公开(公告)号：US20110061482A1

公开(公告)日：2011-03-17

申请号：US12992249

申请日：2009-05-07

申请人： Kazuya Maruyama ,  Kouichi Jinushi ,  Yoshiko Adachi

发明人： Kazuya Maruyama ,  Kouichi Jinushi ,  Yoshiko Adachi

IPC分类号： F16H25/20

CPC分类号： G02B27/0149 ,  F16H25/2015 ,  F16H25/2021 ,  Y10T74/18576

摘要： A power transmission device which is free from a possibility of breakage of a driving member is provided. A stepping motor (driving member) 61a configured to be driven on the basis of a command signal from a controller 70, a lead screw portion 61c configured to be rotationally driven in association with the drive of the stepping motor 61a, and a power transmitting member 65 configured to move along an axial direction X of the lead screw portion 61c in accordance with the rotation of the lead screw portion 61c and transmit a power to a power transmitted member 42e are provided, and the controller 70 is configured to control the output of the command signal to the stepping motor 61a to be stopped when the power transmitting member 65 is not moved along the axial direction X.

摘要翻译： 提供一种没有驱动部件破损的动力传递装置。 基于来自控制器70的命令信号驱动的步进电机（驱动部件）61a，与步进电动机61a的驱动相关联地构成为旋转驱动的导螺杆部61c，以及动力传递部件 65被配置为根据导螺杆部61c的旋转沿着导螺杆部61c的轴向X移动，并向电力传递构件42e发送电力，并且控制器70被配置为控制 当动力传递构件65不沿着轴向X移动时，向步进电动机61a的指令信号停止。

公开(公告)号：US06558259B1

公开(公告)日：2003-05-06

申请号：US09499639

申请日：2000-02-08

申请人： Kazuya Maruyama ,  Isao Nakamura

发明人： Kazuya Maruyama ,  Isao Nakamura

IPC分类号： A63F914

CPC分类号： A63F13/493 ,  A63F13/10 ,  A63F13/803 ,  A63F2300/50 ,  A63F2300/63 ,  A63F2300/8017

摘要： A game machine and information storage medium which can change at least one of game termination numbers specified for items including a lap number, life, time limit, player's vehicles, game points and game stages, for player's benefit, in comparison with the normal game termination number to be set by reception of a game charge for a normal one play of the game. This game machine comprises: an additional charge processing section for receiving an additional charge before game termination; a game termination number setting section for setting the game termination number for player's benefit in comparison with the normal game termination number set by reception of a game charge for a normal one play of the game; and a game termination processing section for processing for terminating the game when a specific number of laps or a time limit reaches the changed game termination number.

摘要翻译： 一种游戏机和信息存储介质，与通常的游戏终端相比，可以改变为了玩家的利益而改变指定为包括圈数，生命，时间限制，玩家的车辆，游戏点和游戏阶段的项目的游戏终止号码中的至少一个 通过接收游戏的正常一次游戏的游戏费用来设定的号码。 该游戏机包括：附加费用处理部分，用于在游戏终止之前接收附加费用; 游戏终止号码设定部，其与通过游戏的正常一次游戏接收的游戏费用设定的通常游戏终止号相比较，设定玩家利益的游戏终止号码; 以及游戏终止处理部，用于当特定圈数或时间限制达到改变的游戏终止号码时处理终止游戏。

公开(公告)号：US08581118B2

公开(公告)日：2013-11-12

申请号：US12920410

申请日：2009-08-31

申请人： Takashi Kasuga ,  Hidehiko Mishima ,  Kazuya Maruyama

发明人： Takashi Kasuga ,  Hidehiko Mishima ,  Kazuya Maruyama

IPC分类号： H02G3/18

CPC分类号： H02G3/088

摘要： A seal structure capable of achieving a waterproof structure at low cost while being flexibly adaptable to design change of a wire member, a method of forming the seal structure, a wire body and an electronic apparatus using them are provided. A seal structure 15 for sealing through holes 33, 43 of housings 31, 41 in which a wire member 20 is inserted is configured to include a covering C that includes a spacer member 11 disposed on one side of the through hole, secures the spacer member 11, the wire member 20 and the housings 31, 41 to each other and seals them.

摘要翻译： 提供一种能够以柔软的方式适应线材的设计变更而实现低成本的防水结构的密封结构，形成密封结构的方法，线体和使用它们的电子设备。 用于密封其中插入有线构件20的壳体31,41的通孔33,43的密封结构15被构造成包括覆盖物C，该覆盖物C包括设置在通孔的一侧上的间隔构件11， 如图11所示，线材20和壳体31,41彼此密封。

公开(公告)号：US08404497B2

公开(公告)日：2013-03-26

申请号：US12946131

申请日：2010-11-15

申请人： Kazuya Maruyama ,  Toshikazu Ishikawa ,  Jun Matsuhashi ,  Takashi Kikuchi

发明人： Kazuya Maruyama ,  Toshikazu Ishikawa ,  Jun Matsuhashi ,  Takashi Kikuchi

IPC分类号： H01L21/66

CPC分类号： H01L23/49838 ,  H01L22/32 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A surface mount type semiconductor device is disclosed. The semiconductor device has testing lands on a lower surface of a wiring substrate with a semiconductor chip mounted thereon. Lower surface-side lands with solder balls coupled thereto respectively and testing lands with solder balls not coupled thereto are formed on a lower surface of a wiring substrate. To suppress the occurrence of contact imperfection between the testing lands and land contacting contact pins provided in a probe socket, the diameter of each testing land is set larger than the diameter of each lower surface-side land. Even when the wiring substrate is reduced in size, electrical characteristic tests using the testing lands can be done with high accuracy.

摘要翻译： 公开了一种表面贴装型半导体器件。 半导体器件具有安装在其上的半导体芯片的布线基板的下表面上的测试焊盘。 具有与其分别耦合的焊料球的下表面侧焊盘和在其没有耦合的焊球的测试焊盘形成在布线基板的下表面上。 为了抑制测试台和设置在探针插座中的接地触针之间的接触不良的发生，每个测试台的直径被设定为大于每个下表面侧的直径。 即使布线基板的尺寸减小，也可以高精度地进行使用测试台面的电特性测试。

公开(公告)号：US20110000712A1

公开(公告)日：2011-01-06

申请号：US12920410

申请日：2009-08-31

申请人： Takashi Kasuga ,  Hidehiko Mishima ,  Kazuya Maruyama

发明人： Takashi Kasuga ,  Hidehiko Mishima ,  Kazuya Maruyama

IPC分类号： H02G3/18 ,  B32B37/12

CPC分类号： H02G3/088

摘要： A seal structure capable of achieving a waterproof structure at low cost while being flexibly adaptable to design change of a wire member, a method of forming the seal structure, a wire body and an electronic apparatus using them are provided. A seal structure 15 for sealing through holes 33, 43 of housings 31, 41 in which a wire member 20 is inserted is configured to include a covering C that includes a spacer member 11 disposed on one side of the through hole, secures the spacer member 11, the wire member 20 and the housings 31, 41 to each other and seals them.

摘要翻译： 提供一种能够以柔软的方式适应线材的设计变更而实现低成本的防水结构的密封结构，形成密封结构的方法，线体和使用它们的电子设备。 用于密封其中插入有线构件20的壳体31,41的通孔33,43的密封结构15被构造成包括覆盖物C，该覆盖物C包括设置在通孔的一侧上的间隔构件11， 如图11所示，线材20和壳体31,41彼此密封。

公开(公告)号：US08864325B2

公开(公告)日：2014-10-21

申请号：US12992249

申请日：2009-05-07

申请人： Kazuya Maruyama ,  Kouichi Jinushi ,  Yoshiko Adachi

发明人： Kazuya Maruyama ,  Kouichi Jinushi ,  Yoshiko Adachi

IPC分类号： G02B7/182 ,  F16H25/20 ,  G02B27/01

CPC分类号： G02B27/0149 ,  F16H25/2015 ,  F16H25/2021 ,  Y10T74/18576

摘要： A power transmission device which is free from a possibility of breakage of a driving member is provided. A stepping motor (driving member) 61a configured to be driven on the basis of a command signal from a controller 70, a lead screw portion 61c configured to be rotationally driven in association with the drive of the stepping motor 61a, and a power transmitting member 65 configured to move along an axial direction X of the lead screw portion 61c in accordance with the rotation of the lead screw portion 61c and transmit a power to a power transmitted member 42e are provided, and the controller 70 is configured to control the output of the command signal to the stepping motor 61a to be stopped when the power transmitting member 65 is not moved along the axial direction X.

摘要翻译： 提供一种没有驱动部件破损的动力传递装置。 基于来自控制器70的命令信号驱动的步进电机（驱动部件）61a，与步进电动机61a的驱动相关联地构成为旋转驱动的导螺杆部61c，以及动力传递部件 65被配置为根据导螺杆部61c的旋转沿着导螺杆部61c的轴向X移动，并向电力传递构件42e发送电力，并且控制器70被配置为控制 当动力传递构件65不沿着轴向X移动时，向步进电动机61a的指令信号停止。

公开(公告)号：US20110140105A1

公开(公告)日：2011-06-16

申请号：US12946131

申请日：2010-11-15

申请人： Kazuya MARUYAMA ,  Toshikazu ISHIKAWA ,  Jun MATSUHASHI ,  Takashi KIKUCHI

发明人： Kazuya MARUYAMA ,  Toshikazu ISHIKAWA ,  Jun MATSUHASHI ,  Takashi KIKUCHI

IPC分类号： H01L23/495 ,  H01L21/66

CPC分类号： H01L23/49838 ,  H01L22/32 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A surface mount type semiconductor device is disclosed. The semiconductor device has testing lands on a lower surface of a wiring substrate with a semiconductor chip mounted thereon. Lower surface-side lands with solder balls coupled thereto respectively and testing lands with solder balls not coupled thereto are formed on a lower surface of a wiring substrate. To suppress the occurrence of contact imperfection between the testing lands and land contacting contact pins provided in a probe socket, the diameter of each testing land is set larger than the diameter of each lower surface-side land. Even when the wiring substrate is reduced in size, electrical characteristic tests using the testing lands can be done with high accuracy.

摘要翻译： 公开了一种表面贴装型半导体器件。 半导体器件具有安装在其上的半导体芯片的布线基板的下表面上的测试焊盘。 具有与其分别耦合的焊料球的下表面侧焊盘和在其没有耦合的焊球的测试焊盘形成在布线基板的下表面上。 为了抑制测试台和设置在探针插座中的接地触针之间的接触不良的发生，每个测试台的直径被设定为大于每个下表面侧的直径。 即使布线基板的尺寸减小，也可以高精度地进行使用测试台面的电特性测试。