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公开(公告)号:US5128424A
公开(公告)日:1992-07-07
申请号:US732078
申请日:1991-07-18
IPC分类号: C08G59/66 , C09J163/00
CPC分类号: C08G59/66 , C09J163/00
摘要: Broadly, the present invention is directed to an adhesive composition which comprises an epoxy resin, an effective amount of a mercapto curing agent or curative for said epoxy resin, and a compatibilizing amount of a polysulfide compound which has a performance improving fraction of its --SH groups rendered unreactive with the epoxy groups in said composition. Optionally, the adhesive composition can contain amine or amide curing agents in addition to the mercapto curative. Advantageously, at least about 5% of the number of reactive thiol groups of the polysulfide compound are rendered unreactive, advantageously at least about 25%, and preferably at least about 50%. Preferred polysulfide compatibilizing compounds are adducts of a polysulfide and a component which contains functionality reactive with a thiol group, but which contains no residual functionality reactive with epoxy groups in the composition once the polysulfide adduct is formed. Another aspect of the present invention is a method for improving the performance of an adhesive composition of an epoxy resin and a mercapto curative, which method comprises incorporating a compatibilizing amount of polysulfide compound which has had a performance improving fraction of its --SH groups rendered unreactive with epoxy groups in the composition. The polysulfide compatibilizing adduct is formed by the reaction of a polysulfide and a component that contains functionality reactive with thiol groups, but which contains no residual functionality reactive with epoxy groups in the adduct.
摘要翻译: 广泛地,本发明涉及一种粘合剂组合物,其包含环氧树脂,有效量的巯基固化剂或所述环氧树脂的固化剂,以及相容剂量的具有-SH的性能提高分数的多硫化合物 所述组合物中的环氧基团不反应。 任选地,粘合剂组合物除了巯基固化剂之外还可含有胺或酰胺固化剂。 有利的是,多硫化物化合物的反应性硫醇基团的数量的至少约5%为非反应性,有利地为至少约25%,优选至少约50%。 优选的多硫化物相容化合物是多硫化物和含有与硫醇基反应的官能团的组分的加合物,但是一旦形成多硫化物加合物,其不含在组合物中与环氧基反应的残余官能团。 本发明的另一方面是提高环氧树脂和巯基固化剂的粘合剂组合物的性能的方法,该方法包括加入相容剂量的多硫化物,其具有不反应的-SH基团的性能提高分数 在组合物中具有环氧基团。 多硫相容化加合物是通过多硫化物和含有与硫醇基反应的官能团的组分的反应形成的,但不包含与加合物中的环氧基反应的残余官能团。
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公开(公告)号:US5504156A
公开(公告)日:1996-04-02
申请号:US355980
申请日:1994-12-14
IPC分类号: C08L9/00 , C08L21/00 , C08L23/00 , C08L23/06 , C08L23/08 , C08L23/12 , C08L23/26 , C08L51/00 , C08L53/02 , C08L53/00 , C08L33/02
CPC分类号: C08L53/025 , C08L23/0876 , C08L51/003 , C08L2205/03 , C08L23/06 , C08L23/12 , Y10S525/901 , Y10S525/941
摘要: A thermoplastic elastomer composition which comprises (I) 99 to 1% by weight of a hydrogenated diene copolymer having a number average molecular weight of 50000 to 700,000 in which 80% or more of the double bonds of the conjugated diene portion of the conjugated diene polymer have been saturated, (II) 1 to 99% by weight of an ionomer resin having an .alpha.-olefin unit having 2 to 8 carbon atoms and an .alpha.,.beta.-unsaturated carboxylic acid unit, at least part of the carboxyl group of said unsaturated carboxylic acid unit having been neutralized with a metal ion, and (III) 0 to 70% by weight of a polyolefin resin, provided that (I)+(II)+(III)=100% by weight. Said composition is excellent in moldability and gives a molded article excellent in transparency, flexibility, mechanical strength, heat resistance and impact resilience.
摘要翻译: 一种热塑性弹性体组合物,其包含(I)99〜1重量%的数均分子量为50000〜700,000的氢化二烯共聚物,其中共轭二烯聚合物的共轭二烯部分的双键的80%以上 已经饱和,(II)1至99重量%的具有2至8个碳原子的α-烯烃单元的离聚物树脂和α,β-不饱和羧酸单元,所述不饱和羧酸的至少部分羧基 羧酸单元已经用金属离子中和,和(III)0-70%重量的聚烯烃树脂,条件是(I)+(II)+(III)= 100重量%。 所述组合物的成型性优异,得到透明性,柔软性,机械强度,耐热性和冲击弹性优异的成型体。
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公开(公告)号:US4912152A
公开(公告)日:1990-03-27
申请号:US264388
申请日:1988-10-31
CPC分类号: C08G18/703 , C08G18/10 , C08G2190/00
摘要: A one-pack type thermosetting composition comprising (A) at least one polyisocyanate compound having dispersed therein (B) at least one compound selected from the group consisting of (1) a solid polyfunctional compound having at least one functional group selected from the group consisting of hydrazino, primary amido and sulfamoyl groups, (2) a solid compound having at least one amidino group and (3) a solid compound having a heterocyclic ring and a plurality of active hydrogen atoms, or a one-pack type thermosetting composition comprising (A') a mixture consisting of (a) at least one polyisocyanate compound and (b) at least one high boiling polar compound, having dispersed therein (B') a solid polyfunctional compound having at least one active hydrogen atom. Said one-pack type thermosetting composition is storable and suitable for use in adhesives, sealing materials, coatings and shaped articles of resin.
摘要翻译: 一种单组分型热固性组合物,其包含(A)至少一种其中分散有的多异氰酸酯化合物(B)至少一种选自以下的化合物:(1)具有至少一个选自以下的官能团的固体多官能化合物: 的肼基,伯酰胺基和氨磺酰基,(2)具有至少一个脒基的固体化合物和(3)具有杂环和多个活性氢原子的固体化合物,或单组分型热固性组合物,其包含( A')由(a)至少一种多异氰酸酯化合物和(b)至少一种分散在其中的高沸点极性化合物(B')组成的混合物,其具有至少一个活性氢原子的固体多官能化合物。 所述单组分型热固性组合物可储存并适用于粘合剂,密封材料,涂料和成型树脂制品。
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公开(公告)号:US4560737A
公开(公告)日:1985-12-24
申请号:US567177
申请日:1983-12-30
IPC分类号: C08L7/00 , B29C49/00 , B29C55/00 , B29C55/02 , C08J7/00 , C08L1/00 , C08L21/00 , C08L23/00 , C08L27/00 , C08L27/14 , C08L27/16 , C08L51/00 , C08L51/02 , C08L51/06 , C08L77/00 , C08L101/00 , H01B3/44 , H01L41/193 , H01L41/45
CPC分类号: H01L41/45 , C08L27/16 , H01L41/193 , H01L41/257
摘要: A piezoelectric polymeric material in the form of sheet or film, which comprises polymers of vinylidene fluoride (VDF) as principle components. The piezoelectric material is essentially a mixture of 100 parts by weight of a VDF base resin, which may be either poly(VDF) or a copolymer, and 1-100 parts by weight of a copolymer of a fluoroelastomer and either VDF monomer or a monomer mixture containing a major amount of VDF monomer. A sheet or film having a high piezoelectric modulus is obtained by stretching a sheet or film of said mixture at an adequately elevated temperature and polarizing the sheet or film after or during the stretching thereby making the stretching sheet or film an electret.
摘要翻译: 以片状或薄膜形式的压电聚合物材料,其包含偏二氟乙烯(VDF)的聚合物作为主要组分。 压电材料基本上是100重量份的可以是聚(VDF)或共聚物的VDF基础树脂和1-100重量份含氟弹性体和VDF单体或单体的共聚物的混合物 含有大量VDF单体的混合物。 通过在适当升高的温度下拉伸所述混合物的片材或薄膜,在拉伸后或拉伸过程中对片材或膜进行偏振,从而使拉伸片材或薄膜成为驻极体,获得具有高压电模量的片材或薄膜。
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