类号： C25D5/10 ,  C25D5/16 ,  C25D5/18 ,  C25D5/48 ,  C25D7/06 ,  H05K3/07 ,  H05K3/38 ,  B32B15/20

CPC分类号： H05K3/384 ,  C25D5/16 ,  C25D5/18 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/0723 ,  H05K3/07 ,  Y10S428/935 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/1291 ,  Y10T428/12993

摘要： There it is disclosed a chemical treatment for copper foil which imparts a dark brown to black color to the foil and improves the bond strength of the foil to a dielectric substrate without detrimentally changing the etching characteristics of the foil. The treatment includes depositing a nodular copper/nickel alloy layer on a surface of the foil. These nodules are 55% to 95% by weight copper and are electrolytically deposited using a pulse power controller.

摘要翻译： 公开了一种用于铜箔的化学处理，其对箔施加深褐色至黑色，并且改善箔与电介质基底的结合强度，而不会有害地改变箔的蚀刻特性。 该处理包括在箔的表面上沉积结节状铜/镍合金层。 这些结节是铜的55重量％至95重量％，并且使用脉冲功率控制器进行电解沉积。

公开(公告)号：US5230932A

公开(公告)日：1993-07-27

申请号：US855380

申请日：1992-03-20

申请人： Szuchain F. Chen ,  Nina Yukov ,  Lifun Lin ,  Chung-Yao Chao

发明人： Szuchain F. Chen ,  Nina Yukov ,  Lifun Lin ,  Chung-Yao Chao

IPC分类号： H05K3/24 ,  H05K3/38

CPC分类号： H05K3/384 ,  H05K2201/0355 ,  H05K2203/0723 ,  H05K3/244 ,  Y10S428/935 ,  Y10T428/12438 ,  Y10T428/12792 ,  Y10T428/12903

摘要： A technique for improving the tarnish and oxidation resistance of copper and copper based ally material is disclosed. The material is electrolytically coated by immersion in an aqueous electrolyte containing sodium hydroxide, zinc ions and chromium (VI) ions. The deposited coating is a codeposited layer of zinc and chromium with a zinc to chromium ratio of from about 5:1 to about 12:1. The coating provides tarnish resistance at temperatures in excess of 190.degree. C. and is removable by immersion in sulfuric acid.

摘要翻译： 公开了一种改善铜和铜基合金材料的抗褪色和抗氧化性能的技术。 该材料通过浸入含有氢氧化钠，锌离子和铬（VI）离子的含水电解质中进行电解涂覆。 沉积的涂层是锌和铬的共沉积层，锌与铬的比率为约5:1至约12:1。 该涂层在超过190℃的温度下提供抗光泽性，并且可通过浸入硫酸中除去。