公开(公告)号：US20050212069A1

公开(公告)日：2005-09-29

申请号：US11089180

申请日：2005-03-25

申请人： Tsuneo Sato ,  Atsuhiko Ishihara ,  Akihiro Uchida ,  Koji Kaseda ,  Masahiro Kato ,  Shigeru Kondo

发明人： Tsuneo Sato ,  Atsuhiko Ishihara ,  Akihiro Uchida ,  Koji Kaseda ,  Masahiro Kato ,  Shigeru Kondo

IPC分类号： H01L27/14 ,  H01L27/146 ,  H01L31/0232 ,  H04N5/217 ,  H04N5/372

CPC分类号： H01L21/67294 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2924/0002 ,  H04N5/2257 ,  H04N5/3577 ,  H01L2924/00

摘要： A zener diode is formed in a spacer, which adhered on the semiconductor substrate so as to surround an image sensor, by semiconductor process. A first contact terminal is connected to a CCD output terminal of the image sensor, and a second contact terminal is connected to a ZD ground terminal on the semiconductor substrate. When the ZD ground terminal is connected to ground, the zener diode is actuated. Capacitance components of the zener diode smoothes a waveform of the CCD output so as to prevent an unnecessary radiation noise from generating.

摘要翻译： 齐纳二极管形成在间隔物中，其通过半导体工艺粘附在半导体衬底上以围绕图像传感器。 第一接触端子连接到图像传感器的CCD输出端子，第二接触端子连接到半导体衬底上的ZD接地端子。 当ZD接地端子接地时，齐纳二极管被启动。 齐纳二极管的电容分量平滑了CCD输出的波形，以防止产生不必要的辐射噪声。

公开(公告)号：US20050211888A1

公开(公告)日：2005-09-29

申请号：US11090794

申请日：2005-03-25

申请人： Tsuneo Sato ,  Atsuhiko Ishihara ,  Akihiro Uchida ,  Koji Kaseda ,  Masahiro Kato ,  Shigeru Kondo

发明人： Tsuneo Sato ,  Atsuhiko Ishihara ,  Akihiro Uchida ,  Koji Kaseda ,  Masahiro Kato ,  Shigeru Kondo

IPC分类号： H01J40/14 ,  H01L23/49 ,  H01L23/552 ,  H01L27/146 ,  H04N5/225 ,  H04N5/335

CPC分类号： H01L27/14618 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/3025 ,  H04N5/2253 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.

摘要翻译： 固态成像装置由图像传感器芯片，电路板和由铜构成的电磁波吸收体构成。 图像传感器芯片由裸芯片，间隔件和盖玻璃构成。 第一接触端子形成在裸芯片上，并且第二接触端子和GND线形成在电路板上。 当制造时，图像传感器芯片安装在电路板上的预定位置，并且第一接触端子和第二接触端子与接合线连接。 电磁波吸收体形成为覆盖接合线，而其端部接触GND线。

公开(公告)号：US07391002B2

公开(公告)日：2008-06-24

申请号：US11090794

申请日：2005-03-25

申请人： Tsuneo Sato ,  Atsuhiko Ishihara ,  Akihiro Uchida ,  Koji Kaseda ,  Masahiro Kato ,  Shigeru Kondo

发明人： Tsuneo Sato ,  Atsuhiko Ishihara ,  Akihiro Uchida ,  Koji Kaseda ,  Masahiro Kato ,  Shigeru Kondo

IPC分类号： H01L27/00

CPC分类号： H01L27/14618 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/3025 ,  H04N5/2253 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.

摘要翻译： 固态成像装置由图像传感器芯片，电路板和由铜构成的电磁波吸收体构成。 图像传感器芯片由裸芯片，间隔件和盖玻璃构成。 第一接触端子形成在裸芯片上，并且第二接触端子和GND线形成在电路板上。 当制造时，图像传感器芯片安装在电路板上的预定位置，并且第一接触端子和第二接触端子与接合线连接。 电磁波吸收体形成为覆盖接合线，而其端部接触GND线。

公开(公告)号：US07492023B2

公开(公告)日：2009-02-17

申请号：US11089180

申请日：2005-03-25

申请人： Tsuneo Sato ,  Atsuhiko Ishihara ,  Akihiro Uchida ,  Koji Kaseda ,  Masahiro Kato ,  Shigeru Kondo

发明人： Tsuneo Sato ,  Atsuhiko Ishihara ,  Akihiro Uchida ,  Koji Kaseda ,  Masahiro Kato ,  Shigeru Kondo

IPC分类号： H01L31/232

CPC分类号： H01L21/67294 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2924/0002 ,  H04N5/2257 ,  H04N5/3577 ,  H01L2924/00

摘要： A zener diode is formed in a spacer, which adhered on the semiconductor substrate so as to surround an image sensor, by semiconductor process. A first contact terminal is connected to a CCD output terminal of the image sensor, and a second contact terminal is connected to a ZD ground terminal on the semiconductor substrate. When the ZD ground terminal is connected to ground, the zener diode is actuated. Capacitance components of the zener diode smoothes a waveform of the CCD output so as to prevent an unnecessary radiation noise from generating.

摘要翻译： 齐纳二极管形成在间隔物中，其通过半导体工艺粘附在半导体衬底上以围绕图像传感器。 第一接触端子连接到图像传感器的CCD输出端子，第二接触端子连接到半导体衬底上的ZD接地端子。 当ZD接地端子接地时，齐纳二极管被启动。 齐纳二极管的电容分量平滑了CCD输出的波形，以防止产生不必要的辐射噪声。