Method of quantitative determination of defect concentration on surfaces
    1.
    发明授权
    Method of quantitative determination of defect concentration on surfaces 失效
    定量测定表面缺陷浓度的方法

    公开(公告)号:US5389786A

    公开(公告)日:1995-02-14

    申请号:US46758

    申请日:1993-04-15

    CPC分类号: G01N21/718

    摘要: The ablation threshold of a laser fluence with respect to the surface of a sample manufactured in a high vacuum chamber is determined by using the sample. The quantity of vacancy-type defects is determined by radiating a laser beam having a fluence slightly higher than the ablation threshold on the surface. At the same time, the quantities of adatom-type and kink-type defects are determined by radiating a pulsed laser beam having a fluence slightly lower than the ablation threshold on the surface repeatedly to obtain the relation between an emission yield and the number of laser pulses. The quantity of the adatom-type defects is obtained by determining the area (total quantity of emitted atoms) of a rapidly decreasing portion of the relation. The quantity of kink-type defects is obtained by determining a magnitude of an emission yield of a slowly decreasing portion of the relation.

    摘要翻译: 通过使用样品来确定相对于在高真空室中制造的样品的表面的激光注量的消融阈值。 通过辐射具有略高于表面上的消融阈值的注量的激光束来确定空位型缺陷的量。 同时,通过在表面上辐射略低于表面消融阈值的注量的脉冲激光束来确定吸收原子类型和扭结型缺陷的数量,以获得发射产量与激光数目之间的关系 脉冲。 通过确定关系的快速减少部分的面积(发射原子的总量)来获得吸收原子型缺陷的量。 通过确定关系的缓慢减少部分的发射产量的大小来获得扭结型缺陷的数量。

    Exposure apparatus
    2.
    发明授权
    Exposure apparatus 失效
    曝光装置

    公开(公告)号:US5168304A

    公开(公告)日:1992-12-01

    申请号:US829611

    申请日:1992-01-30

    申请人: Ken Hattori

    发明人: Ken Hattori

    IPC分类号: G03F7/20

    CPC分类号: G03F7/2022

    摘要: An exposure apparatus for selectively exposing the peripheral portion of a circular substrate such as wafer for integrated circuit manufacturing purposes. In this exposure apparatus, the spot of an exposure light beam from a projecting system is projected onto the peripheral portion of a resist-coated surface of a substantially circular substrate in such a manner that a part of the spot projects from the peripheral edge of the substrate. The portion of the spot projecting from the peripheral edge of the substrate is received by a detector arranged opposite to the projecting system through the intermediary of the substrate peripheral portion so that the position of the substrate peripheral edge in the projected spot is detected in accordance with the contour position of the received spot portion. During rotation of the substrate, in accordance with the detection signal the projecting system is controlled to move in the radial direction of the substrate in response to the displacement of the substrate peripheral edge so that the exposure light beam always illuminated the peripheral portion of the substrate within a given dimensional extend in the radial direction. Further, in the present exposure apparatus the rotational speed of the substrate and the exposure conditions by the spot formed on the substrate peripheral portion by the light beam (the intensity and/or size of the integrated exposure light) are controlled in such a manner that the exposure light quantity applied to the substrate peripheral portion by the spot attains a predetermined proper exposure light quantity.

    摘要翻译: 一种用于集成电路制造目的的用于选择性地暴露诸如晶片的圆形衬底的周边部分的曝光装置。 在该曝光装置中,来自投影系统的曝光光束的光斑以大致圆形的基板的抗蚀剂涂布面的周边部投影,使得一部分光点从 基质。 从基板的周缘突出的部分的部分由与基板周边部分的介质相对的投影系统布置的检测器接收,使得基板周边边缘在投影光斑中的位置根据 接收点部分的轮廓位置。 在基板旋转期间,根据检测信号,投影系统被控制为响应于基板周缘的位移而沿着基板的径向方向移动,使得曝光光束始终照射基板的周边部分 在给定尺寸内沿径向方向延伸。 此外,在本曝光装置中,以通过光束形成在基板周边部分上的光斑(集成曝光光的强度和/或尺寸)的方式控制基板的旋转速度和曝光条件,使得 通过点施加到基板周边部分的曝光量达到预定的适当的曝光量。

    Method and apparatus for monitoring and fault-analyzing networks
    4.
    发明授权
    Method and apparatus for monitoring and fault-analyzing networks 失效
    监测和故障分析网络的方法和装置

    公开(公告)号:US5572533A

    公开(公告)日:1996-11-05

    申请号:US496207

    申请日:1995-06-28

    摘要: A method and an apparatus for monitoring and fault-analyzing a network which includes a plurality of LANs. LAN-to-LAN connectors are provided between LANs. The apparatus includes a monitor fault analyzer. A terminal is connected to a LAN, to issue a command which stores specific packets or transfers stored packets, from a command transmitter to LAN-to-LAN connectors. Upon receiving a command, a command holder of a routing unit (router) of the LAN-to-LAN connector holds the command. The router carries out the usual routing process to pass or block packets transferred from the LAN interfaces according to the addressee. A unit for detecting and copying the specified packets compares the address of each received packet with the addresses stored in the command holder, and if they agree with each other, copies the packet. A data storage unit stores the copy in the storage unit and the time of reception of the packet is measured by the timer and added to the packet. The apparatus monitors and analyzes the contents and time of the collected packets having the addresses of the monitored terminals.

    摘要翻译: 一种用于监视和故障分析包括多个LAN的网络的方法和装置。 LAN之间提供LAN至LAN连接器。 该装置包括监视器故障分析器。 终端连接到局域网,发出存储特定数据包或传送存储数据包的命令,从命令发送器到LAN到LAN连接器。 在接收到命令时,LAN-to-LAN连接器的路由单元(路由器)的命令保持器保持该命令。 路由器根据收件人进行通常的路由处理,以通过或阻止从LAN接口传输的数据包。 用于检测和复制指定包的单元将每个接收到的分组的地址与存储在命令持有者中的地址进行比较,并且如果彼此一致,则复制分组。 数据存储单元将副本存储在存储单元中,并且由定时器测量分组的接收时间并将其添加到分组。 该装置监视并分析具有被监视终端的地址的收集的分组的内容和时间。

    Apparatus for exposing peripheral portion of substrate
    6.
    发明授权
    Apparatus for exposing peripheral portion of substrate 失效
    用于暴露衬底的周边部分的装置

    公开(公告)号:US5229811A

    公开(公告)日:1993-07-20

    申请号:US922660

    申请日:1992-07-31

    IPC分类号: G03F7/20

    CPC分类号: G03F7/2028

    摘要: An exposing apparatus for exposing the periphery portion of a substrate on which resist is uniformly applied while rotating the substrate by a rotating device around a substantially central portion of the substrate, comprising: an irradiating device capable of irradiating a light beam, which is not sensed by the resist, toward the periphery portion of the resist; a light receiving device disposed to confront the irradiating device, receiving the light beam and outputting a light receipt signal in accordance with the quantity of received light; a detection device for detecting the rotational angle of the resist and outputting an angular signal; a moving device for relatively moving the light beam irradiated and the substrate in a radial direction; and a control device, wherein the substrate is disposed between the irradiating device and the light receiving device so as to shield a portion of the light beam and a control device controls the moving device in accordance with the light receipt signal and the angular signal so as to relatively move the light beam and the substrate in such a manner that the radial directional width of a region which is irradiated with the light beam is substantially constant in the periphery portion of the resist.

    摘要翻译: 一种曝光装置,用于暴露基板的周边部分,其上均匀地施加抗蚀剂,同时通过围绕基板的大致中心部分的旋转装置旋转基板,包括:能够照射未被感测的光束的照射装置 通过抗蚀剂朝向抗蚀剂的周边部分; 被配置为面对照射装置的光接收装置,接收光束并根据接收的光量输出光接收信号; 用于检测抗蚀剂的旋转角度并输出角度信号的检测装置; 移动装置,用于沿径向相对移动照射的光束和基底; 以及控制装置,其中,所述基板设置在所述照射装置和所述受光装置之间,以屏蔽所述光束的一部分,并且控制装置根据所述光接收信号和所述角度信号来控制所述移动装置,以便 以使光束和基板相对移动,使得在光刻胶的周边部分中照射光束的区域的径向方向宽度基本上恒定。

    Device for positioning circular semiconductor wafers
    7.
    发明授权
    Device for positioning circular semiconductor wafers 失效
    用于定位圆形半导体晶片的装置

    公开(公告)号:US5194743A

    公开(公告)日:1993-03-16

    申请号:US679251

    申请日:1991-04-02

    IPC分类号: G03F7/20 H01L21/68

    CPC分类号: G03F7/70716 H01L21/681

    摘要: A device for positioning a circular substrate having a cut portion, comprising: a first rotational stage which is finely rotated around the origin of a rectangular coordinate system; an X-Y stage on the first rotational stage which is two-dimensionally moved in the coordinate system; a second rotational stage on the X-Y stage which is rotated while holding the substrate; a first detecting device for detecting information about the displacement change of the periphery of the substrate from the rotational center during the rotation of the second rotational stage; a first positioning controlling device for controlling the rotation of the second rotational stage in accordance with information detected by the first detecting device so that the cut portion is placed in a predetermined direction on the coordinate system; a second detecting device having three or more detecting points in the coordinate system so as to detect the three or more positions of the periphery, the second detecting device generating information about a detection at each of the three or more detecting points; and a second positioning controlling device for controlling the X-Y stage and the first rotational stage in accordance with the detection information from the second detecting device after the cut portion has been placed in the predetermined direction.

    摘要翻译: 一种用于定位具有切割部分的圆形基底的装置,包括:围绕所述直角坐标系的原点精细旋转的第一旋转台; 在坐标系中二维移动的第一旋转台上的X-Y平台; 在X-Y平台上的第二旋转台,其在保持基板的同时旋转; 第一检测装置,用于在所述第二旋转台的旋转期间从所述旋转中心检测关于所述基板的周边的位移变化的信息; 第一定位控制装置,用于根据由第一检测装置检测的信息来控制第二旋转台的旋转,使得切割部分沿坐标系上的预定方向放置; 所述第二检测装置在所述坐标系中具有三个以上的检测点,以检测所述周边的三个以上的位置,所述第二检测装置生成关于所述三个以上检测点中的每一个的检测的信息; 以及第二定位控制装置,用于在切割部分被放置在预定方向之后,根据来自第二检测装置的检测信息来控制X-Y级和第一旋转级。

    Periphery exposing method and apparatus therefor
    9.
    发明授权
    Periphery exposing method and apparatus therefor 失效
    外围曝光方法及其装置

    公开(公告)号:US5361121A

    公开(公告)日:1994-11-01

    申请号:US694759

    申请日:1991-05-02

    CPC分类号: G03F7/2022

    摘要: Prior to a periphery exposing operation, a light emitting unit and a light receiving unit are retracted to a position separate from a wafer, and a calibrating operation is conducted in the retracted position utilizing a light shield plate different from the wafer to be exposed, thereby obtaining a servo control reference signal for the exposure. At the exposure of the periphery portion of the wafer, the exposure width is controlled according to the reference signal. It is therefore rendered possible to achieve exact peripheral exposure, including the intensity and intensity distribution of the exposing light beam immediately before the irradiation of the peripheral portion of the wafer.

    摘要翻译: 在周边曝光操作之前,发光单元和光接收单元缩回到与晶片分离的位置,并且利用不同于要暴露的晶片的遮光板在缩回位置进行校准操作,由此 获得用于曝光的伺服控制参考信号。 在晶片的周边部分的曝光下,根据参考信号来控制曝光宽度。 因此,可以实现精确的周边曝光,包括在晶片的周边部分的照射之前的曝光光束的强度和强度分布。