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公开(公告)号：US20080230254A1
公开(公告)日：2008-09-25
申请号：US12111317
申请日：2008-04-29
IPC分类号： H01B7/08
CPC分类号： H05K1/0219 , H05K1/0393 , H05K3/4647 , H05K2201/0715 , H05K2201/09236 , H05K2201/09618
摘要： A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided.
摘要翻译： 提供传输电缆及其制造方法。 多个信号线形成在绝缘层的一侧，并且在信号线之间形成接地线。 接地线通过形成并嵌入在绝缘层中的金属凸块与与绝缘层的背面形成的屏蔽层电连接。 可以在夹着信号线和接地线的相对侧上形成绝缘层和屏蔽层。 在这种情况下，接地线分别通过其两侧的金属凸块与屏蔽层电连接。 因此，可以提供能够高速传输和大容量传输的高度可靠的传输电缆。
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公开(公告)号：US20070120231A1
公开(公告)日：2007-05-31
申请号：US11619039
申请日：2007-01-02
IPC分类号： H01L39/00
CPC分类号： H05K1/0219 , H05K1/0393 , H05K3/4647 , H05K2201/0715 , H05K2201/09236 , H05K2201/09618
摘要： A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided.
摘要翻译： 提供传输电缆及其制造方法。 多个信号线形成在绝缘层的一侧，并且在信号线之间形成接地线。 接地线通过形成并嵌入在绝缘层中的金属凸块与与绝缘层的背面形成的屏蔽层电连接。 可以在夹着信号线和接地线的相对侧上形成绝缘层和屏蔽层。 在这种情况下，接地线分别通过其两侧的金属凸块与屏蔽层电连接。 因此，可以提供能够高速传输和大容量传输的高度可靠的传输电缆。
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公开(公告)号：US07745731B2
公开(公告)日：2010-06-29
申请号：US12111317
申请日：2008-04-29
IPC分类号： H01B7/08
CPC分类号： H05K1/0219 , H05K1/0393 , H05K3/4647 , H05K2201/0715 , H05K2201/09236 , H05K2201/09618
摘要： A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided.
摘要翻译： 提供传输电缆及其制造方法。 多个信号线形成在绝缘层的一侧，并且在信号线之间形成接地线。 接地线通过形成并嵌入在绝缘层中的金属凸块与与绝缘层的背面形成的屏蔽层电连接。 可以在夹着信号线和接地线的相对侧上形成绝缘层和屏蔽层。 在这种情况下，接地线分别通过其两侧的金属凸块与屏蔽层电连接。 因此，可以提供能够高速传输和大容量传输的高度可靠的传输电缆。
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公开(公告)号：US20080110018A1
公开(公告)日：2008-05-15
申请号：US11720711
申请日：2005-09-29
申请人： Kazuhiro Shimizu , Masanobu Yagi , Kenichiro Hanamura , Mitsuyuki Takayasu , Kiyoe Nagai , Tomoo Iijima
发明人： Kazuhiro Shimizu , Masanobu Yagi , Kenichiro Hanamura , Mitsuyuki Takayasu , Kiyoe Nagai , Tomoo Iijima
CPC分类号： H05K3/4038 , B32B37/26 , B32B2457/08 , H05K3/022 , H05K3/06 , H05K3/4647 , H05K2201/0355 , H05K2203/0384 , H05K2203/0733 , H05K2203/1461 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163
摘要： A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.
摘要翻译： 一种多层布线板的制造方法，包括以下步骤：在设置有用于层间连接的凸块的基底上形成绝缘层，通过将铜箔夹在不锈钢板之间通过热压接将铜箔接合到绝缘层上;以及 在热压接时，至少在每个不锈钢板和铜箔之间插入金属箔的铜箔图案化。 此时，在要施加的金属箔的表面上形成脱模层。 因此，可以制造这样的多层布线板，其防止成型后的产品粘附（铜箔的粘合），并且尺寸稳定性优异，而不会发生起皱和粗糙。
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5.发明申请FLEXIBLE CIRCUIT BOARD, METHOD FOR MAKING THE SAME, FLEXIBLE MULTI-LAYER WIRING CIRCUIT BOARD, AND METHOD FOR MAKING THE SAME 审中-公开柔性电路板及其制造方法，柔性多层布线电路板及其制造方法公开(公告)号：US20070170598A1
公开(公告)日：2007-07-26
申请号：US10556139
申请日：2004-05-10
申请人： Tomoo Iijima , Kenji Osawa , Kimitaka Endo , Yoshiaki Echigo , Akira Shigeta , Kazuyoshi Kobayashi , Kenichiro Hanamura
发明人： Tomoo Iijima , Kenji Osawa , Kimitaka Endo , Yoshiaki Echigo , Akira Shigeta , Kazuyoshi Kobayashi , Kenichiro Hanamura
IPC分类号： H01L23/48
CPC分类号： H05K3/4626 , H01L2924/0002 , H05K1/0393 , H05K3/386 , H05K3/4617 , H05K3/4635 , H05K3/4647 , H05K2201/0154 , H05K2201/0191 , H05K2201/0195 , H05K2201/0355 , H05K2203/0384 , H05K2203/1189 , H01L2924/00
摘要： There is provided a flexible circuit board 22 that, when deposited on another flexible circuit board 40, causes no gap to occur between wiring films 4a, 4a, of the flexible circuit board 40. Moreover, a plurality of flexible circuit boards are deposited on one another to provide a flexible multi-layer wiring circuit board having no gaps between the flexible circuit boards and having less bowing. In the flexible circuit board 22, the thickness of a bonding layer 16, 16a, on the opposed side of a bowing metallic member 2, of an inter-layer insulating film 10 where which bumps 6 are formed is greater than the thickness of a bonding layer on the side of metallic member 2. When the flexible circuit board 22 is deposited on the other flexible circuit board 40 to form a flexible multi-layer wiring circuit board 50, the bonding layer 16, 16a can be filled between the wiring films 4a, 4a, so that the flexible multi-layer wiring circuit board 50 has no gaps and a less bowing.
摘要翻译： 提供了一种柔性电路板22，其在沉积在另一柔性电路板40上时，在柔性电路板40的布线膜4a，4a之间不产生间隙。 此外，多个柔性电路板彼此沉积，以提供柔性电路板之间没有间隙并具有较少弯曲的柔性多层布线电路板。 在柔性电路板22中，形成有凸块6的层间绝缘膜10的弯曲金属构件2的相对侧的接合层16,16a的厚度大于 接合层在金属构件2的侧面上。 当柔性电路板22沉积在另一个柔性电路板40上以形成柔性多层布线电路板50时，可以在布线膜4a，4a之间填充结合层16,16a，使得 柔性多层布线电路板50无间隙和较少弯曲。
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公开(公告)号：US08112881B2
公开(公告)日：2012-02-14
申请号：US11720711
申请日：2005-09-29
申请人： Kazuhiro Shimizu , Masanobu Yagi , Kenichiro Hanamura , Mitsuyuki Takayasu , Kiyoe Nagai , Tomoo Iijima
发明人： Kazuhiro Shimizu , Masanobu Yagi , Kenichiro Hanamura , Mitsuyuki Takayasu , Kiyoe Nagai , Tomoo Iijima
IPC分类号： H05K3/20
CPC分类号： H05K3/4038 , B32B37/26 , B32B2457/08 , H05K3/022 , H05K3/06 , H05K3/4647 , H05K2201/0355 , H05K2203/0384 , H05K2203/0733 , H05K2203/1461 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163
摘要： A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.
摘要翻译： 一种多层布线板的制造方法，包括以下步骤：在设置有用于层间连接的凸块的基底上形成绝缘层，通过将铜箔夹在不锈钢板之间通过热压接将铜箔接合到绝缘层上;以及 在热压接时，至少在每个不锈钢板和铜箔之间插入金属箔的铜箔图案化。 此时，在要施加的金属箔的表面上形成脱模层。 因此，可以制造这样的多层布线板，其防止成型后的产品粘附（铜箔的粘合），并且尺寸稳定性优异，而不会发生起皱和粗糙。
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公开(公告)号：US07429702B2
公开(公告)日：2008-09-30
申请号：US11619039
申请日：2007-01-02
IPC分类号： H01B7/08
CPC分类号： H05K1/0219 , H05K1/0393 , H05K3/4647 , H05K2201/0715 , H05K2201/09236 , H05K2201/09618
摘要： A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided.
摘要翻译： 提供传输电缆及其制造方法。 多个信号线形成在绝缘层的一侧，并且在信号线之间形成接地线。 接地线通过形成并嵌入在绝缘层中的金属凸块与与绝缘层的背面形成的屏蔽层电连接。 可以在夹着信号线和接地线的相对侧上形成绝缘层和屏蔽层。 在这种情况下，接地线分别通过其两侧的金属凸块与屏蔽层电连接。 因此，可以提供能够高速传输和大容量传输的高度可靠的传输电缆。
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