公开(公告)号：US6058020A

公开(公告)日：2000-05-02

申请号：US221787

申请日：1998-12-28

Applicant: Jurgen Winterer ,  Gottfried Beer ,  Bernd Stadler

Inventor： Jurgen Winterer ,  Gottfried Beer ,  Bernd Stadler

IPC: H01L23/28 ,  H01L23/047 ,  H01L23/13 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H01L41/053

CPC classification number: H01L23/047 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49861 ,  H05K3/303 ,  H01L2224/05554 ,  H01L2224/056 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10931 ,  Y02P70/613

Abstract: A component housing for surface mounting of a semiconductor component on a component-mounting surface of a printed circuit board. The component housing including a chip carrier made of an electrically insulating material and having an approximately planar chip carrier area, a semiconductor chip, preferably having an integrated electronic circuit, secured on the chip carrier area, and electrode terminals having a surface-mountable configuration. The electrode terminals penetrating through the chip carrier and electrically connected to the semiconductor chip. A distance between the component-mounting surface of the printed circuit board and outer delimiting areas of the chip carrier which face the component-mounting surface of the printed circuit board increases continuously from an edge region to a central region of the chip carrier.

Abstract translation: 一种用于将半导体部件表面安装在印刷电路板的部件安装表面上的部件壳体。 所述部件壳体包括由电绝缘材料制成并且具有大致平坦的芯片载体区域的芯片载体，固定在芯片载体区域上的优选具有集成电子电路的半导体芯片，以及具有可表面安装的构造的电极端子。 电极端子穿过芯片载体并电连接到半导体芯片。 印刷电路板的部件安装面与面向印刷电路板的部件安装面的芯片载体的外部限定区域之间的距离从芯片载体的边缘区域到中心区域连续地增加。

公开(公告)号：US6047604A

公开(公告)日：2000-04-11

申请号：US221784

申请日：1998-12-28

Applicant: Albert Auburger ,  Jurgen Winterer

Inventor： Albert Auburger ,  Jurgen Winterer

IPC: G01L9/00 ,  G01L19/00 ,  H01L29/84 ,  G01L9/06

CPC classification number: G01L19/003 ,  G01L19/0084 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465

Abstract: The pressure sensor component is mountable on the component-mounting surface of a printed circuit board. The component has a chip carrier of electrically insulating material formed with a substantially flat chip carrier surface. A semiconductor chip with a pressure sensor is fastened on the chip carrier surface. Electrode connections with a surface-mountable structure penetrate the chip carrier and they are electrically connected to the semiconductor chip. The chip carrier is filled with a flowable filler completely covering the semiconductor chip.

Abstract translation: 压力传感器部件可安装在印刷电路板的部件安装表面上。 该部件具有形成有基本平坦的芯片载体表面的电绝缘材料的芯片载体。 具有压力传感器的半导体芯片紧固在芯片载体表面上。 具有可表面安装的结构的电极连接穿透芯片载体并且它们电连接到半导体芯片。 芯片载体填充有完全覆盖半导体芯片的可流动填料。