摘要:
A semiconductor memory device includes a clock synchronizing unit for receiving a first power voltage through a first power voltage terminal, and an additional power voltage providing unit for additionally providing a second power voltage to the first power voltage terminal for a predetermined period after leaving a power down mode.
摘要:
An integrated circuit includes a pad, an input buffer unit, and a supplementary driving unit. The pad is configured to receive a reset signal from an external device. The input buffer unit is configured to buffer a reset signal applied to the pad. The supplementary driving unit is configured to receive an output signal from the input buffer unit and supplementarily drive an input terminal of the input buffer unit to a deactivation level of the reset signal.
摘要:
A data alignment circuit of a semiconductor memory apparatus includes: a data strobe clock phase control block configured to control a phase of a data strobe clock signal in response to a strobe delay code and generate a delayed strobe clock signal; a plurality of data phase control blocks configured to control phases of input data in response to data delay codes and generate delayed data; a plurality of data alignment blocks configured to latch the delayed data in response to the delayed strobe clock signal and generate latched data and aligned data; and a delay code generation block configured to perform an operation of determining phases of the latched data and generate the strobe delay code and the data delay codes.
摘要:
A semiconductor memory device includes a clock synchronizing unit for receiving a first power voltage through a first power voltage terminal, and an additional power voltage providing unit for additionally providing a second power voltage to the first power voltage terminal for a predetermined period after leaving a power down mode.
摘要:
A test circuit in a memory device includes a first compression unit configured to compress data of a plurality of cells to transmit first compressed data to a plurality of input/output lines, and a second compression unit configured to compress the first compressed data on the plurality of input/output line to output second compressed data to at least one output pin, wherein the second compression unit operates in a low compressing mode and a high compressing mode in response to a data compression selecting signal.
摘要:
An on die thermal sensor (ODTS) for use in a semiconductor memory device includes: a temperature information code generation unit for sensing an internal temperature of the semiconductor memory device in response to first and second enable signals and for generating a temperature information code which includes the sensed temperature information; and a flag signal logic determination unit for generating a plurality of first flag signals having temperature information and determining whether the plurality of first flag signals have a predetermined logic level or a variable logic level in response to the first and second enable signals.
摘要:
Provided is concerned with a voltage regulation circuit and method of regulating the voltage, including a reference voltage generator for generating a reference voltage by dividing a core voltage of a semiconductor memory device, a controller for controlling the reference voltage generator to adjust the reference voltage without handling the core voltage in response to a test signal of a test mode, and a voltage generator for generating a bit-line precharging voltage and/or a cell plate voltage in accordance with the reference voltage.
摘要:
The semiconductor apparatus includes a reference delay value check unit configured to receive a source signal and delay the source signal to generate a reference delay signal; a process delay value check unit configured to receive the source signal and delay the source signal to generate a process delay signal; and a signal generation unit configured to receive the reference delay signal and the process delay signal, receive an input signal, and variably delay the input signal based on the reference delay signal and the process delay signal to generate an output signal.
摘要:
The semiconductor apparatus includes a reference delay value check unit configured to receive a source signal and delay the source signal to generate a reference delay signal; a process delay value check unit configured to receive the source signal and delay the source signal to generate a process delay signal; and a signal generation unit configured to receive the reference delay signal and the process delay signal, receive an input signal, and variably delay the input signal based on the reference delay signal and the process delay signal to generate an output signal.
摘要:
An on die thermal sensor (ODTS) for use in a semiconductor device includes a temperature information output unit for measuring an internal temperature of the semiconductor device to generate a temperature information code having temperature information, and updating the temperature information code according to a refresh period.