HEAT-RESISTANT RESIN COMPOSITION AND INSULATED WIRE INSULATED THEREWITH
    4.
    发明申请
    HEAT-RESISTANT RESIN COMPOSITION AND INSULATED WIRE INSULATED THEREWITH 审中-公开
    耐热树脂组合物和绝缘线绝缘

    公开(公告)号:US20090197083A1

    公开(公告)日:2009-08-06

    申请号:US12362051

    申请日:2009-01-29

    Abstract: A heat-resistant resin composition comprised of a mixture prepared by kneading a polybutylene terephthalate resin together with a component different from said polybutylene terephthalate resin, wherein a β relaxation peak of said heat-resistant resin composition on the tan δ curve determined by the dynamic viscoelasticity measurement defined in Japanese Industrial Standard K 7244-4 appears at a temperature lower than a temperature at which a β relaxation peak of a composition composed singly of a polybutylene terephthalate appears; and said another component is dispersed in said polybutylene terephthalate resin phase in a form of particles having sizes of 1 μm or smaller.

    Abstract translation: 一种耐热树脂组合物,其由通过将聚对苯二甲酸丁二醇酯树脂与不同于所述聚对苯二甲酸丁二醇酯树脂的组分捏合而制备的混合物,其中所述耐热树脂组合物在通过动态粘弹性测定的tanδ曲线上的β松弛峰 在日本工业标准K 7244-4中定义的测量值出现在低于单独聚对苯二甲酸丁二醇酯组合物的β松弛峰的温度的温度; 并且所述另一组分以大小为1μm或更小的颗粒的形式分散在所述聚对苯二甲酸丁二醇酯树脂相中。

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