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公开(公告)号:US20090314534A1
公开(公告)日:2009-12-24
申请号:US12301265
申请日:2007-05-29
CPC分类号: H01L33/642 , H01L23/24 , H01L24/45 , H01L24/73 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L33/647 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要: An electronic component (1) is provided with a circuit board (2) having a plurality of electrodes on the upper and lower planes of an insulating substrate, and a circuit element (7) fixed to the upper plane of the circuit board (2). The electronic component is also provided with an upper electrode (4) whereupon a circuit element (7) is to be arranged; a through hole (13) penetrating the insulating substrate (12); and a lower electrode (15), which is formed on the lower side ranging from a first side end (20A) of the circuit board (2) to a sectional side end (20B) facing the first side end (20A) and carries electricity to the upper electrode (4) through the through hole (13).
摘要翻译: 电子部件(1)具有在绝缘基板的上下面具有多个电极的电路基板(2)和固定在电路基板(2)的上面的电路元件(7) 。 电子部件还设置有上电极(4),电路元件(7)将被布置; 穿过所述绝缘基板(12)的通孔(13); 以及下电极(15),其形成在从电路基板(2)的第一侧端部(20A)到面向第一侧端部(20A)的截面侧端部(20B)的下侧,并且承载电力 通过通孔(13)到达上电极(4)。
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公开(公告)号:US20090154176A1
公开(公告)日:2009-06-18
申请号:US12301283
申请日:2007-05-29
CPC分类号: H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , Y10T29/5313 , H01L2924/00014 , H01L2924/00
摘要: In an electronic component (1), a frame (3) composed of a conductor is fixed on a circumference portion on the upper surface of a circuit board (2). The circuit board (2) and the frame (3) have a side surface (41) composed of a same surface, and the circuit board (2) is provided with terminal sections (16, 17) exposed on the side surface (41). The frame (3) has an empty space (22) over a lower surface facing the circuit board (2) and a side surface (20). The empty space (22) may be filled with an insulating material.
摘要翻译: 在电子部件(1)中,由导体构成的框架(3)固定在电路基板(2)的上表面的圆周部上。 电路板(2)和框架(3)具有由相同的表面组成的侧表面(41),并且电路板(2)设置有暴露在侧表面(41)上的端子部分(16,17) 。 框架(3)在面向电路板(2)的下表面和侧表面(20)上具有空的空间(22)。 空的空间(22)可以填充绝缘材料。
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