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1.发明授权公开(公告)号：US07678996B2
公开(公告)日：2010-03-16
申请号：US12076957
申请日：2008-03-25
IPC分类号： H01B7/00
CPC分类号： C08L53/025 , C08K5/34928 , C08L23/06 , C08L51/06 , C08L67/02 , C08L2203/202 , H01B3/421 , H01B3/441 , H01B3/442 , C08L2666/04 , C08L2666/02 , C08L2666/14
摘要： A high heat-resistance resin composition, the high heat-resistance resin composition being thermally treated at 150° C. for 100 hours, wherein a heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof by Differential Scanning Calorimetry (DSC) is equal to or less than 45 J/g before thermal treatment, an increasing rate of the heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof after the thermal treatment by Differential Scanning Calorimetry (DSC) is equal to or less than 20% as compared to that before the thermal treatment, and a degree of extensibility thereof is equal to or more than 200% after the thermal treatment.
摘要翻译： 高耐热性树脂组合物在150℃下热处理100小时，其中通过差示测定其熔点的高耐热性树脂组合物的吸热量， 在热处理之前，扫描量热法（DSC）等于或小于45J / g，通过差示扫描在热处理后的熔点测量的高耐热树脂组合物的吸热量的增加率 与热处理相比，量热法（DSC）等于或小于20％，并且在热处理后其扩展程度等于或大于200％。
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公开(公告)号：US20090197083A1
公开(公告)日：2009-08-06
申请号：US12362051
申请日：2009-01-29
CPC分类号： C08L67/02 , C08L23/0815 , C08L23/0884 , C08L53/025 , Y10T428/2927 , C08L2666/14 , C08L2666/02 , C08L2666/06
摘要： A heat-resistant resin composition comprised of a mixture prepared by kneading a polybutylene terephthalate resin together with a component different from said polybutylene terephthalate resin, wherein a β relaxation peak of said heat-resistant resin composition on the tan δ curve determined by the dynamic viscoelasticity measurement defined in Japanese Industrial Standard K 7244-4 appears at a temperature lower than a temperature at which a β relaxation peak of a composition composed singly of a polybutylene terephthalate appears; and said another component is dispersed in said polybutylene terephthalate resin phase in a form of particles having sizes of 1 μm or smaller.
摘要翻译： 一种耐热树脂组合物，其由通过将聚对苯二甲酸丁二醇酯树脂与不同于所述聚对苯二甲酸丁二醇酯树脂的组分捏合而制备的混合物，其中所述耐热树脂组合物在通过动态粘弹性测定的tanδ曲线上的β松弛峰 在日本工业标准K 7244-4中定义的测量值出现在低于单独聚对苯二甲酸丁二醇酯组合物的β松弛峰的温度的温度; 并且所述另一组分以大小为1μm或更小的颗粒的形式分散在所述聚对苯二甲酸丁二醇酯树脂相中。
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3.发明申请公开(公告)号：US20080302555A1
公开(公告)日：2008-12-11
申请号：US12076957
申请日：2008-03-25
CPC分类号： C08L53/025 , C08K5/34928 , C08L23/06 , C08L51/06 , C08L67/02 , C08L2203/202 , H01B3/421 , H01B3/441 , H01B3/442 , C08L2666/04 , C08L2666/02 , C08L2666/14
摘要： A high heat-resistance resin composition, the high heat-resistance resin composition being thermally treated at 150° C. for 100 hours, wherein a heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof by Differential Scanning Calorimetry (DSC) is equal to or less than 45 J/g before thermal treatment, an increasing rate of the heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof after the thermal treatment by Differential Scanning Calorimetry (DSC) is equal to or less than 20% as compared to that before the thermal treatment, and a degree of extensibility thereof is equal to or more than 200% after the thermal treatment.
摘要翻译： 高耐热性树脂组合物在150℃下热处理100小时，其中通过差示测定其熔点的高耐热性树脂组合物的吸热量， 在热处理之前，扫描量热法（DSC）等于或小于45J / g，通过差示扫描在热处理后的熔点测量的高耐热树脂组合物的吸热量的增加率 与热处理相比，量热法（DSC）等于或小于20％，并且在热处理后其扩展程度等于或大于200％。
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公开(公告)号：US07541544B2
公开(公告)日：2009-06-02
申请号：US12018281
申请日：2008-01-23
IPC分类号： H01B7/00
CPC分类号： C08L67/02 , C08L23/06 , C08L25/00 , C08L35/06 , Y10T428/294 , C08L2666/06
摘要： A polyester resin composition according to the present invention includes: a PBT resin; a styrene system elastomer; and a compound having a glycidyl group or a polyolefin composition in an amount of 50-80 wt %, 10-30 wt % and 10-30 wt %, respectively.
摘要翻译： 根据本发明的聚酯树脂组合物包括：PBT树脂; 苯乙烯系弹性体; 和分别具有50-80重量％，10-30重量％和10-30重量％的缩水甘油基或聚烯烃组合物的化合物。
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公开(公告)号：US20080193756A1
公开(公告)日：2008-08-14
申请号：US12018281
申请日：2008-01-23
CPC分类号： C08L67/02 , C08L23/06 , C08L25/00 , C08L35/06 , Y10T428/294 , C08L2666/06
摘要： A polyester resin composition according to the present invention includes: a PBT resin; a styrene system elastomer; and a compound having a glycidyl group or a polyolefin composition in an amount of 50-80 wt %, 10-30 wt % and 10-30 wt %, respectively.
摘要翻译： 根据本发明的聚酯树脂组合物包括：PBT树脂; 苯乙烯系弹性体; 和分别具有50-80重量％，10-30重量％和10-30重量％的缩水甘油基或聚烯烃组合物的化合物。
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公开(公告)号：US09156979B2
公开(公告)日：2015-10-13
申请号：US12277986
申请日：2008-11-25
申请人： Kenichiro Fujimoto , Tomiya Abe , Kentaro Segawa , Hitoshi Kimura , Katsuhisa Shishido , Akira Suzuki , Takuya Suzuki
发明人： Kenichiro Fujimoto , Tomiya Abe , Kentaro Segawa , Hitoshi Kimura , Katsuhisa Shishido , Akira Suzuki , Takuya Suzuki
IPC分类号： B32B5/02 , C08L83/04 , C08F283/04 , C08L67/02 , H01B3/42 , H01B3/46 , C08K3/34 , C08K5/29 , C08K5/3492 , C08K5/523 , C08L51/08
CPC分类号： C08L67/02 , C08K3/346 , C08K5/29 , C08K5/34924 , C08K5/523 , C08L51/085 , H01B3/42 , H01B3/423 , H01B3/46 , Y10T428/2933 , C08L2666/14 , C08L2666/24
摘要： An insulated wire uses a resin composition. The insulated wire includes a conductor; and an insulating material provided on the conductor, the insulating material includes a polyester resin in 100 parts by weight, a non-bromine flame retardant agent in 1-30 parts by weight, a polyorganosiloxane core-graft copolymer in 1-50 parts by weight, an inorganic porous filler in 0.1-50 parts by weight; and a hydrolysis resistance modifier in 0.05-10 parts by weight.
摘要翻译： 绝缘线使用树脂组合物。 绝缘电线包括导体; 绝缘材料包括100重量份的聚酯树脂，1-30重量份的非溴阻燃剂，1-50重量份的聚有机硅氧烷核 - 接枝共聚物， ，0.1-50重量份的无机多孔填料; 和0.05-10重量份的耐水解性改性剂。
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7.发明授权Polybutylene naphthalate-based resin composition and electric wire using the polybutylene naphthalate-based resin composition 有权聚萘二甲酸丁二醇酯类树脂组合物和使用聚萘二甲酸丁二醇酯类树脂组合物的电线公开(公告)号：US08445785B2
公开(公告)日：2013-05-21
申请号：US12582944
申请日：2009-10-21
申请人： Kenichiro Fujimoto , Tomiya Abe , Hitoshi Kimura , Katsuhisa Shishido , Akira Suzuki , Takuya Suzuki
发明人： Kenichiro Fujimoto , Tomiya Abe , Hitoshi Kimura , Katsuhisa Shishido , Akira Suzuki , Takuya Suzuki
IPC分类号： H01B7/00
CPC分类号： C08L67/02 , C08K3/016 , C08K3/22 , C09D167/02 , H01B3/423 , C08L2666/18
摘要： A polybutylene naphthalate-based resin composition contains polybutylene naphthalate resin, a polyester block copolymer, and magnesium hydroxide; and an electric wire uses a polybutylene naphthalate-based resin composition, with an insulated coating layer formed on a conductor, by using a polybutylene naphthalate-based resin composition containing polybutylene naphthalate resin, a polyester block copolymer, and magnesium hydroxide as an insulating material.
摘要翻译： 聚萘二甲酸丁二醇酯类树脂组合物含有聚萘二甲酸丁二醇酯树脂，聚酯嵌段共聚物和氢氧化镁; 并且电线使用聚萘二甲酸丁二醇酯类树脂组合物，通过使用含有聚萘二甲酸丁二醇酯树脂，聚酯嵌段共聚物和氢氧化镁作为绝缘材料的聚萘二甲酸丁二醇酯类树脂组合物，在导体上形成绝缘涂层。
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8.发明授权Polybutylene naphthalate-based resin composition and electric cable using polybutylene naphthalate-based resin composition 有权聚萘二甲酸丁二酯基树脂组合物和使用聚萘二甲酸丁二醇酯树脂组合物的电缆公开(公告)号：US08410208B2
公开(公告)日：2013-04-02
申请号：US12579794
申请日：2009-10-15
申请人： Kenichiro Fujimoto , Tomiya Abe
发明人： Kenichiro Fujimoto , Tomiya Abe
IPC分类号： C08K3/34
CPC分类号： H01B3/423
摘要： A polybutylene naphthalate-based resin composition contains, relative to (A) 100 parts by wt of polybutylene naphthalate resin, (B) 40-150 parts by wt of polyester block copolymer, (C) 0.5-5 parts by wt of hydrolysis retarder, and (D) 0.5-5 parts by wt of inorganic multiporous filler.
摘要翻译： 聚萘二甲酸丁二醇酯类树脂组合物相对于（A）100重量份聚萘二甲酸丁二醇酯树脂，（B）40〜150重量份聚酯嵌段共聚物，（C）0.5〜5重量份水解延迟剂， 和（D）0.5-5重量份的无机多孔填料。
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公开(公告)号：US08507592B2
公开(公告)日：2013-08-13
申请号：US13308591
申请日：2011-12-01
申请人： Satoru Amou , Kosuke Kuwabara , Tomiya Abe , Hiroaki Komatsu , Kenichi Murakami
发明人： Satoru Amou , Kosuke Kuwabara , Tomiya Abe , Hiroaki Komatsu , Kenichi Murakami
CPC分类号： C09J171/00 , B32B3/18 , B32B7/12 , B32B15/092 , B32B15/20 , B32B37/12 , B32B37/142 , B32B2307/202 , B32B2309/02 , B32B2309/04 , B32B2379/08 , B32B2457/00 , C08G2650/56 , C08K5/3417 , C08L39/04 , C09J7/22 , C09J7/25 , C09J7/35 , C09J2203/326 , C09J2205/102 , C09J2463/00 , Y10T428/2852 , Y10T428/29
摘要： An adhesive composition includes a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin. The maleimide compound has a plurality of maleimide groups in a structure and is at least one of a first maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds. A heat resistant adhesive film may be formed by coating the adhesive composition on a substrate film, and a wiring film may have a conductor wiring layer put between such heat resistant adhesive films.
摘要翻译： 粘合剂组合物包含基于100重量份苯氧基树脂的具有双酚S骨架的苯氧基树脂和10至100重量份的马来酰亚胺化合物。 马来酰亚胺化合物具有结构中的多个马来酰亚胺基团，并且是熔融温度为160℃以下的第一马来酰亚胺化合物和200℃下的胶凝时间为180〜350秒的第二马来酰亚胺化合物， 熔融温度为160℃以下的马来酰亚胺化合物和在250℃下的凝胶化时间为110〜150秒。 可以通过将粘合剂组合物涂布在基材膜上来形成耐热粘合剂膜，并且布线膜可以在这种耐热粘合剂膜之间具有导体布线层。
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公开(公告)号：US08449978B2
公开(公告)日：2013-05-28
申请号：US12211553
申请日：2008-09-16
申请人： Yuki Honda , Tomiya Abe , Hideyuki Kikuchi
发明人： Yuki Honda , Tomiya Abe , Hideyuki Kikuchi
CPC分类号： C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C09D179/08 , H01B3/306 , Y10T428/2933 , Y10T428/294 , Y10T428/2947
摘要： An insulated wire including a conductor, and an insulating film formed by coating and baking an insulating varnish on the conductor directly or via another insulation layer. The insulating varnish includes a phenolic hydroxyl group-containing polyimide resin represented by a chemical formula (1): where X is a tetravalent aromatic group composing an aromatic tetracarboxylic dianhydride residue, Y1 is a divalent aromatic group including one or more phenolic hydroxyl groups and Y2 is a divalent aromatic group not including a phenolic hydroxyl group A ratio of the number Z1 of phenolic hydroxyl groups included in Y1 of the chemical formula (1) to the number Z2 of an imide group included in the chemical formula (1) is 0.15≦Z1/Z2≦0.85.
摘要翻译： 包括导体的绝缘线，以及通过直接或经由另一绝缘层在绝缘漆上涂覆和烘烤绝缘漆而形成的绝缘膜。 绝缘漆包括由化学式（1）表示的含酚羟基的聚酰亚胺树脂：其中X是构成芳族四羧酸二酐残基的四价芳族基团，Y1是包括一个或多个酚羟基的二价芳族基团和Y2 是不包括酚羟基的二价芳族基团化学式（1）的Y1中包含的酚羟基数Z1与化学式（1）中包括的酰亚胺基的Z2的比率为0.15， Z1/Z2@0.85。
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