公开(公告)号：US5358604A

公开(公告)日：1994-10-25

申请号：US953520

申请日：1992-09-29

Applicant: Charles W. C. Lin ,  Chung J. Lee ,  Tom J. Hirsch ,  Kimcuc T. Tran

Inventor： Charles W. C. Lin ,  Chung J. Lee ,  Tom J. Hirsch ,  Kimcuc T. Tran

IPC: C25D5/02 ,  G03F7/00 ,  H05K3/02 ,  H05K3/20 ,  B05D1/00

CPC classification number: B29C43/003 ,  B82Y10/00 ,  B82Y40/00 ,  C23C16/01 ,  C23C16/04 ,  C23C16/06 ,  C25D5/022 ,  G03F7/0002 ,  H05K3/20 ,  H05K3/205 ,  B29C2043/025 ,  H05K2203/0113 ,  H05K2203/0117 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/1338 ,  H05K3/027

Abstract: The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.

Abstract translation: 本发明提供一种使用该装置在热和压力条件下将导电图案转印到基板上的装置和方法。 该设备包括具有印刷表面的母模，其上产生将要产生的导电图案的永久镜像。 然后将该图案涂覆有导电金属（例如铜）的松散粘附的膜，其被转印到待印刷的基底上。

公开(公告)号：US5508228A

公开(公告)日：1996-04-16

申请号：US195434

申请日：1994-02-14

Applicant: Ernest R. Nolan ,  Diana C. Duane ,  Todd H. Herder ,  Thomas A. Bishop ,  Kimcuc T. Tran ,  Robert W. Froehlich ,  Randy L. German ,  Richard D. Nelson ,  Chung J. Lee ,  Mark R. Breen ,  Kathryn V. Keswick

Inventor： Ernest R. Nolan ,  Diana C. Duane ,  Todd H. Herder ,  Thomas A. Bishop ,  Kimcuc T. Tran ,  Robert W. Froehlich ,  Randy L. German ,  Richard D. Nelson ,  Chung J. Lee ,  Mark R. Breen ,  Kathryn V. Keswick

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01L21/44

CPC classification number: H01L24/12 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0231 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  Y10S438/903

Abstract: Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.

Abstract translation: 用于粘合倒装芯片集成电路器件的合适的电连接凸块和用于形成凸块的各种方法包括以下步骤：在衬底或集成电路裸片上形成聚合物凸块并用金属化层涂覆聚合物凸块。 聚合物凸块形成步骤包括以下步骤：在基材上涂覆聚合物材料，固化聚合物和从聚合物材料蚀刻凸块图案。 外涂步骤包括在聚合物凸块上无电镀电镀金属如金。