摘要:
A communication power line status detecting method and a system using the method provided by the present disclosure is suitable for used in a transmission device and a receiving device which are connected by a communication power line. The transmission device transmits a communication indicator signal through the communication power line. When the receiving device receives the communication indicator signal from the communication power line, it converts the communication indicator signal into a time domain in order to analyze the signal reflection and transmission status of the communication indicator signal when it is transmitted via the communication power line, and to generate a line status information corresponding to the communication power line.
摘要:
A multi-input and multi-output antenna device is disclosed. The MIMO antenna device comprises two antennas symmetrically disposed on a substrate. Each antenna comprises a T-shaped feeding unit, a radiation unit and a ground unit. The T-shaped feeding unit and the radiation unit are disposed on a first surface of the substrate. The T-shaped feeding unit forms a strip portion and a top portion. The radiation unit has first and second ends. The radiation unit extends from the first end to the second end to form a rectangular region and a spacing. The first end extends parallel to the top portion. The ground unit is disposed along two sides of the strip portion and electrically coupled to the second end. The two strip portions of the two T-shaped feeding units are parallel to and aligned with each other. The two ground units are electrically connected to each other.
摘要:
A communication power line status detecting method and a system using the method provided by the present disclosure is suitable for used in a transmission device and a receiving device which are connected by a communication power line. The transmission device transmits a communication indicator signal through the communication power line. When the receiving device receives the communication indicator signal from the communication power line, it converts the communication indicator signal into a time domain in order to analyze the signal reflection and transmission status of the communication indicator signal when it is transmitted via the communication power line, and to generate a line status information corresponding to the communication power line.
摘要:
An image sensor package and a method for fabricating thereof are provided. A substrate having an insulator filled cavity is provided with an image sensor device electrical connected to a metal layer, thereon. A covering plate is then disposed on the substrate. The substrate is subsequently thinned to expose the insulator. Removing a portion of the insulator, a hole is formed and a conductive layer is filled therein to form a via hole. Next, a solder ball is located over a backside of the substrate which is electrically connected to the metal layer through the via hole. The image sensor package is thinned, thus, the dimensions thereof are reduced.
摘要:
A radio frequency identification tag device includes an antenna unit including a dielectric substrate that has two through holes extending from a first surface to a second surface opposite to the first surface, a first conductive layer disposed over the first surface of the dielectric substrate, a second conductive layer unit disposed over the second surface of the dielectric substrate and having opposite second conductive layers spaced apart from each other such that a spacer is formed between the second conductive layers, and two connecting conductors each disposed in a corresponding through hole in the dielectric substrate and interconnecting electrically a corresponding second conductive layer and the first conductive layer. A radio frequency identification module is disposed to span the spacer and is attached to the second conductive layer unit.
摘要:
The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
摘要:
The invention provides an image sensor package and a method for fabricating thereof. The package comprises a substrate having an image sensor device electrically connected to a metal layer thereon and a covering plate disposed over the substrate. A plurality of trench insulators is formed in the substrate, whereby the each trench insulator surrounds an isolation region each. A via hole is formed in the substrate within the isolation region and electrically connects to the metal layer to a solder ball thereby transmitting a signal from the image sensor device to an exterior circuit.
摘要:
The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
摘要:
An antenna radome is provided. The antenna radome comprises an antenna radome substrate and a unit cell. The unit cell is formed on a surface of the antenna radome substrate, and the unit cell is perpendicular to a magnetic field direction of an antenna. The unit cell comprises a plurality of conductors.