公开(公告)号：US09693492B2

公开(公告)日：2017-06-27

申请号：US14111107

申请日：2012-01-31

申请人： Yusuke Kitsukawa ,  Takuya Suzuki ,  Tomoyuki Unno

发明人： Yusuke Kitsukawa ,  Takuya Suzuki ,  Tomoyuki Unno

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K9/00 ,  H01L23/04 ,  H01L23/552 ,  H01L23/66

CPC分类号： H05K9/006 ,  H01L23/04 ,  H01L23/552 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/3025

摘要： A high-frequency package includes a first dielectric substrate having a signal line and a grounding conductor provided on a back side, a high-frequency element connected to a back side of the first dielectric substrate with a first connection conductor therebetween, a second dielectric substrate having a signal line and a grounding conductor provided on a front side facing the back side with the high-frequency element therebetween, and second connection conductors that are arranged so as to surround the high-frequency element and connect the grounding conductor on the back side of the first dielectric substrate and the grounding conductor on the front side of the second dielectric substrate. In the high-frequency package, a dielectric space surrounded by a conductor pattern is formed in the front side of the second dielectric substrate under the high-frequency element.

公开(公告)号：US09433080B2

公开(公告)日：2016-08-30

申请号：US13075779

申请日：2011-03-30

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01L23/552 ,  H01L23/58 ,  H01L23/66 ,  H01L25/18 ,  H01P5/107 ,  H01L25/065 ,  H01P3/08 ,  H01Q9/04 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

公开(公告)号：US09070961B2

公开(公告)日：2015-06-30

申请号：US13062349

申请日：2009-09-02

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H05K1/11 ,  H05K1/14 ,  H01P5/107 ,  H01L23/552 ,  H01L23/58 ,  H01L23/66 ,  H01L25/18 ,  H05K1/02 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

摘要翻译： 使用不使用任何盖子的简单且便宜的配置来实现高频电路的屏蔽。 高频电路安装基板（20）设置在其下表面层上，设置有高频电路（21和22），并形成与第一接地导体相同的电位的第一接地导体， 频率电路，并且围绕高频电路。 设置母控制基板（3），其上安装有高频电路安装基板（20），使得高频电路夹在其间并在其上形成有第二接地导体的区域 高频电路。 多个第一焊盘形成在高频电路安装基板（20）的第一接地导体上，以围绕高频电路。 形成在母板控制基板（3）的面对第一焊盘的位置处与第二接地导体电连接的多个第二焊盘。 多个焊球（30G2）被设置用于连接第一焊盘和第二焊盘。 高频电路容纳在由焊球（30G2），高频电路的接地导体以及第一和第二接地导体包围的伪屏蔽腔中。

公开(公告)号：US07994881B2

公开(公告)日：2011-08-09

申请号：US12307755

申请日：2007-10-30

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H01P1/04

CPC分类号： H01P1/042 ,  H01P3/121

摘要： A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where λ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave.

摘要翻译： 在面向金属基板的多层电介质基板上的第一波导周围形成矩形导体图案，其端部距离第一波导的长边缘大约λ/ 4，其中λ是信号的自由空间波长 波。 导体开口形成在导电图案的端部和第一波导的长边缘之间，其长度比第一波导的长边长并且短于约λ。 在多层电介质基板中沿层方向形成封闭电介质传输路径，长度约为λg/ 4，其中λg为信号波的衬底内有效波长。

公开(公告)号：US20110163919A1

公开(公告)日：2011-07-07

申请号：US13062349

申请日：2009-09-02

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H05K9/00 ,  H01Q1/38

CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

摘要翻译： 使用不使用任何盖子的简单且便宜的配置来实现高频电路的屏蔽。 高频电路安装基板（20）设置在其下表面层上，设置有高频电路（21和22），并形成与第一接地导体相同的电位的第一接地导体， 频率电路，并且围绕高频电路。 设置母控制基板（3），其上安装有高频电路安装基板（20），使得高频电路夹在其间并在其上形成有第二接地导体的区域 高频电路。 多个第一焊盘形成在高频电路安装基板（20）的第一接地导体上，以围绕高频电路。 形成在母板控制基板（3）的面对第一焊盘的位置处与第二接地导体电连接的多个第二焊盘。 多个焊球（30G2）被设置用于连接第一焊盘和第二焊盘。 高频电路容纳在由焊球（30G2），高频电路的接地导体以及第一和第二接地导体包围的伪屏蔽腔中。

公开(公告)号：US07725009B2

公开(公告)日：2010-05-25

申请号：US11176777

申请日：2005-07-07

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H04N5/00

CPC分类号： H04N21/462 ,  H04N5/57 ,  H04N5/63 ,  H04N5/85 ,  H04N21/4325 ,  H04N21/4424

摘要： A video reproduction apparatus detects the remaining time of a movie being reproduced and a battery's availability and calculates therefrom power available before reproducing the movie ends, and uses the power as calculated and a table representing a relationship between the liquid crystal display device's screen brightness and power consumption to calculate and set the liquid crystal display device's screen brightness to prevent the battery from running out while the movie is being reproduced.

摘要翻译： 视频再现装置检测正在再现的电影的剩余时间和电池的可用性，并且从其计算再现电影结束之前的可用电力，并且使用所计算的电力和表示液晶显示装置的屏幕亮度和功率之间的关系的表 消耗来计算和设置液晶显示设备的屏幕亮度，以防止在电影被再现时电池电量耗尽。

公开(公告)号：US20100117711A1

公开(公告)日：2010-05-13

申请号：US12527877

申请日：2007-11-15

申请人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

发明人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

IPC分类号： G06F7/44 ,  H01L23/48

CPC分类号： H03D7/02 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03D9/0633 ,  H01L2924/00

摘要： A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit.

摘要翻译： 在半导体衬底上形成二端子半导体器件。 两个布线图案分别连接到半导体器件的端子，并且两个电极焊盘分别连接到用于连接形成在单独基板上的信号输入/输出电路的布线图案。 两个平行布线图案分别连接到布线图案，并且两个电抗电路连接电极焊盘分别连接到并行布线图案，用于将形成在单独基板上的电抗电路与信号输入/输出电路分开地电连接。

公开(公告)号：US07336221B2

公开(公告)日：2008-02-26

申请号：US10555651

申请日：2005-03-24

申请人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

发明人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

IPC分类号： G01S7/28

CPC分类号： H05K1/167 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/183 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A multilayer dielectric substrate includes a first signal via, a second signal via, an internal-layer signal line, an internal-layer ground conductor, and ground vias. The first signal via is connected to a bias-and-control-signal terminal of a high-frequency semiconductor, and is arranged within a region corresponding to the electromagnetic shielding members. The second signal via is arranged outside the region, and is connected to an external terminal for a bias and control signal. The internal-layer signal line connects between the first and the second signal vias. The internal-layer ground conductor is arranged around the first and the second signal vias and the internal-layer signal line. The ground vias are arranged around the first and the second signal vias and the internal-layer signal line, on the internal-layer ground conductor. A resistance film is provided on at least one of an upper surface and a lower surface of the internal-layer signal line.

摘要翻译： 多层介质基板包括第一信号通孔，第二信号通孔，内层信号线，内层接地导体和接地通孔。 第一信号通孔连接到高频半导体的偏置和控制信号端子，并且被布置在对应于电磁屏蔽构件的区域内。 第二信号通孔布置在区域外部，并且连接到用于偏置和控制信号的外部端子。 内层信号线连接在第一和第二信号通孔之间。 内层接地导体围绕第一和第二信号通孔和内层信号线布置。 接地通孔围绕第一和第二信号通孔和内层信号线布置在内层接地导体上。 电阻膜设置在内层信号线的上表面和下表面中的至少一个上。

公开(公告)号：US07164905B2

公开(公告)日：2007-01-16

申请号：US11070231

申请日：2005-03-03

申请人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

发明人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

IPC分类号： H04M11/00 ,  H04Q7/20

CPC分类号： G01S7/032 ,  G01S13/34 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01P7/065 ,  H01L2924/00

摘要： Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

公开(公告)号：US20050213939A1

公开(公告)日：2005-09-29

申请号：US11050894

申请日：2005-02-04

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H04N5/91 ,  G11B15/04 ,  G11B19/04 ,  G11B23/28 ,  H04N5/76 ,  H04N5/765 ,  H04N5/913

CPC分类号： G11B23/284 ,  H04N5/913 ,  H04N21/4334 ,  H04N21/44008 ,  H04N21/4627 ,  H04N21/812 ,  H04N21/8355 ,  H04N2005/91328

摘要： In recording video/audio information in a digital broadcasting, only when copy control information contained in the video/audio information includes a copy-once signal, a recording processing unit records the video/audio information on an optical disk by an optical disk drive. In editing the video/audio information recorded on the optical disk regardless of the copy control information, when the video/audio information read out from the optical disk has not been subjected to a processing by a CPRM signal and a period free from the processing is not longer than a predetermined time, an edition processing unit deletes a CM segment with the determination that the video/audio information corresponds to the CM segment.

摘要翻译： 在数字广播中记录视频/音频信息时，仅当包含在视频/音频信息中的复制控制信息包括一次复制信号时，记录处理单元通过光盘驱动器将视频/音频信息记录在光盘上。 在编辑记录在光盘上的视频/音频信息而不管复制控制信息的情况下，当从光盘读出的视频/音频信息未被CPRM信号进行处理并且没有处理的时间段是 不超过预定时间，则编辑处理单元以确定视频/音频信息对应于CM片段的方式删除CM片段。